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1. 发明授权

US06513718B1 Method for mounting a microcircuit in a cavity of a card forming a support and resulting card 有权
标题翻译：将微电路安装在形成支撑件和所得卡的卡的空腔中的方法
公开(公告)号：US06513718B1
公开(公告)日：2003-02-04
申请号：US09563904
申请日：2000-05-04
申请人： Francoise Bouchez , Francois Launay , Pierre Loubly , Jacques Venambre
发明人： Francoise Bouchez , Francois Launay , Pierre Loubly , Jacques Venambre
IPC分类号： G06K1906
CPC分类号： G06K19/07747 , G06K19/07728 , G06K19/07745 , H01L2224/48228
摘要： To mount a microcircuit module in a cavity in a card forming a support, resin is deposited on the bottom of the cavity and the module is fitted in such a way that the microcircuit is coated with resin. A compressible annular area formed in the cavity completely surrounds the microcircuit and the coating material. The annular area extends over a continuous peripheral area of the bottom of the cavity.
摘要翻译：为了将微型电路模块安装在形成支撑件的卡中的空腔中，树脂沉积在空腔的底部，并且模块以使得微电路涂覆有树脂的方式安装。形成在空腔中的可压缩环形区域完全包围微电路和涂层材料。环形区域在空腔的底部的连续周边区域上延伸。

2. 发明授权

US5850690A Method of manufacturing and assembling an integrated circuit card 失效
标题翻译：集成电路卡的制造和组装方法
公开(公告)号：US5850690A
公开(公告)日：1998-12-22
申请号：US677001
申请日：1996-07-08
申请人： Fran.cedilla.ois Launay , Jacques Venambre , Jan Severin , Harry Van Noort
发明人： Fran.cedilla.ois Launay , Jacques Venambre , Jan Severin , Harry Van Noort
IPC分类号： B42D15/10 , G06K19/077 , H01L23/28 , H01L23/50 , H05K3/34 , H01L21/56 , H05K13/04
CPC分类号： G06K19/07743 , G06K19/07745 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8592 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01079 , H01L2924/01087 , H01L2924/15153 , H01L2924/15165 , Y10T29/49121 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165
摘要： In a first step, electrical conductor tracks (15 to 20) are applied against the bottom and the walls of a cavity (5) for the integrated circuit (IC4) and connected to external contact pads (2) at the same side of the card. Said tracks lie alternately side-by-side at the bottom 7 of the cavity. In a second step, the IC (4) is glued with its surface which does not carry the contacts on said tracks on the bottom (7) of the cavity by means of a non-conducting glue. Then connections are realized by soldering of conductor wires (12) between contacts of the IC and ends of the tracks, and the cavity is filled with a protective resin. Application: Placement of an IC with inverted contacts in an electronic card support.
摘要翻译：在第一步骤中，将电导体轨道（15至20）施加到集成电路（IC4）的空腔（5）的底部和壁上，并连接到卡的同一侧的外部接触焊盘（2）。所述轨迹在空腔的底部7处并排交替并排。在第二步骤中，IC（4）与其表面粘合，其表面不通过非导电胶将携带在空腔底部（7）上的轨道上的触点。然后通过在IC的触点和轨道的端部之间焊接导线（12）来实现连接，并且空腔中填充有保护树脂。应用：在电子卡支持中放置具有倒置接点的IC。

3. 发明申请

US20080277484A1 Smart Card Producing Method and a Smart Card in Particular Provided with a Magnetic Antenna 有权
标题翻译：智能卡生产方法和特别提供磁性天线的智能卡
公开(公告)号：US20080277484A1
公开(公告)日：2008-11-13
申请号：US12092994
申请日：2006-11-02
申请人： Francois Launay , Jacques Venambre , Yann Limelette , Aurelie Barbotin
发明人： Francois Launay , Jacques Venambre , Yann Limelette , Aurelie Barbotin
IPC分类号： G06K19/077
CPC分类号： G06K19/07749 , G06K19/0775 , G06K19/07767 , G06K19/07779 , G06K19/07783 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/01025 , H01L2924/01087 , H01L2924/00012 , H01L2924/00
摘要： A smart card comprises a magnetic antenna consisting of first (26) and second (28) coils. The card embossing area (24) is arranged outside of the first coil (26) and inside the second coil (28). A smart card producing method is also disclosed.
摘要翻译：智能卡包括由第一（26）和第二（28）线圈组成的磁性天线。卡片压印区域（24）布置在第一线圈（26）的外侧和第二线圈（28）的内部。还公开了一种智能卡制造方法。

