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1. 发明申请

US20120146408A1 PRODUCTION SYSTEM POWER SUPPLY CONTROL METHOD, AND PRODUCTION SYSTEM 有权
标题翻译：生产系统电源控制方法及生产系统
公开(公告)号：US20120146408A1
公开(公告)日：2012-06-14
申请号：US13390813
申请日：2011-03-23
申请人： Tomotaka Nishimoto , Kouichi Yabuki , Ikuo Yoshida , Hiroyuki Kondo
发明人： Tomotaka Nishimoto , Kouichi Yabuki , Ikuo Yoshida , Hiroyuki Kondo
IPC分类号： H02J4/00
CPC分类号： H05K13/08 , Y10T307/25 , Y10T307/944
摘要： A power supply control method of a production system including a first unit and a second unit includes: starting power supply for operation of the second unit in accordance with a signal acquired according to an operation status of the first unit (S41); starting the operation by the second unit after the start of the power supply (S44); acquiring stop time information indicating time from when the operation ends to when a next operation of the second unit starts (S22); determining, based on the acquired stop time information, whether or not to stop the power supply after the started operation ends (S24); and stopping the power supply when it is determined to stop the power supply (S48).
摘要翻译：包括第一单元和第二单元的生产系统的电源控制方法包括：根据根据第一单元的操作状态获取的信号，起动用于第二单元的操作的电源（S41）; 在电源开始之后由第二单元开始操作（S44）; 获取指示从操作结束到第二单元的下一操作开始的时间的停止时间信息（S22）; 基于获取的停止时间信息确定在开始操作结束后是否停止电源（S24）; 并且当确定停止电源时停止电源（S48）。

2. 发明授权

US07571539B2 Component verification method and apparatus 有权
标题翻译：组件验证方法和装置
公开(公告)号：US07571539B2
公开(公告)日：2009-08-11
申请号：US10566835
申请日：2004-08-24
申请人： Yasuhiro Maenishi , Chikashi Konishi , Ikuo Yoshida , Hiroyoshi Nishida , Masaya Matsumoto , Akihito Yamasaki , Takuya Yamazaki
发明人： Yasuhiro Maenishi , Chikashi Konishi , Ikuo Yoshida , Hiroyoshi Nishida , Masaya Matsumoto , Akihito Yamasaki , Takuya Yamazaki
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , H05K13/08 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/53052 , Y10T29/53174
摘要： A component verification method for a mounter (100) that is capable of performing component verification with less labor. The method includes a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.
摘要翻译：一种用于安装者（100）的部件验证方法，其能够以较少的劳动进行部件验证。该方法包括：指定放置位置的位置指定步骤（S12A），其中放置组件带的安装器（100）; 读取步骤（S13），其从附着在所述部件带或卷轴（426）上的IC标签（426b）读取部件信息; 以及针对组件布置数据来验证组件信息和放置位置的验证步骤（S14），该组件布置数据指示应该安装到板上的组件以及组件磁带应该被放置的位置。

3. 发明申请

US20080228304A1 Line Balance Control Method, Line Balance Control Apparatus, and Component Mounting Machine 失效
标题翻译：线路平衡控制方法，线路平衡控制装置和部件安装机
公开(公告)号：US20080228304A1
公开(公告)日：2008-09-18
申请号：US10597285
申请日：2005-05-19
申请人： Yasuhiro Maenishi , Ikuo Yoshida
发明人： Yasuhiro Maenishi , Ikuo Yoshida
IPC分类号： G06F19/00
CPC分类号： G05B19/41805 , G05B19/41865 , G05B2219/32056 , G05B2219/32258 , G05B2219/32297 , G05B2219/32322 , G05B2219/33339 , G05B2219/45026 , Y02P90/04 , Y02P90/18 , Y02P90/20
摘要： To provide a line balance control method, a line balance control apparatus, and a component mounting machine, which do not require a higher-level device. A production line 100 is equipped with a printing machine 120, a coating machine 130, a component mounting machine 101, a component mounting machine 102, and a reflow machine 140, and they are connected through a communication line 110, respectively. In addition, a line balance control device, which is equipped with possibility inquiring means which makes an inquiry of whether or not it is possible to mount components to be allocated, among the components to be mounted, to the component mounting machines 101, 102, possibility obtaining means which obtains a response to the inquiry in the possibility inquiring means, and allocating means which allocates components to be mounted, to each component mounting machine 101, 102, in such a manner that mounting time at each component mounting machine is equalized, on the basis of the response obtained in the possibility obtaining means, is disposed in a device which configure the production line 100.
摘要翻译：为了提供不需要较高级别装置的线路平衡控制方法，线平衡控制装置和部件安装机。生产线100配备有印刷机120，涂布机130，部件安装机101，部件安装机102和回流焊机140，并且它们分别通过通信线路110连接。另外，线路平衡控制装置配备有可能询问装置，可以将待安装的部件是否可以安装在要安装的部件中的部件到组件安装机101,102，获取对可能性查询装置中的查询的响应的可能性获取装置，以及分配装置，其以每个部件安装机的安装时间相等的方式向每个部件安装机101,102分配要安装的部件，基于在可能性获得装置中获得的响应，被布置在构造生产线100的装置中。

