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    • 10. 发明授权
    • Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone
    • 具有多个气体注入区域的等离子体反应器装置,其具有用于每个区域的时变单独的可配置气体组成
    • US08231799B2
    • 2012-07-31
    • US11414026
    • 2006-04-28
    • Kallol BeraXiaoye ZhaoKenny L. DoanEzra Robert GoldPaul Lukas BrillhartBruno GeoffrionBryan PuDaniel J. Hoffman
    • Kallol BeraXiaoye ZhaoKenny L. DoanEzra Robert GoldPaul Lukas BrillhartBruno GeoffrionBryan PuDaniel J. Hoffman
    • H01L21/00C23C16/00
    • H01L21/3065H01J37/32082H01J37/3244H01J37/32449H01L21/31116
    • A plasma reactor for processing a workpiece such as a semiconductor wafer has a housing defining a process chamber, a workpiece support configured to support a workpiece within the chamber during processing and comprising a plasma bias power electrode. The reactor further includes plural gas sources containing different gas species, plural process gas inlets and an array of valves capable of coupling any of said plural gas sources to any of said plural process gas inlets. The reactor also includes a controller governing said array of valves and is programmed to change the flow rates of gases through said inlets over time. A ceiling plasma source power electrode of the reactor has plural gas injection zones coupled to the respective process gas inlets. In a preferred embodiment, the plural gas sources comprise supplies containing, respectively, fluorocarbon or fluorohydrocarbon species with respectively different ratios of carbon and fluorine chemistries. They further include an oxygen or nitrogen supply and a diluent gas supply. The controller is programmed to produce flow of different process gas species or mixtures thereof through different ones of said plural gas injection zones. The controller is further programmed to change over time the species content of the gases flowing through different ones of said plural gas injection zones.
    • 用于处理诸如半导体晶片的工件的等离子体反应器具有限定处理室的壳体,被配置为在处理期间支撑室内的工件并包括等离子体偏置功率电极的工件支撑件。 反应器还包括含有不同气体种类的多个气体源,多个处理气体入口和能够将所述多个气体源中的任一个耦合到所述多个处理气体入口中的任何一个的阀阵列。 反应器还包括控制所述阀阵列的控制器,并被编程为随时间改变通过所述入口的气体的流速。 反应器的天花板等离子体源功率电极具有耦合到各个工艺气体入口的多个气体注入区域。 在一个优选的实施方案中,多个气体源包括分别含有分别具有不同比例的碳和氟化学物质的碳氟化合物或氟代烃物质的物料。 它们还包括氧气或氮气供应和稀释气体供应。 控制器被编程为通过不同的所述多个气体注入区域产生不同工艺气体种类或其混合物的流动。 控制器进一步被编程为随时间改变流过不同的所述多个气体注入区域的气体的物质含量。