4. 发明申请

US20060255157A1 Method for production of a card with a double interface and microcircuit card obtained thus 有权
标题翻译：一种具有双接口和微电路卡的卡的制造方法
公开(公告)号：US20060255157A1
公开(公告)日：2006-11-16
申请号：US10572461
申请日：2004-10-12
申请人： François Launay , Jacques Venambre
发明人： François Launay , Jacques Venambre
IPC分类号： G06K19/06
CPC分类号： G06K19/07769 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L2924/0002 , H05K1/183 , H05K3/323 , H05K2201/10727 , H01L2924/00
摘要： A method for production of a microcircuit card, includes the production of a card with electronic component connector pins for an electronic component within the thickness thereof and provided with a cavity with a base and defined by a slope on which the connector pins are arranged and production of a module including a support film with external contacts on an external face thereof and internal contacts on an internal face thereof. An anisotropic flexible conducting adhesive is then applied to the periphery of the internal face of the film, a resin more rigid than the adhesive is introduced into the cavity of the body, the module is inserted into the cavity such that the anisotropic adhesive is located opposite the periphery of the slope of the cavity, the anisotropic adhesive is thermally activated under pressure and the resin polymerized.
摘要翻译：一种微电路卡的制造方法，其特征在于，制造具有电子部件的厚度为电子部件的电子部件连接器针的卡，并且具有由基座构成的空腔，并且由设置有连接器针脚的斜面限定，包括在其外表面上具有外部触点的支撑膜和其内表面上的内部触点的模块。然后将各向异性柔性导电粘合剂施加到膜的内表面的周边，将比粘合剂更刚性的树脂引入到主体的空腔中，将模块插入空腔中，使得各向异性粘合剂位于相对的位置空腔边缘的周边，各向异性粘合剂在压力下热活化，树脂聚合。

5. 发明授权

US5647122A Manufacturing method for an integrated circuit card 失效
标题翻译：集成电路卡的制造方法
公开(公告)号：US5647122A
公开(公告)日：1997-07-15
申请号：US490482
申请日：1995-06-14
申请人： Fran.cedilla.ois Launay , Jacques Venambre
发明人： Fran.cedilla.ois Launay , Jacques Venambre
IPC分类号： B42D15/10 , G06K19/077 , H01L21/60 , H01L23/24 , H01L23/498 , H05K3/34
CPC分类号： H01L24/81 , G06K19/07743 , G06K19/07745 , H01L23/24 , H01L23/49855 , B29L2031/3493 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2224/81801 , H01L2224/85205 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , Y10T29/49144
摘要： The electronic card comprises an electrically insulating card support provided with a cavity for accommodating an integrated circuit and, on one surface, with metal contact pads which are electrically connected to contacts of the integrated circuit. The invention comprises the steps of: (i) the application by an MID technique (Moulded Interconnection Devices) of electrical conductor tracks, all arranged on the bottom and the lateral walls of the cavity, and each connected to one of the metal contact pads arranged on the surface of the support which comprises the cavity, (ii) the realization of electrical connections connecting the contacts of the integrated circuit arranged in the cavity to the conductor tracks on the bottom of the cavity, and (iii) filling up of the cavity with a protective resin which is subsequently polymerized.
摘要翻译：电子卡包括电绝缘卡支架，其设置有用于容纳集成电路的空腔，并且在一个表面上具有电连接到集成电路的触点的金属接触焊盘。本发明包括以下步骤：（i）通过MID技术（模制互连装置）应用电导体轨道，其全部布置在空腔的底部和侧壁上，并且每个连接到布置的金属接触垫中的一个在包括空腔的支撑体的表面上，（ii）实现将布置在空腔中的集成电路的触点连接到腔的底部上的导体轨迹的电连接，以及（iii）填充空腔与保护树脂接着聚合。

