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1. 发明授权

US08155260B2 Nuclear fuel rod for fast reactors with oxide coating layer on inner surface of cladding, and manufacturing method thereof 有权
标题翻译：用于包覆内表面具有氧化物涂层的快堆的核燃料棒及其制造方法
公开(公告)号：US08155260B2
公开(公告)日：2012-04-10
申请号：US12110775
申请日：2008-04-28
申请人： Chan Bock Lee , Jong-Hyuk Baek , Byoung-Oon Lee , Jin-Sik Cheon , Ho Jin Ryu , Jun Hwan Kim , Sung Ho Kim , Tae-Kyu Kim , Woo-Gon Kim , Chong-Tak Lee , Ki-Hwan Kim , Young-Mo Ko , Yoon-Myeong Woo , Seok-Jin Oh , Dohee Hahn
发明人： Chan Bock Lee , Jong-Hyuk Baek , Byoung-Oon Lee , Jin-Sik Cheon , Ho Jin Ryu , Jun Hwan Kim , Sung Ho Kim , Tae-Kyu Kim , Woo-Gon Kim , Chong-Tak Lee , Ki-Hwan Kim , Young-Mo Ko , Yoon-Myeong Woo , Seok-Jin Oh , Dohee Hahn
IPC分类号： G21C3/00
CPC分类号： G21C3/20 , G21Y2002/103 , G21Y2002/104 , G21Y2002/303 , G21Y2002/304 , G21Y2004/10 , G21Y2004/303 , Y02E30/40
摘要： Disclosed herein are a nuclear fuel rod for fast reactors, which includes an oxide coating layer formed on the inner surface of a cladding, and a manufacturing method thereof. The nuclear fuel rod for fast reactors, which includes the oxide coating layer formed on the inner surface of the cladding, can increase the maximum permissible burnup and maximum permissible temperature of the metallic fuel slug for fast reactors so as to prolong the its lifecycle in the fast reactors, thus increasing economic efficiency. Also, the fuel rod is manufactured in a simpler manner compared to the existing method, in which a metal liner is formed, and the disclosed method enables the cladding of the fuel rod to be manufactured in an easy and cost-effective way.
摘要翻译：本文公开了一种用于快堆的核燃料棒及其制造方法，其包括形成在包层的内表面上的氧化物被覆层。用于快堆的核燃料棒（包括形成在包层内表面上的氧化物涂层）可以增加快堆的金属燃料块的最大允许燃耗和最大允许温度，从而延长其在快堆，从而提高经济效益。此外，与现有的形成金属衬垫的方法相比，燃料棒的制造更简单，并且所公开的方法能够以简单和成本有效的方式制造燃料棒的包层。

2. 发明申请

US20080085734A1 Method and device for receiving digital multimedia broadcasting signal in wireless terminal 审中-公开
标题翻译：用于在无线终端中接收数字多媒体广播信号的方法和装置
公开(公告)号：US20080085734A1
公开(公告)日：2008-04-10
申请号：US11806909
申请日：2007-06-05
申请人： Jin-U Kim , Seung-Hwan Kim , Jong-Kyun Shin , Young-Hwan Kim , Yong-Jin Kim , Jae-Ho Lee , Jae-Bong Chun , Seong-Ho Yoon
发明人： Jin-U Kim , Seung-Hwan Kim , Jong-Kyun Shin , Young-Hwan Kim , Yong-Jin Kim , Jae-Ho Lee , Jae-Bong Chun , Seong-Ho Yoon
IPC分类号： H04M1/00
CPC分类号： H04B1/18
摘要： A method and device for receiving a digital multimedia broadcasting (DMB) signal in a wireless terminal where an external antenna is detachable from the wireless terminal, an internal antenna is embedded in the wireless terminal, a switch connects one of the external antenna and the internal antenna to a DMB receiver. The DMB receiver receives a DMB signal through one of the external antenna and the internal antenna. A controller controls the switch to connect the internal antenna and transmit the DMB signal to the DMB receiver when the external antenna is detached from the wireless terminal and controls the switch to connect the external antenna to the DMB receiver and transmit the DMB signal to the DMB receiver, when the external antenna is attached to the wireless terminal.
摘要翻译：一种用于在无线终端中接收数字多媒体广播（DMB）信号的方法和装置，其中外部天线可从无线终端拆卸，内部天线嵌入在无线终端中，开关将外部天线和内部天线之一连接起来天线到DMB接收机。 DMB接收机通过外部天线和内部天线之一接收DMB信号。当外部天线与无线终端分离时，控制器控制交换机连接内部天线并将DMB信号发送到DMB接收机，并控制交换机将外部天线连接到DMB接收机，并将DMB信号发送到DMB 接收机，当外部天线连接到无线终端时。

