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    • 2. 发明授权
    • Fabricating method of complementary metal-oxide-semiconductor (CMOS) image sensor including p type gate structure
    • 包括p型栅极结构的互补金属氧化物半导体(CMOS)图像传感器的制造方法
    • US07776676B2
    • 2010-08-17
    • US11954194
    • 2007-12-11
    • Jhy-Jyi Sze
    • Jhy-Jyi Sze
    • H01L21/8238
    • H01L27/14643H01L27/14689
    • A method of fabricating a complementary metal-oxide-semiconductor image sensor is provided. First, a substrate having a photo sensitive region and a transistor device region is provided. A p type well in the substrate of the transistor device region is formed. A dielectric layer and an un-doped polysilicon layer on the substrate are sequentially formed. A n type polysilicon layer on a first portion of the transistor device region and a p type polysilicon layer on the photo sensitive region and on a second portion of the transistor device region are formed. The dielectric layer, the n type polysilicon layer and the p type polysilicon layer are patterned to form a plurality of n type gate structures and a p type gate structure on the p type well of the transistor device region. A photo sensitive diode is formed in the substrate of the photo sensitive region.
    • 提供一种制造互补金属氧化物半导体图像传感器的方法。 首先,提供具有光敏区域和晶体管器件区域的衬底。 形成在晶体管器件区域的衬底中的p型阱。 依次形成基板上的介质层和未掺杂多晶硅层。 形成晶体管器件区域的第一部分上的n型多晶硅层和在光敏区域和晶体管器件区域的第二部分上的p型多晶硅层。 图案化电介质层,n型多晶硅层和p型多晶硅层,以在晶体管器件区域的p型阱上形成多个n型栅极结构和p型栅极结构。 光敏二极管形成在感光区的基板中。
    • 9. 发明授权
    • Method of fabricating a DRAM capacitor
    • 制造DRAM电容器的方法
    • US06187629B1
    • 2001-02-13
    • US09206109
    • 1998-12-04
    • Jing-Horng GauHsiu-Wen HuangJhy-Jyi Sze
    • Jing-Horng GauHsiu-Wen HuangJhy-Jyi Sze
    • H01L218242
    • H01L28/84H01L21/76804H01L27/10852H01L28/90
    • A method of fabricating a DRAM capacitor. A conductive layer and an amorphous silicon layer are formed on a substrate having a dielectric layer. The amorphous silicon layer and the conductive layer are etched to form a region of a capacitor to expose a portion of the dielectric layer. An opening with a profile having a wider upper portion and a narrower lower portion is formed within the conductive layer, and through the opening, the dielectric layer is then etched through to form a node contact window to expose the substrate. An amorphous silicon spacer is formed on the sidewall of conductive layer of the region of the capacitor and fills the node contact window. A selective HSG-Si, a dielectric layer and a polysilicon layer are formed to achieve the fabrication of the capacitor. The conductive layer, the amorphous silicon layer and the HSG-Si serve as a lower electrode of the capacitor and the polysilicon layer serves as an upper electrode of the capacitor.
    • 一种制造DRAM电容器的方法。 在具有电介质层的基板上形成导电层和非晶硅层。 蚀刻非晶硅层和导电层以形成电容器的区域以暴露电介质层的一部分。 在导电层内形成具有较宽上部和较窄下部的轮廓的开口,然后通过该开口蚀刻通孔以形成节点接触窗以露出衬底。 在电容器区域的导电层的侧壁上形成非晶硅间隔物,并填充节点接触窗口。 形成选择性HSG-Si,电介质层和多晶硅层,以实现电容器的制造。 导电层,非晶硅层和HSG-Si用作电容器的下电极,多晶硅层用作电容器的上电极。