4. 发明申请

US20070282974A1 DISTRIBUTION SERVER, MULTIFUNCTION APPRATUS AND DISTRIBUTION SERVER SYSTEM 审中-公开
标题翻译：分发服务器，多功能配置和分发服务器系统
公开(公告)号：US20070282974A1
公开(公告)日：2007-12-06
申请号：US11757541
申请日：2007-06-04
申请人： Koichi NAGOSHI , Ikuo YOSHIDA , Takeshi OOTSUKA , Takayuki FUKUSHIMA
发明人： Koichi NAGOSHI , Ikuo YOSHIDA , Takeshi OOTSUKA , Takayuki FUKUSHIMA
IPC分类号： G06F15/16
CPC分类号： H04N1/00413 , H04N1/00204 , H04N1/00244 , H04N1/00411 , H04N1/00416 , H04N1/00472 , H04N1/00474 , H04N1/00973 , H04N2201/0039 , H04N2201/0094
摘要： A distribution server distributes over a network, menu information that contains information for executing a job using a multifunction apparatus and information for identifying the job. The distribution server sets at least a portion of the information for executing the job using the multifunction apparatus as additional information added later to the menu information, and adds an input instruction to the menu information for executing additional information input using the multifunction apparatus. The multifunction apparatus that obtains the menu temporarily determines a portion of a fixed job for execution.
摘要翻译：分发服务器通过网络分发包含用于使用多功能设备执行作业的信息的菜单信息和用于识别作业的信息。分发服务器使用多功能设备将用于执行作业的信息的至少一部分设置为稍后添加到菜单信息中的附加信息，并将输入指令添加到用于执行使用多功能设备输入的附加信息的菜单信息。获取菜单的多功能装置临时确定用于执行的固定作业的一部分。

5. 发明申请

US20060265865A1 Apparatus for determining support member layout patterns 审中-公开
标题翻译：用于确定支撑构件布局图案的装置
公开(公告)号：US20060265865A1
公开(公告)日：2006-11-30
申请号：US10569723
申请日：2004-10-15
申请人： Ikuo Yoshida
发明人： Ikuo Yoshida
IPC分类号： H05K13/04
CPC分类号： H05K13/0069 , H05K13/0061 , Y10T29/49778 , Y10T29/4978 , Y10T29/5313
摘要： A support pin position determination apparatus (600) that determines the positions at which support pins are to be placed so that the leads of electronic components which have already been mounted on the undersurface of a circuit board are not damaged or the solder lands thereof do not come off includes: a database unit (607); a support pin position determination program storing unit (605); and a calculation control unit (601). The database unit (607) holds component mounting point data (607b), component shape data (607c), and available pin positions at which the support pins are allowed to be placed on a support pin plate (support pin plate data (607a)). The support pin position determination program storing unit (605) stores a support pin position determination program for determining positions at which the support pins are to be placed among the available pin positions, on the basis of the mounting point data and the shape data of the components. The calculation control unit (601) executes the support pin position determination program. The component shape data is data of the shape with a margin of a fixed width added around the outer shape of the component itself.
摘要翻译：确定支撑销的位置的支撑销位置确定装置（600），使得已经安装在电路板的下表面上的电子部件的引线没有被损坏或其焊盘没有脱落包括：数据库单元（607）; 支撑销位置确定程序存储单元（605）; 和计算控制单元（601）。数据库单元（607）保持部件安装点数据（607b），部件形状数据（607c）以及允许支撑销放置在支撑销板上的可用销位置（支撑销板数据（607 一个））。支撑销位置确定程序存储单元（605）基于安装点数据和安装点位置确定程序的形状数据，存储用于确定支撑销在可用引脚位置之间的位置的支撑销位置确定程序组件。计算控制单元（601）执行支撑销位置确定程序。部件形状数据是在部件本身的外形附近加上固定宽度的边缘的形状的数据。