3. 发明申请

US20120329249A1 METHODS OF PROCESSING SUBSTRATES 有权
标题翻译：处理基板的方法
公开(公告)号：US20120329249A1
公开(公告)日：2012-12-27
申请号：US13530543
申请日：2012-06-22
申请人： Jung-Seok Ahn , II Hwan Kim , Jung-Hwan Kim , Sangwook Park , Chungsun Lee , Kwang-chul Choi
发明人： Jung-Seok Ahn , II Hwan Kim , Jung-Hwan Kim , Sangwook Park , Chungsun Lee , Kwang-chul Choi
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/3128 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2224/13025 , H01L2224/13101 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00012
摘要： Methods of manufacturing a plurality of semiconductor chips are provided. The method may include providing a middle layer between a substrate and a carrier to combine the carrier with the substrate, thinning the substrate; after thinning the substrate, separating the carrier from the substrate; and after the carrier is separated from the substrate, cutting the substrate to form the plurality of semiconductor chips, wherein the middle layer is adhered to the carrier with a first bonding force, and the middle layer is adhered to the substrate with a second bonding force, and wherein the second bonding force is greater than the first bonding force.
摘要翻译：提供制造多个半导体芯片的方法。该方法可以包括在衬底和载体之间提供中间层以将载体与衬底组合，使衬底变薄; 在使衬底变薄之后，将衬底与衬底分离; 在载体与基板分离之后，切割基板以形成多个半导体芯片，其中中间层以第一结合力粘附到载体上，并且中间层以第二结合力粘附到基板并且其中所述第二结合力大于所述第一结合力。

4. 发明授权

US08224392B2 Mobile terminal capable of recognizing fingernail touch and method of controlling the operation thereof 有权
标题翻译：能够识别指甲触摸的移动终端和控制其操作的方法
公开(公告)号：US08224392B2
公开(公告)日：2012-07-17
申请号：US12769422
申请日：2010-04-28
申请人： Jong Hwan Kim , Seung Hwan Yoo , Doo Hwan Kim , Mi Jung Kim , Soo Chul Lim , Young Sun Lee , Eun Sang Lee
发明人： Jong Hwan Kim , Seung Hwan Yoo , Doo Hwan Kim , Mi Jung Kim , Soo Chul Lim , Young Sun Lee , Eun Sang Lee
IPC分类号： H04M1/00 , H04B1/38 , G06F3/041
CPC分类号： G06F3/041 , G06F3/016 , G06F3/0428 , G06F3/0488 , G06F2203/04106
摘要： A method of controlling a mobile terminal, and which includes displaying, on a touch screen display of the mobile terminal, an operation screen corresponding to a current operating mode executing on the mobile terminal; detecting, via a detecting device, a touch input on the touch screen display of the mobile terminal; determining, via a controller on the mobile terminal, a first finger characteristic describing a finger touching the touch screen display and a second finger characteristic describing the finger touching the touch screen display that is different than the first finger characteristic; performing, via the controller, a first operation relevant to the current operating mode based on the determined first finger characteristic; and performing, via the controller, a second operation relevant to the current operating mode based on the determined second finger characteristic.
摘要翻译：一种控制移动终端的方法，包括在移动终端的触摸屏显示器上显示与在移动终端上执行的当前操作模式相对应的操作画面; 经由检测装置检测所述移动终端的触摸屏显示器上的触摸输入; 通过所述移动终端上的控制器确定描述触摸所述触摸屏显示的手指的第一手指特征和描述所述手指触摸所述触摸屏显示不同于所述第一手指特征的第二手指特征; 基于所确定的第一手指特征，经由所述控制器执行与所述当前操作模式相关的第一操作; 以及基于所确定的第二手指特征，经由所述控制器执行与所述当前操作模式相关的第二操作。

