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1. 发明授权

US5378307A Fluid treatment apparatus 失效
标题翻译：流体处理设备
公开(公告)号：US5378307A
公开(公告)日：1995-01-03
申请号：US54108
申请日：1993-04-28
申请人： Steven L. Bard , Gerald A. Bendz , Michael J. Canestaro , John R. Chapura , Edward J. Frankoski , Michael S. Horan , Jeffrey D. Jones , James S. Kamperman , John R. Kjelgaard, Jr. , Jack M. McCreary
发明人： Steven L. Bard , Gerald A. Bendz , Michael J. Canestaro , John R. Chapura , Edward J. Frankoski , Michael S. Horan , Jeffrey D. Jones , James S. Kamperman , John R. Kjelgaard, Jr. , Jack M. McCreary
IPC分类号： B05C5/00 , B05B15/04 , C23F1/08 , H01L23/12 , H05K3/00 , H05K3/06 , H05K3/18 , B08B3/02
CPC分类号： H05K3/0085 , B05B15/0406 , Y02P70/36
摘要： A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.
摘要翻译：一种用于将第一和第二流体（例如蚀刻剂和水）施加到以预定速率穿过设备的制品（例如电路板）的流体处理装置和方法。第一流体冲击在物品的表面上，然后收集在设备的共用外壳内。第二流体冲击到制品的表面上并收集在相同的壳体内，但是在与收集的第一流体分开的位置处，以至少部分地防止其混合。用于实现流体冲击的优选方式包括单独的流体注射器，每个流体注射器在其中包括至少两排流体喷射喷射器。收集的流体各自返回到相应的冲击装置。使用供应第二流体的泵来实现第二流体的补充，同时该装置还包括以与第二流体的供给速率相似的速率有效地去除第二流体的装置（例如排水管）。使用位于第一流体冲击装置相对（例如，在相对侧）上的合适的装置（例如，双辊），第一流体也保持在制品表面上方的确定水平。第二流体的相似水平保持也是可能的。还定义了所收集的第二流体的级联，其发生在用于收集第一流体的相同壳体室内。

2. 发明授权

US4554184A Method for plating from an electroless plating bath 失效
标题翻译：从化学镀浴中镀覆的方法
公开(公告)号：US4554184A
公开(公告)日：1985-11-19
申请号：US626961
申请日：1984-07-02
申请人： Michael J. Canestaro , Ronald A. Kaschak , Donald G. McBride , Donald P. Seraphim
发明人： Michael J. Canestaro , Ronald A. Kaschak , Donald G. McBride , Donald P. Seraphim
IPC分类号： C23C18/16 , C23C18/31 , C23C18/34 , C23C18/40 , C23C18/44 , H05K3/18
CPC分类号： C23C18/1617 , C23C18/1676 , C23C18/168 , C23C18/405 , H05K3/187
摘要： A method for plating a metal from an electroless plating bath onto a substrate is provided which includes providing a source of an electroless plating bath at a non-plating temperature in a master mixing tank; transferring at least a portion of the plating bath to at least one plating cell, changing the bath temperature to a plating temperature, and contacting the substrate to be plated with the bath at a plating temperature.
摘要翻译：提供了一种从化学镀浴中将金属镀覆到基底上的方法，其包括在主混合槽中提供非电镀温度下的无电镀浴源; 将至少一部分电镀槽转移到至少一个电镀单元，将电镀温度改变为电镀温度，并在电镀温度下使待镀衬底与镀液接触。

3. 发明授权

US4358479A Treatment of copper and use thereof 失效
标题翻译：铜的处理及其用途
公开(公告)号：US4358479A
公开(公告)日：1982-11-09
申请号：US211998
申请日：1980-12-01
申请人： Michael J. Canestaro , Edmond O. Fey
发明人： Michael J. Canestaro , Edmond O. Fey
IPC分类号： C23C22/63 , C23F1/34 , H05K3/38 , B05D5/12 , C23F1/00
CPC分类号： C23C22/63 , H05K3/381 , H05K3/385 , H05K2203/0307 , H05K2203/0315 , H05K2203/0723 , H05K2203/1152
摘要： A method for modifying the surface characteristics of copper foil by contacting a surface thereof with an oxidizing composition; and use of the treated copper foil in the preparation of printed circuits.
摘要翻译：一种通过使其表面与氧化组合物接触来改变铜箔的表面特性的方法; 并使用经处理的铜箔制备印刷电路。