6. 发明授权

US5585669A Semiconductor chip card having selective encapsulation 失效
标题翻译：具有选择性封装的半导体芯片卡
公开(公告)号：US5585669A
公开(公告)日：1996-12-17
申请号：US444141
申请日：1995-05-18
申请人： Jacques Venambre
发明人： Jacques Venambre
IPC分类号： B29C39/10 , B29L31/34 , B42D15/10 , G06K19/077 , H01L23/02 , H05K3/00
CPC分类号： G06K19/07745 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , Y10T29/49121 , Y10T29/49124
摘要： A chip card including a card base with a recess. A circuit support and a microcircuit is arranged on a circuit support surface which faces an interior of the recess and is spaced from the recess bottom. A raised portion is formed on the recess bottom and spaced from a cover section so as to divide the recess into two regions bounded by the recess bottom, the cover section and the raised portion. The first region is completely filled with an encapsulant and the second region is partly filled with the encapsulant.
摘要翻译：包括具有凹槽的卡座的芯片卡。电路支撑件和微电路布置在电路支撑表面上，该电路支撑表面面向凹部的内部并且与凹部底部间隔开。凸起部分形成在凹部底部并与盖部间隔开，以便将凹部分成由凹部底部，盖部分和凸起部分限定的两个区域。第一区域完全填充有密封剂，第二区域部分地填充有密封剂。

7. 发明授权

US08870076B2 Smart card producing method and a smart card in particular provided with a magnetic antenna 有权
标题翻译：智能卡制作方法和特别设有磁性天线的智能卡
公开(公告)号：US08870076B2
公开(公告)日：2014-10-28
申请号：US12092994
申请日：2006-11-02
申请人： François Launay , Jacques Venambre , Yann Limelette , Aurélie Barbotin
发明人： François Launay , Jacques Venambre , Yann Limelette , Aurélie Barbotin
IPC分类号： G06K19/06 , G06K19/077
CPC分类号： G06K19/07749 , G06K19/0775 , G06K19/07767 , G06K19/07779 , G06K19/07783 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/01025 , H01L2924/01087 , H01L2924/00012 , H01L2924/00
摘要： A smart card comprises a magnetic antenna consisting of first (26) and second (28) coils. The card embossing area (24) is arranged outside of the first coil (26) and inside the second coil (28). A smart card producing method is also disclosed.
摘要翻译：智能卡包括由第一（26）和第二（28）线圈组成的磁性天线。卡片压印区域（24）布置在第一线圈（26）的外侧和第二线圈（28）的内部。还公开了一种智能卡制造方法。

8. 发明授权

US07735741B2 Method for production of a card with a double interface and microcircuit card obtained thus 有权
标题翻译：一种具有双接口和微电路卡的卡的制造方法
公开(公告)号：US07735741B2
公开(公告)日：2010-06-15
申请号：US10572461
申请日：2004-10-12
申请人： François Launay , Jacques Venambre
发明人： François Launay , Jacques Venambre
IPC分类号： G06K19/06
CPC分类号： G06K19/07769 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L2924/0002 , H05K1/183 , H05K3/323 , H05K2201/10727 , H01L2924/00
摘要： A method for production of a microcircuit card, includes the production of a card with electronic component connector pins for an electronic component within the thickness thereof and provided with a cavity with a base and defined by a slope on which the connector pins are arranged and production of a module including a support film with external contacts on an external face thereof and internal contacts on an internal face thereof. An anisotropic flexible conducting adhesive is then applied to the periphery of the internal face of the film, a resin more rigid than the adhesive is introduced into the cavity of the body, the module is inserted into the cavity such that the anisotropic adhesive is located opposite the periphery of the slope of the cavity, the anisotropic adhesive is thermally activated under pressure and the resin polymerized.
摘要翻译：一种微电路卡的制造方法，其特征在于，制造具有电子部件的厚度为电子部件的电子部件连接器针的卡，并且具有由基座构成的空腔，并且由设置有连接器针脚的斜面限定，包括在其外表面上具有外部触点的支撑膜和其内表面上的内部触点的模块。然后将各向异性柔性导电粘合剂施加到膜的内表面的周边，将比粘合剂更刚性的树脂引入到主体的空腔中，将模块插入空腔中，使得各向异性粘合剂位于相对的位置空腔边缘的周边，各向异性粘合剂在压力下热活化，树脂聚合。

