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1. 发明授权

US07405469B2 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07405469B2
公开(公告)日：2008-07-29
申请号：US11783919
申请日：2007-04-13
申请人： Hidemasa Kagii , Akira Muto , Ichio Shimizu , Katsuo Arai , Hiroshi Sato , Hiroyuki Nakamura , Masahiko Osaka , Takuya Nakajo , Keiichi Okawa , Hiroi Oka
发明人： Hidemasa Kagii , Akira Muto , Ichio Shimizu , Katsuo Arai , Hiroshi Sato , Hiroyuki Nakamura , Masahiko Osaka , Takuya Nakajo , Keiichi Okawa , Hiroi Oka
IPC分类号： H01L23/495
CPC分类号： H01L23/24 , H01L21/52 , H01L23/488 , H01L23/49562 , H01L24/36 , H01L24/40 , H01L2224/05155 , H01L2224/05166 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/05624 , H01L2224/05644 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals 6G, 6S via connection materials 5b, 5c. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals 6G, 6S being exposed. Mounting surfaces of the metal plate terminals 6G, 6S and a third part of the metal cap are bonded to electrodes on a mounting board 10 via connection materials 5e, 5f and 5g.
摘要翻译：半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。在与半导体芯片的第一表面相对的第二表面上形成栅电极和源电极，并且栅电极和源电极通过连接材料5b，5c连接金属板端子6G，6S 。此外，半导体芯片由金属板端子6G，6S的露出的安装面的树脂密封体密封。金属板端子6G，6S和金属盖的第三部分的安装表面通过连接材料5e，5f和5g与安装板10上的电极接合。

2. 发明授权

US07381032B2 Hermetic compressor and freezing air-conditioning system 有权
标题翻译：密封压缩机和冷冻空调系统
公开(公告)号：US07381032B2
公开(公告)日：2008-06-03
申请号：US10432028
申请日：2001-11-26
申请人： Masahiko Osaka , Hidetoshi Nishihara , Toshihiko Ota , Akihiko Kubota , Manabu Motegi , Hiroki Awashima , Takeshi Kojima , Kazuhito Noguchi , Ichiro Kita , Masahiro Kakutani
发明人： Masahiko Osaka , Hidetoshi Nishihara , Toshihiko Ota , Akihiko Kubota , Manabu Motegi , Hiroki Awashima , Takeshi Kojima , Kazuhito Noguchi , Ichiro Kita , Masahiro Kakutani
IPC分类号： F04B39/00 , F01N1/02 , F02M35/00
CPC分类号： F04B39/0055
摘要： In a hermetic compressor in a freezing refrigerating system or an air-conditioning system such as a refrigerator or a showcase, a construction is disclosed for intending to provide a low-noise hermetic compressor by effectively attenuating a pressure pulsation having occurred in a compression chamber with a suction muffler. By this construction, since a muffler cover 20 has a planar simple shape, the deformation upon molding becomes little and it can come into fully close contact with a muffler main body 19. Therefore, the pressure pulsation hardly leaks through the connecting portion between the muffler main body 19 and the muffler cover 20. The full silencing effect that the suction muffler 18 has is obtained and thereby noise can be reduced more effectively.
摘要翻译：在冷冻冷藏系统的封闭式压缩机或冷藏库或陈列柜等空调系统中，公开了一种旨在通过有效地衰减在压缩室中产生的压力脉动来提供低噪声封闭式压缩机的结构，吸气消声器。通过这种结构，由于消音器盖20具有平面简单的形状，所以成型时的变形很小，并且可以与消音器主体19完全紧密接触。因此，压力脉动几乎不会通过消音器主体19和消声器盖20之间的连接部分泄漏。获得吸入消声器18具有的完全消音效果，从而可以更有效地降低噪音。

3. 发明申请

US20060177967A1 Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20060177967A1
公开(公告)日：2006-08-10
申请号：US11348362
申请日：2006-02-07
申请人： Akira Muto , Ichio Shimizu , Katsuo Arai , Hidemasa Kagii , Hiroshi Sato , Hiroyuki Nakamura , Takuya Nakajo , Keiichi Okawa , Masahiko Osaka
发明人： Akira Muto , Ichio Shimizu , Katsuo Arai , Hidemasa Kagii , Hiroshi Sato , Hiroyuki Nakamura , Takuya Nakajo , Keiichi Okawa , Masahiko Osaka
IPC分类号： H01L21/50
CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49537 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/84 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor device in the form of a resin sealed semiconductor package is disclosed, wherein a gate terminal connected to a gate pad electrode formed on a surface of a semiconductor chip and a source terminal connected to a source pad electrode formed on the chip surface exposed to a back surface of a sealing resin portion, a first portion of a drain terminal connected to a back-surface drain electrode of the semiconductor chip is exposed to an upper surface of the sealing resin portion, and a second portion of the drain terminal formed integrally with the first portion of the drain terminal is exposed to the back surface of the sealing resin portion. When forming the sealing resin portion in such a semiconductor device, first the sealing resin portion is formed so as to also cover an upper surface of the first portion of the drain terminal and thereafter the upper surface side of the sealing resin portion is polished by liquid honing, thereby allowing the upper surface of the first portion of the drain terminal to be exposed on the upper surface of the sealing resin portion. Both heat dissipating property and production yield of the semiconductor device are improved.
摘要翻译：公开了一种树脂密封半导体封装形式的半导体器件，其中连接到形成在半导体芯片的表面上的栅极焊盘电极的栅极端子和连接到形成在芯片表面上的源极焊盘电极的源极端子暴露于密封树脂部分的背面，连接到半导体芯片的背面漏电极的漏极端子的第一部分暴露于密封树脂部分的上表面，并且漏极端子的第二部分整体地形成漏极端子的第一部分暴露于密封树脂部分的背面。当在这种半导体器件中形成密封树脂部分时，首先形成密封树脂部分，以便也覆盖漏极端子的第一部分的上表面，此后密封树脂部分的上表面侧被液体从而允许排水端子的第一部分的上表面暴露在密封树脂部分的上表面上。改善了半导体器件的散热性能和生产成本。