4. 发明授权

US5427627A Method for treating substrates 失效
标题翻译：处理底物的方法
公开(公告)号：US5427627A
公开(公告)日：1995-06-27
申请号：US179653
申请日：1994-01-05
申请人： Michael J. Canestaro , Donald G. McBride , Louis J. Konrad, III , Ronald J. Moore
发明人： Michael J. Canestaro , Donald G. McBride , Louis J. Konrad, III , Ronald J. Moore
IPC分类号： C23F1/08 , B05C3/12 , B05C3/18 , B05C5/02 , C23G3/00 , H05K3/00 , H05K3/06 , H05K3/18 , H05K3/26 , H05K3/42 , B08B3/02
CPC分类号： B05C3/18 , B05C3/125 , H05K3/0085
摘要： A device for applying fluid to a substrate which includes a head member having first and second opposed portions adapted for being fixedly positioned relative to each other. The device is particularly suited for treating a substrate as the substrate moves between the first and second portions. Each portion may in turn include a first channel located at a predetermined distance from the substrate for having a first fluid impinge on the substrate at a first velocity. Additionally, each portion may include a weir adjacent the first channel for having fluid pass thereover at an accelerated rate and thus at a greater velocity than the first fluid, this weir being located at a lesser distance than the first channel. Fluid inlet means is coupled to the respective portions to provide the fluid thereto at desired velocities. Significantly, a fluid blocking means (e.g., an elongated bar) is also included as part of the structure for maintaining the fluids at pre-established levels.
摘要翻译：一种用于向衬底施加流体的装置，其包括具有适于相对于彼此固定定位的第一和第二相对部分的头部构件。当衬底在第一和第二部分之间移动时，该器件特别适用于处理衬底。每个部分还可以包括位于距衬底预定距离的第一通道，以使第一流体以第一速度冲击在衬底上。另外，每个部分可以包括邻近第一通道的堰，用于使流体以加速的速度传递到其上，因此以比第一流体更大的速度传递，该堰位于比第一通道更小的距离处。流体入口装置联接到相应的部分，以期望的速度向其提供流体。重要的是，还包括流体阻塞装置（例如，细长条）作为用于将流体保持在预先确定的水平的结构的一部分。

5. 发明授权

US4431685A Decreasing plated metal defects 失效
标题翻译：减少电镀金属缺陷
公开(公告)号：US4431685A
公开(公告)日：1984-02-14
申请号：US394588
申请日：1982-07-02
申请人： Michael J. Canestaro , Donald G. McBride , John A. Welsh
发明人： Michael J. Canestaro , Donald G. McBride , John A. Welsh
IPC分类号： C23C18/18 , C23C18/16 , C23C18/38 , C23C18/42 , C25D5/02 , G03F7/11 , H01L21/70 , H05K3/10 , H05K3/24 , H05K3/38 , G03C5/00
CPC分类号： H05K3/244 , C23C18/1605 , C23C18/1651 , C23C18/54 , G03F7/11 , H01L21/707 , H05K3/384 , H05K2201/0347 , H05K2203/072 , H05K3/108 , H05K3/382
摘要： A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.
摘要翻译：一种通过在光致抗蚀剂和金属表面之间施加一层贵金属如钯，铂，金，铱，铑或其混合物来减少电镀金属缺陷的方法。

