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    • 1. 发明授权
    • Chemical mechanical polishing system
    • 化学机械抛光系统
    • US08882563B2
    • 2014-11-11
    • US13095404
    • 2011-04-27
    • Jae Phil BooDong Soo KimKeon Sik SeoChan Woon JeonJun Ho BanJa Cheul Goo
    • Jae Phil BooDong Soo KimKeon Sik SeoChan Woon JeonJun Ho BanJa Cheul Goo
    • B24B49/00B24B5/00B24B37/30B24B37/34
    • B24B37/345B24B37/30
    • The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
    • 本发明涉及一种化学机械抛光系统,包括:至少一个抛光盘,其可旋转地安装有安装在其上表面上的压板; 沿预定路径设置的导轨; 衬底载体单元,其包括旋转接头,用于在抛光过程中向基板施加压力,所述衬底载体单元沿着所述导轨移动并加载所述衬底; 以及对接单元,其安装成对接到基板载体单元,以便当基板载体单元位于抛光平台上时,向压缩由基板承载单元保持的基板向下挤压的旋转接头提供空气压力,由此即使 衬底载体单元移动以连续地抛光多个抛光平板上的衬底,基本上消除了由于衬底载体单元的运动引起的空气压力供应管的扭转现象。
    • 4. 发明申请
    • Apparatus and method for treating susbtrates
    • 用于治疗感染的装置和方法
    • US20050153557A1
    • 2005-07-14
    • US11036865
    • 2005-01-13
    • Chan-Woo ChoJae-Phil BooMyung-Seok KimJong-Muk KangIk-Joo KimJung-Hwan SungKi-Hong JungKeon-Sik Seo
    • Chan-Woo ChoJae-Phil BooMyung-Seok KimJong-Muk KangIk-Joo KimJung-Hwan SungKi-Hong JungKeon-Sik Seo
    • B24B37/013B24B37/04B24B49/03H01L21/304H01L21/306H01L21/302H01L21/461
    • B24B49/03B24B37/013B24B37/042
    • The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and more particularly to a polishing apparatus having a workpiece transfer robot for transferring a workpiece from one operation to the next. The polishing apparatus according to the present invention comprises a polishing section including a top ring for holding a workpiece to be polished and a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring; a cleaning section including a cleaning device for cleaning the workpiece that has been polished in the polishing section; and a workpiece transfer robot for transferring the workpiece to be polished to the polishing section or for transferring the workpiece that has been polished to the cleaning section. In this case, the workpiece transfer robot comprises a robot body; at least one arm operatively coupled to the robot body by at least one joint; a holder mechanism mounted on the arm for holding the workpiece; and a seal mechanism at the joint for preventing liquid from entering an interior of the joint, the seal mechanism
    • 本发明涉及一种用于将诸如半导体晶片的工件抛光到平面镜面抛光的抛光装置,更具体地涉及具有用于将工件从一个操作传送到下一个操作的工件传送机器人的抛光装置。 根据本发明的抛光装置包括抛光部分,其包括用于保持待抛光工件的顶环和具有抛光表面的转台,用于抛光由顶环保持的工件的表面; 清洁部,其包括用于清洁在所述研磨部中被抛光的所述工件的清洁装置; 以及工件传送机器人,用于将要抛光的工件传送到抛光部分或用于将已抛光的工件传送到清洁部分。 在这种情况下,工件传送机器人包括机器人主体; 至少一个臂通过至少一个接头可操作地联接到所述机器人主体; 安装在所述臂上用于保持所述工件的保持器机构; 和密封机构,用于防止液体进入接头的内部,密封机构
    • 7. 发明申请
    • CHEMICAL MECHANICAL POLISHING SYSTEM
    • 化学机械抛光系统
    • US20110269378A1
    • 2011-11-03
    • US13095404
    • 2011-04-27
    • Jae Phil BooDong Soo KimKeon Sik SeoChan Woon JeonJun Ho BanJa Cheul Goo
    • Jae Phil BooDong Soo KimKeon Sik SeoChan Woon JeonJun Ho BanJa Cheul Goo
    • B24B37/04B24B1/00
    • B24B37/345B24B37/30
    • The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
    • 本发明涉及一种化学机械抛光系统,包括:至少一个抛光盘,其可旋转地安装有安装在其上表面上的压板; 沿预定路径设置的导轨; 衬底载体单元,其包括旋转接头,用于在抛光过程中向基板施加压力,所述衬底载体单元沿着所述导轨移动并加载所述衬底; 以及对接单元,其安装成对接到基板载体单元,以便当基板载体单元位于抛光平台上时,向压缩由基板承载单元保持的基板向下挤压的旋转接头提供空气压力,由此即使 衬底载体单元移动以连续地抛光多个抛光平板上的衬底,基本上消除了由于衬底载体单元的运动引起的空气压力供应管的扭转现象。