5. 发明授权

US09234789B2 Optical sensing frame and display device therewith 有权
标题翻译：光学感应框架及其显示装置
公开(公告)号：US09234789B2
公开(公告)日：2016-01-12
申请号：US13276018
申请日：2011-10-18
申请人： Wan-Sik Lim , Jang-Hwan Kim , Jae-Hwan Kim , Jin-Hyuk Jang , Woo-Nam Tak
发明人： Wan-Sik Lim , Jang-Hwan Kim , Jae-Hwan Kim , Jin-Hyuk Jang , Woo-Nam Tak
IPC分类号： G01J1/04 , G01J1/02 , G01J1/42 , G06F3/042
CPC分类号： G01J1/0271 , G01J1/0403 , G01J1/42 , G01J1/4228 , G06F3/0421
摘要： The present invention relates to display devices, and more particularly to an optical sensing frame in which an infrared sensor module is fastened to a case top with a bracket to secure an assembly margin and prevent the infrared sensor module from mismatching with a liquid crystal display module by relative movement; and a display device therewith, the optical sensing frame includes a case top having a frame shaped upper side, and sides bent and extended from four sides of the upper side perpendicular thereto, first to third brackets fastened to an inside of the upper side of the case top at three corners thereof respectively, and an infrared sensor module placed in each of the first to third brackets.
摘要翻译：本发明涉及显示装置，更具体地说，涉及一种光学感测框架，其中红外线传感器模块用支架固定到壳体顶部以固定组件边缘，并防止红外传感器模块与液晶显示模块不匹配通过相对运动; 以及显示装置，所述光感测框架包括具有框架形状的上侧的壳体顶部和从其垂直于其的上侧的四侧弯曲并延伸的侧面，第一至第三支架固定到所述上侧的内侧分别在其三角的壳体顶部和放置在第一至第三托架中的每一个中的红外传感器模块。

6. 发明申请

US20100183664A1 ATTENUATED RECOMBINANT NEWCASTLE DISEASE VIRUS AND VACCINE CONTAINING THE SAME 有权
标题翻译：衰老的重症病毒病毒病毒和含有其的疫苗
公开(公告)号：US20100183664A1
公开(公告)日：2010-07-22
申请号：US12442749
申请日：2006-09-27
申请人： Sun-Hee Cho , Hyuk-Joon Kwon , Sun-Joong Kim , Tae-Eun Kim , Young-Jin An , Mi-Joung Ko , Il-Hwan Kim , Young-Ho Park , Chae-Hyun Kim , Jang-Hyuck Han , Tae-Hwan Kim
发明人： Sun-Hee Cho , Hyuk-Joon Kwon , Sun-Joong Kim , Tae-Eun Kim , Young-Jin An , Mi-Joung Ko , Il-Hwan Kim , Young-Ho Park , Chae-Hyun Kim , Jang-Hyuck Han , Tae-Hwan Kim
IPC分类号： A61K39/17 , A61P31/14 , C12N7/00
CPC分类号： A61K39/17 , A61K39/12 , A61K2039/5252 , A61K2039/5254 , A61K2039/54 , A61K2039/55 , A61K2039/552 , A61K2039/55566 , C07K14/005 , C12N7/00 , C12N2760/18122 , C12N2760/18134 , C12N2760/18143 , C12N2760/18162
摘要： The present invention relates to a recombinant vector for transcription of the Newcastle disease virus (NDV) genome, a strain of attenuated recombinant NDV with a surface antigen of pathogenic NDV prepared by the vector, a method of preparing a recombinant NDV having low pathogenicity and high protectivity efficiency against Newcastle disease (ND) using the vector, and a vaccine against ND containing the recombinant NDV.
摘要翻译：本发明涉及用于转录新城疫病毒（NDV）基因组的重组载体，具有通过载体制备的病原性NDV的表面抗原的减毒重组NDV的菌株，制备具有低致病性和高的重组NDV的方法使用载体对新城疫（ND）的保护效率，以及针对含有重组NDV的ND的疫苗。