6. 发明授权

US5311660A Methyl chloroform-free desmear process in additive circuitization 失效
标题翻译：甲基无氯化除垢工艺的加成电路
公开(公告)号：US5311660A
公开(公告)日：1994-05-17
申请号：US15742
申请日：1993-02-10
申请人： Warren A. Alpaugh , Anilkumar C. Bhatt , Michael J. Canestaro , Robert J. Day , Edmond O. Fey , John E. Larrabee
发明人： Warren A. Alpaugh , Anilkumar C. Bhatt , Michael J. Canestaro , Robert J. Day , Edmond O. Fey , John E. Larrabee
IPC分类号： H05K3/26 , H05K3/00 , H05K3/42 , H01K3/10
CPC分类号： H05K3/0055 , H05K2203/0783 , H05K2203/0789 , H05K2203/0796 , H05K2203/081 , H05K2203/088 , Y10T29/49165
摘要： Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution. The surface of the printed circuit board is then seeded, the intended circuitization is photolithographically defined on the printed circuit board, and the circuitization, including the surface circuitization and the plated through hole circuitization, is additively plated.
摘要翻译：公开了一种对印刷电路板进行钻孔，去除和附加电路化的方法。印刷电路板在产生玻璃和聚合物涂抹通孔和通孔的条件下钻孔。通过对钻孔的印刷电路板进行蒸气喷射除去颗粒物。接下来，将印刷电路板浸泡在溶剂中以使印刷电路板的电路插板上的钻头污迹膨胀。然后通过夹带在气体中除去该溶剂，并且将水性，酸性氧化溶液流通过印刷电路板孔，以除去通孔中的溶胀污迹并产生导体回蚀。在水冲洗之后，将水性还原溶液通过印刷电路板以减少并除去酸性氧化性水溶液，例如残留的酸性水溶液。漂洗印刷电路板以除去还原水溶液。然后将印刷电路板的表面接种，将预期的电路光刻地定义在印刷电路板上，并且包括表面电路化和电镀通孔电路的电路被附加电镀。

7. 发明授权

US5294259A Fluid treatment device 失效
标题翻译：流体处理装置
公开(公告)号：US5294259A
公开(公告)日：1994-03-15
申请号：US884818
申请日：1992-05-18
申请人： Michael J. Canestaro , Donald G. McBride , Louis J. Konrad, III , Ronald J. Moore
发明人： Michael J. Canestaro , Donald G. McBride , Louis J. Konrad, III , Ronald J. Moore
IPC分类号： C23F1/08 , B05C3/12 , B05C3/18 , B05C5/02 , C23G3/00 , H05K3/00 , H05K3/06 , H05K3/18 , H05K3/26 , H05K3/42 , B05C3/02
CPC分类号： B05C3/18 , B05C3/125 , H05K3/0085
摘要： A device for applying fluid to a substrate which includes a head member having first and second opposed portions adapted for being fixedly positioned relative to each other. The device is particularly suited for treating a substrate as the substrate moves between the first and second portions. Each portion may in turn include a first channel located at a predetermined distance from the substrate for having a first fluid impinge on the substrate at a first velocity. Additionally, each portion may include a weir adjacent the first channel for having fluid pass thereover at an accelerated rate and thus at a greater velocity than the first fluid, this weir being located at a lesser distance than the first channel. Fluid inlet means is coupled to the respective portions to provide the fluid thereto at desired velocities. Significantly, a fluid blocking means (e.g., an elongated bar) is also included as part of the structure for maintaining the fluids at pre-established levels.
摘要翻译：一种用于向衬底施加流体的装置，其包括具有适于相对于彼此固定定位的第一和第二相对部分的头部构件。当衬底在第一和第二部分之间移动时，该器件特别适用于处理衬底。每个部分还可以包括位于距衬底预定距离的第一通道，以使第一流体以第一速度冲击在衬底上。另外，每个部分可以包括与第一通道相邻的堰，用于使流体以加速的速度通过，因此以比第一流体更大的速度传递，该堰位于比第一通道更小的距离处。流体入口装置联接到相应的部分，以期望的速度向其提供流体。重要的是，还包括流体阻塞装置（例如，细长条）作为用于将流体保持在预先确定的水平的结构的一部分。

8. 发明授权

US4873123A Flexible electrical connection and method of making same 失效
标题翻译：灵活的电气连接及其制作方法
公开(公告)号：US4873123A
公开(公告)日：1989-10-10
申请号：US102447
申请日：1987-09-29
申请人： Michael J. Canestaro , William J. Summa
发明人： Michael J. Canestaro , William J. Summa
IPC分类号： H05K1/02 , H05K3/34 , H05K3/40
CPC分类号： H05K3/3442 , H05K1/0271 , H05K3/4092 , H05K2201/0394 , H05K2201/10727 , H05K2201/10757 , Y02P70/613
摘要： A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line attached to the surface of the organic substrate and having a floating terminus in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend, and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.
摘要翻译：用于将诸如由硅制成的半导体芯片的电子装置安装在诸如由浸渍有环氧树脂的玻璃材料制成的印刷电路板的有机基板上的柔性电连接和用于制造这种连接的方法，被披露。柔性电连接包括连接到有机衬底的表面上的电路线，并且在有机衬底的相对低的粘合区域中具有浮动端，其中希望将电子器件安装在有机衬底上。浮动终端包括应力消除弯曲，并且柔性电连接减轻诸如热应力的应力，否则当电子设备（例如，电子设备）可能会损坏电子设备与柔性电连接的浮动终端之间的物理和/或电连接安装在有机基板的表面上。

