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1. 发明授权

US5378307A Fluid treatment apparatus 失效
标题翻译：流体处理设备
公开(公告)号：US5378307A
公开(公告)日：1995-01-03
申请号：US54108
申请日：1993-04-28
申请人： Steven L. Bard , Gerald A. Bendz , Michael J. Canestaro , John R. Chapura , Edward J. Frankoski , Michael S. Horan , Jeffrey D. Jones , James S. Kamperman , John R. Kjelgaard, Jr. , Jack M. McCreary
发明人： Steven L. Bard , Gerald A. Bendz , Michael J. Canestaro , John R. Chapura , Edward J. Frankoski , Michael S. Horan , Jeffrey D. Jones , James S. Kamperman , John R. Kjelgaard, Jr. , Jack M. McCreary
IPC分类号： B05C5/00 , B05B15/04 , C23F1/08 , H01L23/12 , H05K3/00 , H05K3/06 , H05K3/18 , B08B3/02
CPC分类号： H05K3/0085 , B05B15/0406 , Y02P70/36
摘要： A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.
摘要翻译：一种用于将第一和第二流体（例如蚀刻剂和水）施加到以预定速率穿过设备的制品（例如电路板）的流体处理装置和方法。第一流体冲击在物品的表面上，然后收集在设备的共用外壳内。第二流体冲击到制品的表面上并收集在相同的壳体内，但是在与收集的第一流体分开的位置处，以至少部分地防止其混合。用于实现流体冲击的优选方式包括单独的流体注射器，每个流体注射器在其中包括至少两排流体喷射喷射器。收集的流体各自返回到相应的冲击装置。使用供应第二流体的泵来实现第二流体的补充，同时该装置还包括以与第二流体的供给速率相似的速率有效地去除第二流体的装置（例如排水管）。使用位于第一流体冲击装置相对（例如，在相对侧）上的合适的装置（例如，双辊），第一流体也保持在制品表面上方的确定水平。第二流体的相似水平保持也是可能的。还定义了所收集的第二流体的级联，其发生在用于收集第一流体的相同壳体室内。

2. 发明授权

US5363553A Method of drilling vias and through holes 失效
标题翻译：钻通孔和通孔的方法
公开(公告)号：US5363553A
公开(公告)日：1994-11-15
申请号：US98085
申请日：1993-07-27
申请人： Robert D. Edwards , Frank D. Egitto , Thomas P. Gall , Paul S. Gursky , David E. Houser , James S. Kamperman , Warren R. Wrenner
发明人： Robert D. Edwards , Frank D. Egitto , Thomas P. Gall , Paul S. Gursky , David E. Houser , James S. Kamperman , Warren R. Wrenner
IPC分类号： H05K3/00 , H05K3/44 , H01K3/10
CPC分类号： H05K3/44 , H05K2201/0338 , H05K2201/068 , H05K2203/0323 , H05K2203/0361 , H05K2203/0369 , H05K3/0047 , H05K3/445 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a method of producing vias and through holes through a metal laminate. The laminate is a multi-layer, for example, a trilayer of a relatively hard metal between two layers of a relatively soft metal. The method includes the steps of first etching a clearance hole through the soft metal on one side of the trilayer laminate, followed by partially etching the hard metal layer. Next, drilling the remaining thickness of the hard metal, and drilling through the second layer of soft metal.
摘要翻译：公开了一种通过金属层压体制造通孔和通孔的方法。层压体是多层，例如，两层相对软的金属之间的相对硬的金属的三层。该方法包括以下步骤：首先蚀刻穿过三层层压体一侧的软金属的间隙孔，然后部分蚀刻硬质金属层。接下来，钻出硬质金属的剩余厚度，并穿过第二层软金属。

3. 发明申请

US20080296348A1 Heater for select solder machine 审中-公开
标题翻译：加热器用于选择焊机
公开(公告)号：US20080296348A1
公开(公告)日：2008-12-04
申请号：US11809946
申请日：2007-06-04
申请人： Richard F. Slater, JR. , James S. Kamperman , John J. Lavetsky
发明人： Richard F. Slater, JR. , James S. Kamperman , John J. Lavetsky
IPC分类号： B23K1/00 , B23K31/12
CPC分类号： B23K3/047 , B23K1/0016 , B23K3/0653 , B23K3/087 , B23K2101/42 , H05K3/3468 , H05K3/3494
摘要： A select solder machine configured to solder a circuit board using a solder material. The select solder machine includes a solder head movable with respect to the circuit board. The solder head is configured to position the solder material with respect to the circuit board to solder the circuit board. The select solder machine further includes a support member configured to support the circuit board in a position adjacent the solder head, and a heating member configured to heat the circuit board. The heating member is located above the circuit board.
摘要翻译：配置为使用焊料材料焊接电路板的选择焊接机。选择性焊接机包括可相对于电路板移动的焊接头。焊头被配置为相对于电路板定位焊料材料以焊接电路板。选择焊接机还包括被配置为将电路板支撑在与焊头相邻的位置的支撑构件，以及构造成加热电路板的加热构件。加热部件位于电路板的上方。

4. 发明授权

US4835847A Method and apparatus for mounting a flexible film electronic device carrier on a substrate 失效
标题翻译：将柔性膜电子器件载体安装在基底上的方法和装置
公开(公告)号：US4835847A
公开(公告)日：1989-06-06
申请号：US183948
申请日：1988-04-20
申请人： James S. Kamperman
发明人： James S. Kamperman
IPC分类号： H01L21/00 , H01L21/60 , H01L23/498 , H05K3/34
CPC分类号： H01L24/50 , H01L21/67144 , H01L23/4985 , H05K3/3421 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H05K2201/10681 , H05K2203/0195 , H05K2203/085 , Y02P70/613 , Y10T29/49121 , Y10T29/49144 , Y10T29/53178
摘要： A fixture for mounting a flexible film electronic device carrier on or for separating the carrier from a substrate which includes a body portion that has a cavity deep enough to contain an electronic device attached to the carrier, a perimeter for contact with a lead bonding area of the film, a surface having openings through which a vacuum can be drawn for holding the flexible film carrier and electronic device attached thereto in the cavity, and a heating element in the perimeter of the body portion; and use thereof to mount a carrier on to separate a carrier from a substrate.

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