7. 发明授权

US07178584B2 Plasma polymerization enhancement of surface of metal for use in refrigerating and air conditioning 有权
标题翻译：用于制冷和空调的金属表面的等离子体聚合增强
公开(公告)号：US07178584B2
公开(公告)日：2007-02-20
申请号：US10952904
申请日：2004-09-30
申请人： Seok-Keun Koh , Hyung Jin Jung , Won Kook Choi , Byung Ha Kang , Ki Hwan Kim , Sam Chul Ha , Cheol Hwan Kim , Sung-Chang Choi
发明人： Seok-Keun Koh , Hyung Jin Jung , Won Kook Choi , Byung Ha Kang , Ki Hwan Kim , Sam Chul Ha , Cheol Hwan Kim , Sung-Chang Choi
IPC分类号： F28F13/18
CPC分类号： C23C16/503 , B05D1/62 , B05D3/148 , B05D5/083 , C23C16/30 , C23C16/50 , C23C16/515 , C23C16/56 , F25B47/003 , F28F13/18 , F28F2245/02 , F28F2245/04
摘要： According to the present invention, there is provided a plasma polymerization surface modification of a metal for enhancing its applicability for use in refrigerating and air conditioning such as in constructing heat exchanges, by using a DC discharge plasma, comprising the steps of: (a) positioning an anode electrode which is substantially of metal to be surface-modified and a cathode electrode in a chamber, (b) maintaining a pressure in the chamber at a predetermined vacuum level, (c) blowing a reaction gas composed of an unsaturated aliphatic hydrocarbon monomer gas or fluorine-containing monomer and silicon containing monomer gas at a predetermined pressure and a non-polymerizable gas at a predetermined pressure into the chamber, and (d) applying a voltage to the electrodes in order to obtain a DC discharge, whereby to obtain a plasma consisting of positive and negative ions and radicals generated from the unsaturated aliphatic hydrocarbon monomer gas and the non-polymerizable gas, and then forming a polymer with hydrophilicity or hydrophobicity on the surface of the anode electrode by plasma deposition, and there is also provided a plasma polymerization surface modification of a metal for enhancing its applicability for use in refrigerating and air conditioning such as in constructing heat exchanges, by using an RF plasma.
摘要翻译：根据本发明，通过使用DC放电等离子体，提供了一种金属的等离子体聚合表面改性，用于增强其在制冷和空调中的应用，例如构建热交换，其包括以下步骤：（a）将基本上要被表面改性的金属的阳极电极和阴极电极放置在室中，（b）将室内的压力保持在预定的真空度，（c）吹送由不饱和脂族烃组成的反应气体单体气体或含氟单体和预定压力的含硅单体气体和以预定压力进入室的非可聚合气体，以及（d）向电极施加电压以获得DC放电，从而获得由不饱和脂肪烃单体气体和不可聚合气体产生的正离子和负离子和自由基组成的等离子体，然后通过等离子体沉积在阳极电极的表面上形成具有亲水性或疏水性的聚合物，并且还提供金属的等离子体聚合表面改性以增强其用于制冷和空调的适用性，例如构建热交换，通过使用RF等离子体。