6. 发明申请

US20060172666A1 Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips 有权
标题翻译：通过将半导体晶片分成单独的半导体芯片片来制造半导体器件的方法
公开(公告)号：US20060172666A1
公开(公告)日：2006-08-03
申请号：US10626524
申请日：2003-07-25
申请人： Junichi Hikita , Ikuo Yoshida , Kazuhide Ino
发明人： Junichi Hikita , Ikuo Yoshida , Kazuhide Ino
IPC分类号： B24B49/00 , B24B49/12
CPC分类号： B24B37/013 , B24B49/10 , B24B49/12 , H01L21/304 , H01L21/78
摘要： A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism, detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.
摘要翻译：一种通过将半导体晶片分成单独的半导体芯片片来制造半导体器件的方法。该方法包括根据期望的半导体芯片的外轮廓形成具有图案的凹槽，通过晶片保持机构保持半导体晶片，研磨由晶片保持机构保持的半导体晶片的背面，检测底部的开口在后表面磨削过程中的槽面，以确定后表面研磨的精加工时机。可以通过用于检测通过凹槽的光的光传感器或用于检测通过凹槽的微波的微波传感器来检测凹槽的开口。此外，可以吸收槽内的空气，以便通过槽内的空气的压力上升来检测槽的开口。

7. 发明授权

US06842974B1 Component mounting method and component mounting apparatus 有权
标题翻译：部件安装方法和部件安装装置
公开(公告)号：US06842974B1
公开(公告)日：2005-01-18
申请号：US10088759
申请日：2000-09-26
申请人： Yasuhiro Maenishi , Takahiro Inoue , Ikuo Yoshida
发明人： Yasuhiro Maenishi , Takahiro Inoue , Ikuo Yoshida
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0478 , H05K13/0409 , H05K13/041 , H05K13/0452 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178
摘要： An electronic component mounting method for placing electronic components successively to component placing positions on a board by component holding devices equipped with a plurality of removable suction nozzles which is operable to hold the electronic components. The method, as an example of its various manners, includes: in placing the electronic components onto a multiple board composed of a plurality of sub-boards, applying a placement step to all the sub-boards, the placement step being a step of placing onto the board all of electronic components that are holdable by an identical suction nozzle; and after completion of the placement step, changing the suction nozzle to another and moving to a next placement step, whereby electronic-component mounting for the individual sub-boards is carried out. In another aspect, component array intervals (M) of component feed sections or intervals (N) of component placing positions on the board are made coincident with array intervals (L) of the component holding devices.
摘要翻译：一种电子部件安装方法，用于通过具有可操作以保持电子部件的多个可移除的吸嘴的部件保持装置将电子部件连续地放置在板上的部件放置位置。该方法作为其各种方式的示例，包括：将电子部件放置在由多个子板构成的多个板上，向所有子板施加放置步骤，放置步骤是放置步骤在板上所有可由相同吸嘴保持的电子部件; 并且在完成放置步骤之后，将吸嘴改变为另一个并移动到下一个放置步骤，由此执行用于各个子板的电子部件安装。在另一方面，组件馈送部分的组件阵列间隔（M）或板上的组件放置位置的间隔（N）与组件保持装置的阵列间隔（L）一致。

8. 发明授权

US06787395B2 Method of manufacturing a multi-chip module 有权
标题翻译：制造多芯片模块的方法
公开(公告)号：US06787395B2
公开(公告)日：2004-09-07
申请号：US10269972
申请日：2002-10-15
申请人： Yoshiyuki Kado , Tsukio Funaki , Hiroshi Kikuchi , Ikuo Yoshida
发明人： Yoshiyuki Kado , Tsukio Funaki , Hiroshi Kikuchi , Ikuo Yoshida
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L23/49838 , H01L23/528 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H01L2924/00
摘要： Silicon chip having narrow pitches of Au bumps are mounted on a module substrate in such a way that while taking into consideration a difference in coefficient of thermal expansion between the silicon chip and the module substrate, a total pitch of electrode pads of the silicon chip is made narrower than a total pitch of the Au bumps, thereby preventing misregistration between the Au bumps and the electrode pads in the course of heat treatment to ensure reliable contact therebetween.
摘要翻译：具有较小间距的Au凸块的硅芯片以这样的方式安装在模块基板上，同时考虑到硅芯片和模块基板之间的热膨胀系数的差异，硅芯片的电极焊盘的总间距为比Au凸块的总间距窄，从而防止在热处理过程中Au凸块和电极焊盘之间的不对准，以确保其间的可靠接触。

