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    • 2. 发明授权
    • Apparatus for two-dimensional transducers used in three-dimensional ultrasonic imaging
    • 用于三维超声成像的二维换能器的装置
    • US07824338B2
    • 2010-11-02
    • US12233403
    • 2008-09-18
    • Christopher M. DaftIgal Ladabaum
    • Christopher M. DaftIgal Ladabaum
    • A61B8/00H01L41/113
    • G01S15/8925G01S7/52023G01S15/8993
    • A single chip transducer apparatus that includes on-chip electronic circuitry which, when connected properly to a two-dimensional matrix of ultrasonic transducer elements, provides enough information to an external imaging system to form three-dimensional images of the subject of interest. In a preferred embodiment, the circuitry provides an amplifier for each transducer element, and then conditions the output of the amplifier in several ways. In one embodiment of the invention, the elements' analog voltages are stored in a sample and hold circuit, and time multiplexed into a high speed line driver that sends many elements data down the interconnect to the system's high speed Analog to Digital converters. In another embodiment, the gain of the amplifiers can be controlled in time to provide aperture translation and time based expansion for translating and focusing image slices in the elevation direction.
    • 一种单芯片换能器装置,其包括片上电子电路,当与外部成像系统的二维矩阵正确连接时,其提供足够的信息以形成感兴趣对象的三维图像。 在优选实施例中,电路为每个换能器元件提供放大器,然后以多种方式调节放大器的输出。 在本发明的一个实施例中,元件的模拟电压被存储在采样和保持电路中,并且被时分复用到高速线路驱动器中,该高速线路驱动器将互连处的许多元件数据发送到系统的高速模数转换器。 在另一个实施例中,可以及时控制放大器的增益以提供孔径平移和基于时间的扩展,用于在高程方向上平移和聚焦图像切片。
    • 5. 发明申请
    • Method of Minimizing Inter-Element Signals for Transducers
    • 最小化传感器元件间信号的方法
    • US20080313883A1
    • 2008-12-25
    • US12099581
    • 2008-04-08
    • Igal Ladabaum
    • Igal Ladabaum
    • H04R31/00
    • B06B1/0292Y10T29/49002Y10T29/49005Y10T29/4908
    • The present invention provides a method of packaging surface microfabricated transducers such that electrical connections, protection, and relevant environmental exposure are realized prior to their separation into discrete components. The packaging method also isolates elements of array transducers. Post processing of wafers consisting of transducers only on the top few microns of the wafer surface can be used to create a wafer scale packaging solution. By spinning or otherwise depositing polymeric and metallic thin and thick films, and by lithographically defining apertures and patterns on such films, transducers can be fully packaged prior to the final dicing steps that would separate the packaged transducers from each other. In the case of microfabricated ultrasonic transducers, such packaging layers can also enable flexible transducers and eliminate or curtail the acoustic cross-coupling that can occur between array elements.
    • 本发明提供了一种包装表面微加工的换能器的方法,使得在分离成离散部件之前实现电连接,保护和相关的环境暴露。 封装方法也隔离阵列换能器的元件。 可以使用仅在晶片表面的最上面几微米处由换能器构成的晶片的后处理来制造晶片级封装解决方案。 通过旋转或以其他方式沉积聚合物和金属薄膜和厚膜,并且通过在这些膜上光刻地限定孔和图案,换能器可以在将封装的换能器彼此分离的最终切割步骤之前被完全包装。 在微细超声波换能器的情况下,这种包装层还可以实现灵活的换能器并且消除或限制阵列元件之间可能出现的声学交叉耦合。