9. 发明授权

US4728751A Flexible electrical connection and method of making same 失效
标题翻译：灵活的电气连接及其制作方法
公开(公告)号：US4728751A
公开(公告)日：1988-03-01
申请号：US915485
申请日：1986-10-06
申请人： Michael J. Canestaro , William J. Summa
发明人： Michael J. Canestaro , William J. Summa
IPC分类号： H01L21/60 , H05K1/02 , H05K3/34 , H05K3/40
CPC分类号： H05K3/4092 , H05K1/0271 , H05K3/3442 , H05K2201/0394 , H05K2201/10727 , H05K2201/10757 , Y02P70/613
摘要： A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line attached to the surface of the organic substrate and having a floating terminus in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend, and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.
摘要翻译：用于将诸如由硅制成的半导体芯片的电子装置安装在诸如由浸渍有环氧树脂的玻璃材料制成的印刷电路板的有机基板上的柔性电连接和用于制造这种连接的方法，被披露。柔性电连接包括连接到有机衬底的表面上的电路线，并且在有机衬底的相对低的粘合区域中具有浮动端，其中希望将电子器件安装在有机衬底上。浮动终端包括应力消除弯曲，并且柔性电连接减轻诸如热应力的应力，否则当电子设备（例如，电子设备）可能会损坏电子设备与柔性电连接的浮动终端之间的物理和/或电连接安装在有机基板的表面上。

10. 发明授权

US4155775A Cleaning of high aspect ratio through holes in multilayer printed circuit boards 失效
标题翻译：通过多层印刷电路板中的孔清洁高纵横比
公开(公告)号：US4155775A
公开(公告)日：1979-05-22
申请号：US860033
申请日：1977-12-12
申请人： Warren A. Alpaugh , Michael J. Canestaro , Theron L. Ellis
发明人： Warren A. Alpaugh , Michael J. Canestaro , Theron L. Ellis
IPC分类号： H05K3/00 , B08B3/08
CPC分类号： H05K3/0055 , H05K2203/0783 , H05K2203/0789 , H05K2203/081 , H05K2203/088
摘要： A cleaning process for high aspect ratio through holes of multilayer printed circuit boards assures the removal of any loosened fiberous material or epoxy smears in the through holes and also provides an inverted "T" structure at the innerplanes of the internal conductive circuits within the printed circuit board sandwich. The inverted "T" structure helps to move the contact point between the plating of the through hole and the internal circuit lines further into the circuit board, thereby eliminating the "Z" stress at the edge of the innerplane. This process is accomplished by first vapor blasting the through holes, soaking the board in a suitable solvent to loosen any fibers or smears on the circuit innerplanes of the board, removing the excess solvent from the through holes and then feeding a unilateral stream of a cleaning solution through the holes, the cleaning solution operating to remove excess fibers and smears in the through holes and to produce a slight, uniform etchback of the metal innerplanes of the printed circuit boards. Thereafter, the solution may be reduced and any excess cleaning solution is removed.
摘要翻译：用于多层印刷电路板的高纵横比通孔的清洁方法确保去除通孔中任何松动的纤维材料或环氧树脂涂层，并且还在印刷电路内的内部导电电路的内平面上提供倒置的“T”结构板三明治倒置的“T”结构有助于将通孔的电镀和内部电路线之间的接触点进一步移动到电路板中，从而消除了内平面边缘处的“Z”应力。该过程是通过首先对通孔进行蒸汽喷射，将板浸入合适的溶剂中以松开板的回路内平面上的任何纤维或涂片，从通孔中除去多余的溶剂，然后将单一清洁流溶液通过孔，清洁溶液操作以除去多余的纤维和通孔中的污迹，并产生印刷电路板的金属内衬的轻微均匀的回蚀。此后，可以减少溶液并除去任何多余的清洁溶液。

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