9. 发明授权

US06646350B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06646350B2
公开(公告)日：2003-11-11
申请号：US09922230
申请日：2001-08-03
申请人： Naotaka Tanaka , Hideo Miura , Yoshiyuki Kado , Ikuo Yoshida , Takahiro Naito
发明人： Naotaka Tanaka , Hideo Miura , Yoshiyuki Kado , Ikuo Yoshida , Takahiro Naito
IPC分类号： H01L2352
CPC分类号： H01L23/562 , H01L21/563 , H01L23/145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/00
摘要： In order to realize a semiconductor device and a manufacturing method thereof which can keep with a high reliability an electric connection between each of bump pads formed on LSI chips and each of electrode pads formed on an interconnection substrate, within an guaranteed temperature range, a thermal expansion coefficient of an adhesive (3) is in the range of 20 to 60 ppm, and an elastic modulus of a build-up portion (6) is in the range of 5 to 10 GPa. Further, the build-up portion (6) is constituted by a multi-layer build-up substrate in which buid-up portion a peak value (a glass transition temperature) of a loss coefficient exists within a range of 100° C. to 250° C. and does not exist within a range of 0° C. to 100° C. By setting or selecting the physical properties in the manner disclosed above, it is possible to realize a semiconductor device and a manufacturing method thereof which can keep with a high reliability an electric bonding between the bump pads (2) formed on the LSI chips (1) and the electrode pads (4) on the interconnection substrate (5) within an guaranteed temperature range.
摘要翻译：为了实现能够保持高可靠性的半导体器件及其制造方法，在形成在LSI芯片上的每个凸块焊盘和形成在互连基板上的每个电极焊盘之间的电连接在保证的温度范围内，粘合剂（3）的膨胀系数在20〜60ppm的范围内，积聚部（6）的弹性模量在5〜10GPa的范围内。此外，积存部（6）由多层积层基板构成，在该多层积层基板中，增益部分的损耗系数的峰值（玻璃化转变温度）存在于100℃〜 250℃，并且不存在于0℃至100℃的范围内。通过以上述方式设置或选择物理性质，可以实现可以保持的半导体器件及其制造方法在保证温度范围内，形成在LSI芯片（1）上的凸块焊盘（2）和互连基板（5）上的电极焊盘（4）之间的电连接具有高可靠性。

10. 发明授权

US5305206A Apparatus for producing an operation manual for use with a host system 失效
标题翻译：用于生成与主机系统一起使用的操作手册的装置
公开(公告)号：US5305206A
公开(公告)日：1994-04-19
申请号：US644238
申请日：1991-01-22
申请人： Takashi Inoue , Kanji Kanai , Ikuo Yoshida , Akio Kizawa , Tadaaki Sakashita , Yoshitaka Hori
发明人： Takashi Inoue , Kanji Kanai , Ikuo Yoshida , Akio Kizawa , Tadaaki Sakashita , Yoshitaka Hori
IPC分类号： G06F3/02 , G06F15/00 , G06F17/21 , G06F15/40
CPC分类号： G06Q10/06 , G06Q10/087
摘要： An operations manual generation apparatus for use with a host system. The apparatus has an input for receiving ordering input data when an operator places an order following a prescribed procedure for requesting an operations manual from the host system. The apparatus has a first memory which stores first information needed to prepare the requested operations manual. The apparatus also has a second memory for storing instruction information which includes a set of guidance text data which describes the minimum number of operating steps needed to be carried out by an operator. Finally, an edit controller is provided for analyzing the first information to select a suitable combination of guidance text data, so that an operations manual may be output which has been automatically optimized to minimize the number of steps which the operator must take to cause the host system to perform the desired function.
摘要翻译：一种与主机系统一起使用的操作手册生成装置。该装置具有用于当操作员按照规定的程序从主机系统请求操作手册之后的命令时接收排序输入数据的输入。该装置具有存储准备所请求的操作手册所需的第一信息的第一存储器。该装置还具有用于存储指令信息的第二存储器，其包括描述操作者需要执行的最少操作步骤的一组指导文本数据。最后，提供编辑控制器用于分析第一信息以选择指导文本数据的合适组合，使得可以输出已经被自动优化的操作手册以最小化操作者必须采取的步骤数量以使主机系统执行所需功能。

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