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    • 6. 发明授权
    • Fabricating method of complementary metal-oxide-semiconductor (CMOS) image sensor including p type gate structure
    • 包括p型栅极结构的互补金属氧化物半导体(CMOS)图像传感器的制造方法
    • US07776676B2
    • 2010-08-17
    • US11954194
    • 2007-12-11
    • Jhy-Jyi Sze
    • Jhy-Jyi Sze
    • H01L21/8238
    • H01L27/14643H01L27/14689
    • A method of fabricating a complementary metal-oxide-semiconductor image sensor is provided. First, a substrate having a photo sensitive region and a transistor device region is provided. A p type well in the substrate of the transistor device region is formed. A dielectric layer and an un-doped polysilicon layer on the substrate are sequentially formed. A n type polysilicon layer on a first portion of the transistor device region and a p type polysilicon layer on the photo sensitive region and on a second portion of the transistor device region are formed. The dielectric layer, the n type polysilicon layer and the p type polysilicon layer are patterned to form a plurality of n type gate structures and a p type gate structure on the p type well of the transistor device region. A photo sensitive diode is formed in the substrate of the photo sensitive region.
    • 提供一种制造互补金属氧化物半导体图像传感器的方法。 首先,提供具有光敏区域和晶体管器件区域的衬底。 形成在晶体管器件区域的衬底中的p型阱。 依次形成基板上的介质层和未掺杂多晶硅层。 形成晶体管器件区域的第一部分上的n型多晶硅层和在光敏区域和晶体管器件区域的第二部分上的p型多晶硅层。 图案化电介质层,n型多晶硅层和p型多晶硅层,以在晶体管器件区域的p型阱上形成多个n型栅极结构和p型栅极结构。 光敏二极管形成在感光区的基板中。