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    • 6. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US07362635B2
    • 2008-04-22
    • US11499156
    • 2006-08-04
    • Kyung-Hyun KimJae-Woong Lee
    • Kyung-Hyun KimJae-Woong Lee
    • G11C7/00G11C8/00
    • G11C29/46G11C29/14
    • A semiconductor memory device includes a control signal generator for combining command signals applied from an external portion to generate a test signal; a set/reset signal generator for receiving a mode setting signal applied from an external portion in response to the test signal and generating a first set/reset signal when the mode setting signal is a signal that designates an individual set/reset; a test logic portion for storing and then outputting the mode setting signal in response to the test signal; a set/reset master signal generator for receiving the first set/reset signal to output a set/reset master signal for commonly controlling a test mode of internal blocks of the semiconductor memory device; and a test control signal generator for combining an output signal of the test logic portion to generate a plurality of control signals and generating the set/reset master signal as a plurality of test control signals in response to the plurality of control signals.
    • 半导体存储器件包括:控制信号发生器,用于组合从外部施加的命令信号以产生测试信号; 设置/复位信号发生器,用于响应于测试信号接收从外部施加的模式设置信号,并且当模式设置信号是指定单独设置/复位的信号时产生第一设置/复位信号; 测试逻辑部分,用于响应于测试信号存储并随后输出模式设置信号; 一个设置/复位主信号发生器,用于接收第一设置/复位信号以输出一个设置/复位主信号,用于共同控制半导体存储器件的内部块的测试模式; 以及测试控制信号发生器,用于组合测试逻辑部分的输出信号以产生多个控制信号,并且响应于多个控制信号,将设置/复位主信号生成为多个测试控制信号。
    • 8. 发明授权
    • Scalable hierarchical I/O line structure for a semiconductor memory device
    • 半导体存储器件的可分级I / O线结构
    • US06870205B2
    • 2005-03-22
    • US10337693
    • 2003-01-07
    • Jae-woong LeeJong-hak Won
    • Jae-woong LeeJong-hak Won
    • H01L27/108G11C7/10G11C7/18G11C11/401G11C11/409G11C11/4097H01L21/8242H01L27/02H01L27/10
    • G11C11/4097G11C7/18H01L27/0207
    • A semiconductor memory device having a hierarchical I/O line structure is provided. The semiconductor memory array includes a memory cell array which is divided into a plurality of sub-arrays by sub-word line driver areas and bit line sense amplifier areas; local input/output (I/O) lines which are arranged in the bit line sense amplifier areas; and global I/O lines which are arranged in the sub-word line driver areas, wherein at least one end of each of the local I/O lines is formed in a bit line sense amplifier area. The semiconductor memory device may also have a dummy bit line sense amplifier area capable of dividing local I/O lines in a bit line sense amplifier area, and can reduce the number of sub-word line driver areas such that the chip size can be reduced.
    • 提供具有分层I / O线结构的半导体存储器件。 半导体存储器阵列包括存储单元阵列,其通过子字线驱动器区域和位线读出放大器区域被划分为多个子阵列; 布置在位线读出放大器区域中的本地输入/输出(I / O)线; 以及布置在子字线驱动器区域中的全局I / O线,其中每个本地I / O线的至少一端形成在位线读出放大器区域中。 半导体存储器件还可以具有能够在位线读出放大器区域中分割本地I / O线的虚拟位线读出放大器区域,并且可以减少子字线驱动器区域的数量,使得芯片尺寸可以减小 。
    • 9. 发明授权
    • Semiconductor memory architecture for minimizing input/output data paths
    • 半导体存储架构,用于最小化输入/输出数据路径
    • US06396766B1
    • 2002-05-28
    • US09829650
    • 2001-04-10
    • Jae-woong Lee
    • Jae-woong Lee
    • G11C800
    • G11C5/063G11C5/025
    • A semiconductor memory device comprising an architecture for minimizing the lengths of the I/O (input/output) data paths and the difference in length between the data paths. In one aspect, a semiconductor memory device comprises first and second pad groups, first, second, third and fourth banks and first and second circuits. The first pad group comprises a portion of the total number of pads and is located in proximity to the center of the chip, and the second pad group comprises the remaining pads. The first, second, third and fourth banks include first and second, third and fourth, fifth and sixth and seventh and eighth blocks having memory cells, respectively, and further include first and second, third and fourth, fifth and sixth and seventh and eighth I/O units for inputting and outputting the data in the first through fourth blocks, respectively. The first circuit is connected between the first pad group and the odd-numbered I/O units of the banks, and performs multiplexing. The second circuit is connected between the second pad group and the even-numbered I/O units of the banks, and performs multiplexing. The banks and circuits are disposed on the semiconductor device such that the data buses connecting the corresponding banks and circuits are substantially the same length and width. Each of the first and second circuits can be replaced with a plurality of I/O sense amplifiers, and the I/O units can be replaced with I/O multiplexers.
    • 一种半导体存储器件,包括用于最小化I / O(输入/输出)数据路径的长度和数据路径之间的长度差的架构。 一方面,一种半导体存储器件包括第一和第二焊盘组,第一,第二,第三和第四组以及第一和第二电路。 第一衬垫组包括总数量的焊盘的一部分,并且位于芯片的中心附近,并且第二焊盘组包括剩余焊盘。 第一,第二,第三和第四组包括分别具有存储单元的第一和第二,第三和第四,第五和第六和第七和第八块,并且还包括第一和第二,第三和第四,第五和第六和第七和第八 I / O单元,分别用于在第一至第四块中输入和输出数据。 第一电路连接在第一焊盘组和组的奇数I / O单元之间,并执行复用。 第二电路连接在第二焊盘组和组的偶数I / O单元之间,并执行复用。 堤和电路设置在半导体器件上,使得连接对应的堤和电路的数据总线大致相同的长度和宽度。 第一和第二电路中的每一个可以被多个I / O读出放大器代替,并且I / O单元可以用I / O复用器代替。