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    • 4. 发明授权
    • Multilayer wiring substrate
    • 多层布线基板
    • US07575442B2
    • 2009-08-18
    • US12076014
    • 2008-03-12
    • Eiji OgataKazunori OmoriKoichi NamimatsuKazunari Fukagawa
    • Eiji OgataKazunori OmoriKoichi NamimatsuKazunari Fukagawa
    • H01R12/06
    • H05K3/4046H05K3/3447H05K2201/0133H05K2201/09645H05K2201/1059
    • A first wiring pattern formed on a first layer of a multilayer wiring substrate, a second wiring pattern formed on a layer different from the first layer on which the first wiring pattern is formed, a penetration hole penetrating the front surface and the back surface of the substrate, and a penetration hole penetrating a front surface and a back surface of the substrate; and a fitting connector having a conductor part on a side surface inscribed in the penetration hole and fitting into the penetration hole are provided. The first wiring pattern and the second wiring pattern are exposed from the internal surface of the penetration hole, and the fitting connector connects a first end part of the conductor part and a second end part with an exposed part of the first wiring pattern and an exposed part of the second wiring pattern, respectively.
    • 形成在多层布线基板的第一层上的第一布线图案,形成在与形成有第一布线图案的第一层不同的层上的第二布线图案,穿透第一布线图案的前表面和后表面的穿透孔 基板和穿透基板的前表面和后表面的穿透孔; 以及配合连接器,其具有位于贯通孔内侧的嵌合于贯通孔的侧面的导体部。 第一布线图案和第二布线图案从穿孔的内表面露出,并且嵌合连接器将导体部分的第一端部和第二端部与第一布线图案的露出部分连接, 分别是第二布线图案的一部分。
    • 7. 发明申请
    • Multilayer wiring substrate
    • 多层布线基板
    • US20080227312A1
    • 2008-09-18
    • US12076014
    • 2008-03-12
    • Eiji OgataKazunori OmoriKoichi NamimatsuKazunari Fukagawa
    • Eiji OgataKazunori OmoriKoichi NamimatsuKazunari Fukagawa
    • H01R12/06
    • H05K3/4046H05K3/3447H05K2201/0133H05K2201/09645H05K2201/1059
    • A first wiring pattern formed on a first layer of a multilayer wiring substrate, a second wiring pattern formed on a layer different from the first layer on which the first wiring pattern is formed, a penetration hole penetrating the front surface and the back surface of the substrate, and a penetration hole penetrating a front surface and a back surface of the substrate; and a fitting connector having a conductor part on a side surface inscribed in the penetration hole and fitting into the penetration hole are provided. The first wiring pattern and the second wiring pattern are exposed from the internal surface of the penetration hole, and the fitting connector connects a first end part of the conductor part and a second end part with an exposed part of the first wiring pattern and an exposed part of the second wiring pattern, respectively.
    • 形成在多层布线基板的第一层上的第一布线图案,形成在与形成有第一布线图案的第一层不同的层上的第二布线图案,穿透第一布线图案的前表面和后表面的穿透孔 基板和穿透基板的前表面和后表面的穿透孔; 以及配合连接器,其具有位于贯通孔内侧的嵌合于贯通孔的侧面的导体部。 第一布线图案和第二布线图案从穿孔的内表面露出,并且嵌合连接器将导体部的第一端部和第二端部与第一布线图案的露出部分连接, 分别是第二布线图案的一部分。