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    • 1. 发明授权
    • Process for preparing clustered functional polyorganosiloxanes, and methods for their use
    • 聚簇功能聚有机硅氧烷的制备方法及其使用方法
    • US09593209B2
    • 2017-03-14
    • US13508375
    • 2010-11-03
    • Stanton DentKai SuLauren TongeJames Tonge
    • Stanton DentKai SuLauren TongeJames Tonge
    • C08G77/20C08G77/50C08L83/14
    • C08G77/50C08L83/14
    • A hydrosilylation process is used to prepare a polyorganosiloxane having clustered functional groups at the polyorganosiloxane chain terminals. The ingredients used in the process include a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule and at least 4 silicon bonded hydrogen atoms for each aliphatically unsaturated organic group in ingredient a), c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more curable groups; and d) a hydrosilylation catalyst. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.
    • 使用氢化硅烷化方法制备聚有机硅氧烷链末端具有聚簇官能团的聚有机硅氧烷。 在该方法中使用的成分包括a)每分子平均具有至少2个不饱和有机基团的聚有机硅氧烷,b)每个分子平均具有4至15个硅原子的平均有机硅氢氧化硅和每个分子具有至少4个硅键合的氢原子 成分a)中的脂族不饱和有机基团,c)每分子具有至少1个脂族不饱和有机基团和1个或更多个可固化基团的反应性物质; 和d)氢化硅烷化催化剂。 所得聚集的官能聚有机硅氧烷可用于电子应用的可固化硅氧烷组合物。
    • 4. 发明申请
    • Siloxanes and Silanes Cured by Organoborane Amine Complexes
    • 硅氧烷和由有机硼烷胺络合物固化的硅烷
    • US20070298223A1
    • 2007-12-27
    • US11792063
    • 2005-12-13
    • Cheryl LochDongchan AhnNick ShephardJames TongePatricia Olney
    • Cheryl LochDongchan AhnNick ShephardJames TongePatricia Olney
    • C08F230/06B32B3/00C08K5/55C09D183/04
    • C08F230/06C08K5/55C08L83/06Y10T428/24612C08L83/00C08L2666/28
    • Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.
    • 可固化组合物含有(i)可自由基聚合的有机硅单体,低聚物或聚合物; (ii)有机硼烷胺络合物; 任选地(iii)具有胺反应性基团的胺反应性化合物; 和(iv)当与含有活性氢和催化剂的化合物混合时能产生气体的组分。 可固化组合物可用作橡胶,胶带,粘合剂,泡沫,压敏粘合剂,保护涂层,薄膜,热塑性整体模制部件,热固性整体模制部件,密封剂,垫圈,密封件或O形环,模具附接胶 ,盖密封剂,密封剂,灌封化合物或保形涂层。 组合物还可以用于复合制品中,例如包括电气和电子连接器的整体结合的装置和水肺潜水面罩,其中将基材与组合物一起涂布或粘合在一起并固化。
    • 9. 发明授权
    • Dual curing polymers and methods for their preparation and use
    • 双固化聚合物及其制备和使用方法
    • US08168737B2
    • 2012-05-01
    • US12517220
    • 2007-12-10
    • Khristopher Edward AlvarezNick Evan ShephardJames Tonge
    • Khristopher Edward AlvarezNick Evan ShephardJames Tonge
    • C08G77/08
    • C08G77/14C08G77/50C08J3/243C08J2383/06C08J2383/14C08L83/06C08L83/14C09D183/14C08L2666/28
    • A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)d, (R1)f, and (R23SiO1/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1 is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.
    • 聚合物通过辐射和湿气固化机制固化。 聚合物通过氢化硅烷化制备。 该聚合物可用于粘合剂组合物。 聚合物包括式(I),(R 22 SiO 2/2)b,(R 2 SiO 3/2)c,(SiO 4/2)d,(R 1)f和(R 23 SiO 1/2)g的单元,其中每个R 1独立地为 氧原子或二价烃基; 每个R 1独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团,每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。