9. 发明申请

US20060237542A1 Smart card comprising a protruding component and method for making same 有权
标题翻译：包括突出部件的智能卡及其制造方法
公开(公告)号：US20060237542A1
公开(公告)日：2006-10-26
申请号：US10532862
申请日：2003-10-23
申请人： Francois Launay , Jacques Venambre
发明人： Francois Launay , Jacques Venambre
IPC分类号： G06K19/06
CPC分类号： G06K19/0718 , G06K19/077 , G06K19/07703 , G06K19/07745 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： The invention concerns a smart card comprising a microcircuit, at least one other component including a protruding component and external contacts in a card-holder. The invention is characterized in that the microcircuit (1), the protruding component (2) and the external contacts (12) form part of a subassembly (S1) fixed in a housing (C1+C2+C3) provided in part of the thickness of the card-holder, said subassembly including a support film (10) bearing on one inner surface the microcircuit (1) and at least the protruding component (2) and on one outer surface the external contacts (12), a window (11) being arranged in said film opposite part of the projecting component.
摘要翻译：本发明涉及一种智能卡，其包括微电路，至少一个其它组件，其包括突出部件和卡片保持器中的外部触点。本发明的特征在于，微电路（1），突出部件（2）和外部触头（12）形成固定在壳体（C 1 + C 2 + C 3）中的子组件（S1）的一部分，所述子组件包括支撑膜（10），所述支撑膜（10）承载在一个内表面上的所述微电路（1）和至少所述突出部件（2），并且在一个外表面上承载所述外部触头（12），窗口（11）布置在所述膜的与突出部件相对的一部分上。

10. 发明授权

US5438750A Method of manufacturing a chip card 失效
标题翻译：制造芯片卡的方法
公开(公告)号：US5438750A
公开(公告)日：1995-08-08
申请号：US360185
申请日：1994-12-20
申请人： Jacques Venambre
发明人： Jacques Venambre
IPC分类号： B29C39/10 , B29L31/34 , B42D15/10 , G06K19/077 , H05K3/00
CPC分类号： G06K19/07745 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , Y10T29/49121 , Y10T29/49124
摘要： A method of manufacturing a chip card comprising a card base in which a cover section is secured, which cover section comprises a circuit support and at least one microcircuit arranged on a lower surface of the circuit support, which lower surface faces the interior of a recess and is spaced from the inner surface of the bottom of the recess, in which method an encapsulant is applied to said inner surface. According to the invention the method comprises the following steps:a) applying a metered mount of said encapsulant to a first part (7) of the inner surface of the bottom (6) of the recess, which first part is surrounded by a raised portion (11), which raised portion (11) itself is surrounded by a second part (8) of said inner surface in such manner that the encapsulant (36) is retained by capillarity by the raised portion (11), which is adapted to be spaced over at least a part of its circumference from the cover section (20) when said section is secured to the card base,b) fixing the cover section (20) on the card base (1), the encapsulant (36) completely filling a first volume (V'.sub.1) situated between said first part (7) and the cover section (20) and partly filling a second volume (V'.sub.2) situated between said second part (8) and the cover section (20).
摘要翻译：一种制造芯片卡的方法，其包括其中固定有盖部分的卡座，所述盖部分包括电路支撑件和布置在电路支撑件的下表面上的至少一个微电路，所述至少一个微电路面向凹部的内部并且与凹部的底部的内表面间隔开，在该方法中，将密封剂施加到所述内表面。根据本发明，该方法包括以下步骤：a）将所述密封剂的计量安装件施加到凹部的底部（6）的内表面的第一部分（7），该第一部分被凸起部分（11），所述凸起部分（11）本身被所述内表面的第二部分（8）围绕，使得所述密封剂（36）由所述凸起部分（11）的毛细管力保持，所述凸起部分适于当所述部分固定在卡座上时，从盖部分（20）的至少一部分周边间隔开，b）将盖部分（20）固定在卡片基座（1）上，密封剂（36）完全填充位于所述第一部分（7）和所述盖部分（20）之间并且部分地填充位于所述第二部分（8）和所述盖部分（20）之间的第二容积（V'2）的第一容积（V'1）。

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