8. 发明申请

US20160082569A1 RETAINER AND WAFER CARRIER INCLUDING THE SAME 审中-公开
标题翻译：保持架和滚动架，包括它们
公开(公告)号：US20160082569A1
公开(公告)日：2016-03-24
申请号：US14729030
申请日：2015-06-02
申请人： Sang-Hyun BAE , Kyu-Dong JUNG , Il-Hwan KIM , Jung-Hwan KIM , Hyuek-Jae LEE , Tae-Je CHO
发明人： Sang-Hyun BAE , Kyu-Dong JUNG , Il-Hwan KIM , Jung-Hwan KIM , Hyuek-Jae LEE , Tae-Je CHO
IPC分类号： B24B37/32
CPC分类号： B24B37/32
摘要： A retainer for a wafer carrier comprising: a body including a plurality of slots configured to receive side surfaces of wafers; and for each of the slots, a supporting structure formed on a sidewall of the slot and configured to make contact with the side surfaces of a corresponding wafer, the supporting structure being spaced apart from an upper corner of the side surface of the corresponding wafer.
摘要翻译：一种用于晶片载体的保持器，包括：主体，其包括被配置为接收晶片的侧表面的多个槽; 并且对于每个狭槽，形成在所述槽的侧壁上并被配置为与相应晶片的侧表面接触的支撑结构，所述支撑结构与相应晶片的侧表面的上角隔开。

9. 发明授权

US09006081B2 Methods of processing substrates 有权
标题翻译：处理基板的方法
公开(公告)号：US09006081B2
公开(公告)日：2015-04-14
申请号：US13530543
申请日：2012-06-22
申请人： Jung-Seok Ahn , Il Hwan Kim , Jung-Hwan Kim , Sangwook Park , Chungsun Lee , Kwang-chul Choi
发明人： Jung-Seok Ahn , Il Hwan Kim , Jung-Hwan Kim , Sangwook Park , Chungsun Lee , Kwang-chul Choi
IPC分类号： H01L21/00 , H01L21/78
CPC分类号： H01L21/78 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/3128 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2224/13025 , H01L2224/13101 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00012
摘要： Methods of manufacturing a plurality of semiconductor chips are provided. The method may include providing a middle layer between a substrate and a carrier to combine the carrier with the substrate, thinning the substrate; after thinning the substrate, separating the carrier from the substrate; and after the carrier is separated from the substrate, cutting the substrate to form the plurality of semiconductor chips, wherein the middle layer is adhered to the carrier with a first bonding force, and the middle layer is adhered to the substrate with a second bonding force, and wherein the second bonding force is greater than the first bonding force.
摘要翻译：提供制造多个半导体芯片的方法。该方法可以包括在衬底和载体之间提供中间层以将载体与衬底组合，使衬底变薄; 在使衬底变薄之后，将衬底与衬底分离; 在载体与基板分离之后，切割基板以形成多个半导体芯片，其中中间层以第一结合力粘附到载体上，并且中间层以第二结合力粘附到基板并且其中所述第二结合力大于所述第一结合力。

10. 发明授权

US08054231B2 Mobile terminal having metal case and antenna structure 有权
标题翻译：具有金属外壳和天线结构的移动终端
公开(公告)号：US08054231B2
公开(公告)日：2011-11-08
申请号：US12419503
申请日：2009-04-07
申请人： Jung Ho Ahn , Yong Jin Kim , Dong Hwan Kim , Jae Ho Lee , Seung Hwan Kim
发明人： Jung Ho Ahn , Yong Jin Kim , Dong Hwan Kim , Jae Ho Lee , Seung Hwan Kim
IPC分类号： H01Q1/24 , H01Q13/10
CPC分类号： H01Q1/243 , H01Q13/106
摘要： A mobile terminal including a metal case and an antenna structure that can exhibit optimum radiation performance is provided. The antenna structure includes an antenna having a radiation unit for transmitting and for receiving electric waves, a Printed Circuit Board (PCB) to which the antenna is mechanically coupled at one surface thereof and having a power supply unit electrically coupled to the radiation unit, and a case constructed using a metal material within which the PCB is disposed, wherein the case has at least one slot formed in a surface thereof opposite to the surface to which the PCB is fastened and adjacent to the radiation unit.
摘要翻译：提供一种包括金属外壳和能够呈现最佳辐射性能的天线结构的移动终端。天线结构包括具有用于发送和接收电波的辐射单元的天线，天线在其一个表面机械耦合并具有电耦合到辐射单元的电源单元的印刷电路板（PCB），以及使用其中布置有PCB的金属材料构造的壳体，其中所述壳体具有形成在其与所述PCB被紧固并邻近所述辐射单元的表面相对的表面中的至少一个槽。

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