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1. 发明授权

US07196011B2 Apparatus and method for treating substrates 有权
标题翻译：用于处理底物的装置和方法
公开(公告)号：US07196011B2
公开(公告)日：2007-03-27
申请号：US11036865
申请日：2005-01-13
申请人： Chan-Woo Cho , Jae-Phil Boo , Myung-Seok Kim , Jong-Muk Kang , Ik-Joo Kim , Jung-Hwan Sung , Ki-Hong Jung , Keon-Sik Seo
发明人： Chan-Woo Cho , Jae-Phil Boo , Myung-Seok Kim , Jong-Muk Kang , Ik-Joo Kim , Jung-Hwan Sung , Ki-Hong Jung , Keon-Sik Seo
IPC分类号： H01L21/469
CPC分类号： B24B49/03 , B24B37/013 , B24B37/042
摘要： The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and more particularly to a polishing apparatus having a workpiece transfer robot for transferring a workpiece from one operation to the next.The polishing apparatus according to the present invention comprises a polishing section including a top ring for holding a workpiece to be polished and a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring; a cleaning section including a cleaning device for cleaning the workpiece that has been polished in the polishing section; and a workpiece transfer robot for transferring the workpiece to be polished to the polishing section or for transferring the workpiece that has been polished to the cleaning section. In this case, the workpiece transfer robot comprises a robot body; at least one arm operatively coupled to the robot body by at least one joint; a holder mechanism mounted on the arm for holding the workpiece; and a seal mechanism at the joint for preventing liquid from entering an interior of the joint, the seal mechanism.
摘要翻译：本发明涉及一种用于将诸如半导体晶片的工件抛光到平面镜面抛光的抛光装置，更具体地涉及具有用于将工件从一个操作传送到下一个操作的工件传送机器人的抛光装置。

2. 发明申请

US20050153557A1 Apparatus and method for treating susbtrates 有权
标题翻译：用于治疗感染的装置和方法
公开(公告)号：US20050153557A1
公开(公告)日：2005-07-14
申请号：US11036865
申请日：2005-01-13
申请人： Chan-Woo Cho , Jae-Phil Boo , Myung-Seok Kim , Jong-Muk Kang , Ik-Joo Kim , Jung-Hwan Sung , Ki-Hong Jung , Keon-Sik Seo
发明人： Chan-Woo Cho , Jae-Phil Boo , Myung-Seok Kim , Jong-Muk Kang , Ik-Joo Kim , Jung-Hwan Sung , Ki-Hong Jung , Keon-Sik Seo
IPC分类号： B24B37/013 , B24B37/04 , B24B49/03 , H01L21/304 , H01L21/306 , H01L21/302 , H01L21/461
CPC分类号： B24B49/03 , B24B37/013 , B24B37/042
摘要： The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and more particularly to a polishing apparatus having a workpiece transfer robot for transferring a workpiece from one operation to the next. The polishing apparatus according to the present invention comprises a polishing section including a top ring for holding a workpiece to be polished and a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring; a cleaning section including a cleaning device for cleaning the workpiece that has been polished in the polishing section; and a workpiece transfer robot for transferring the workpiece to be polished to the polishing section or for transferring the workpiece that has been polished to the cleaning section. In this case, the workpiece transfer robot comprises a robot body; at least one arm operatively coupled to the robot body by at least one joint; a holder mechanism mounted on the arm for holding the workpiece; and a seal mechanism at the joint for preventing liquid from entering an interior of the joint, the seal mechanism
摘要翻译：本发明涉及一种用于将诸如半导体晶片的工件抛光到平面镜面抛光的抛光装置，更具体地涉及具有用于将工件从一个操作传送到下一个操作的工件传送机器人的抛光装置。根据本发明的抛光装置包括抛光部分，其包括用于保持待抛光工件的顶环和具有抛光表面的转台，用于抛光由顶环保持的工件的表面; 清洁部，其包括用于清洁在所述研磨部中被抛光的所述工件的清洁装置; 以及工件传送机器人，用于将要抛光的工件传送到抛光部分或用于将已抛光的工件传送到清洁部分。在这种情况下，工件传送机器人包括机器人主体; 至少一个臂通过至少一个接头可操作地联接到所述机器人主体; 安装在所述臂上用于保持所述工件的保持器机构; 和密封机构，用于防止液体进入接头的内部，密封机构

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