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    • 3. 发明授权
    • Controller circuitry with state machines, address store/compare, and shift register
    • 具有状态机的控制器电路,地址存储/比较和移位寄存器
    • US08910003B2
    • 2014-12-09
    • US14297051
    • 2014-06-05
    • Lee D. Whetsel
    • Lee D. Whetsel
    • G01R31/28G01R31/3177
    • G01R31/31723G01R31/31722G01R31/31725G01R31/31727G01R31/3177G01R31/318572G06F11/261G06F11/267G06F11/27G06F11/3466
    • An address and command port interface selectively enables JTAG TAP domain operations and Trace domain operations within an IC. The port carries TMS and TDI input and TDO output on a single pin and receives a clock signal on a separate pin. The addressable two pin interface loads and updates instructions and data to the TAP domain within the IC. The instruction or data update operations in multiple ICs occur simultaneously. A process transmits data from an addressed target device to a controller using data frames, each data frame comprising a header bit and data bits. The logic level of the header bit is used to start, continue, and stop the data transmission to the controller. A data and clock signal interface between a controller and multiple target devices provides for each target device to be individually addressed and commanded to perform a JTAG or Trace operation.
    • 地址和命令端口接口选择性地启用IC内的JTAG TAP域操作和跟踪域操作。 端口在单个引脚上承载TMS和TDI输入和TDO输出,并在单独的引脚上接收时钟信号。 可寻址的两个引脚接口将指令和数据加载并更新到IC内的TAP域。 多个IC中的指令或数据更新操作同时发生。 过程使用数据帧将数据从寻址的目标设备发送到控制器,每个数据帧包括报头位和数据位。 标头位的逻辑电平用于启动,继续和停止向控制器传输数据。 控制器和多个目标设备之间的数据和时钟信号接口提供每个目标设备被单独寻址并命令执行JTAG或跟踪操作。
    • 4. 发明授权
    • IC dies with serarate connections to expected and mask data
    • IC死亡与预期和掩模数据的serarate连接
    • US08604475B2
    • 2013-12-10
    • US13629854
    • 2012-09-28
    • Lee D. WhetselAlan Hales
    • Lee D. WhetselAlan Hales
    • H01L23/58
    • G01R31/3177G01R1/07342G01R31/318536G01R31/318541G01R31/318544G01R31/318547G01R31/318555G01R31/318558G01R31/318563G01R31/318566G01R31/318572G01R31/31924G01R31/31926
    • Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.
    • 位于半导体管芯上的测试电路使得测试仪能够通过将激励和响应模式输入到多个管芯/ IC来并行地测试多个管芯/ IC。 来自测试器的响应模式与待比较的芯片/ IC的输出响应一起输入到测试电路。 还公开了使用响应信号编码方案,其中测试者使用每个测试电路的单个信号向测试电路发送响应测试命令,以执行:(1)比较管芯/ IC输出与期望的逻辑高( 2)比较管芯/ IC输出与预期逻辑低电平,以及(3)掩模比较操作。 信号编码方案的使用允许对芯片和IC进行功能测试,因为每个管芯/ IC输出所需的所有响应测试命令(即1-3以上)可以仅使用单个测试仪信号连接传输到每个管芯/ IC输出 芯片/ IC输出。 除功能测试外,还可以对芯片和IC进行扫描测试。
    • 9. 发明授权
    • Receiving control signals and operating separate scan paths with adaptor
    • 接收控制信号并用适配器操作单独的扫描路径
    • US08392774B2
    • 2013-03-05
    • US13167418
    • 2011-06-23
    • Lee D. Whetsel
    • Lee D. Whetsel
    • G01R31/28
    • G01R31/318536G01R31/31721G01R31/31723G01R31/3177G01R31/318575G01R31/318577
    • Scan architectures are commonly used to test digital circuitry in integrated circuits. The present disclosure describes a method of adapting conventional scan architectures into a low power scan architecture. The low power scan architecture maintains the test time of conventional scan architectures, while requiring significantly less operational power than conventional scan architectures. The low power scan architecture is advantageous to IC/die manufacturers since it allows a larger number of circuits (such as DSP or CPU core circuits) embedded in an IC/die to be tested in parallel without consuming too much power within the IC/die. Since the low power scan architecture reduces test power consumption, it is possible to simultaneously test more die on a wafer than previously possible using conventional scan architectures. This allows wafer test times to be reduced which reduces the manufacturing cost of each die on the wafer.
    • 扫描架构通常用于测试集成电路中的数字电路。 本公开描述了将常规扫描架构适应成低功耗扫描架构的方法。 低功耗扫描架构保持常规扫描架构的测试时间,同时要求比传统扫描架构明显更少的运行能力。 低功耗扫描架构对于IC /模具制造商是有利的,因为它允许并行测试嵌入在IC /管芯中的更多数量的电路(例如DSP或CPU核心电路),而不会消耗IC /管芯内的太多功率 。 由于低功耗扫描架构降低了测试功耗,因此可以使用传统的扫描架构在以前可能的同时测试晶片上的更多裸片。 这允许减少晶片测试时间,这降低了晶片上每个芯片的制造成本。