4. 发明授权

US07021425B2 Closed type electric compressor 失效
公开(公告)号：US07021425B2
公开(公告)日：2006-04-04
申请号：US10276942
申请日：2001-05-30
申请人： Kazuhito Noguchi , Akihiko Kubota , Masahiko Osaka , Manabu Motegi , Hidetoshi Nishihara
发明人： Kazuhito Noguchi , Akihiko Kubota , Masahiko Osaka , Manabu Motegi , Hidetoshi Nishihara
IPC分类号： F04C29/02
CPC分类号： F04B39/0253
摘要： A sealed electric compressor for use in, for example, an electric refrigerator, generates a little noise and can feed any moving part of its compressing element with refrigerator lubricant. An oil pickup tube is joined by insertion to the lowermost end of a crank shaft and includes a first centrifugal pumping portion and a second centrifugal pumping portion provided continuously and arranged at a smaller angle than that of the first centrifugal pumping portion. The second centrifugal pumping portion arranged at a smaller angle can spin in a pool of the refrigerator lubricant.

5. 发明授权

US06688856B1 Suction muffler for a hermetic compressor 有权
标题翻译：用于封闭式压缩机的吸气消声器
公开(公告)号：US06688856B1
公开(公告)日：2004-02-10
申请号：US09959868
申请日：2002-02-04
申请人： Manabu Motegi , Masahiko Osaka , Akihiko Kubota , Masahiro Kakutani
发明人： Manabu Motegi , Masahiko Osaka , Akihiko Kubota , Masahiro Kakutani
IPC分类号： F04B3900
CPC分类号： F04B39/0072
摘要： A closed motor-driven compressor includes a compression component (2) and an electric component (3) for driving the compression component (2), both of which are elastically supported within a closed vessel (1). A suction muffler (8) is mounted on the compression component (2) and includes a plurality of elements (10, 11, 12; 14, 15, 16; 18, 19, 20; 22, 23, 24; 26, 27, 28) assembled together and each made of synthetic resin. One of the plurality of elements (10, 11, 12; 14, 15, 16; 18, 19, 20; 22, 23, 24; 26, 27, 28) has a guide rib (13; 17; 21) integrally formed therewith that is tapered down toward an adjoining one of the plurality of elements (10, 11, 12; 14, 15, 16; 18, 19, 20; 22, 23, 24; 26, 27, 28), thereby facilitating assembly of the two elements.
摘要翻译：封闭的电动压缩机包括压缩部件（2）和用于驱动压缩部件（2）的电气部件（3），两者均弹性地支撑在密闭容器（1）内。吸入消声器（8）安装在压缩部件（2）上并且包括多个元件（10,11,12; 14,15,16; 18,19,20; 28）组装在一起，每个由合成树脂制成。多个元件（10,11,12; 14,15,16; 18,19,20; 22,23,24,26,27,28）中的一个具有一体形成的导向肋（13; 17; 21）从而沿着多个元件（10,11,12; 14,15,16; 18,19,20,22,23,24,26,27,28）中的相邻的一个元件向下逐渐变细，由此有利于组装两个要素。

6. 发明授权

US06632881B1 Encapsulant of epoxy resin and liquid aromatic amine curing agent 有权
标题翻译：环氧树脂和液体芳香胺固化剂的包封剂
公开(公告)号：US06632881B1
公开(公告)日：2003-10-14
申请号：US09526529
申请日：2000-03-16
申请人： Satoru Tsuchida , Masahiko Osaka , Masatsugu Ogata
发明人： Satoru Tsuchida , Masahiko Osaka , Masatsugu Ogata
IPC分类号： C08K336
CPC分类号： H01L23/293 , C08G59/5033 , C08L21/00 , C08L63/00 , H01L24/50 , H01L2924/12044 , H01L2924/1301 , H01L2924/14 , H01L2924/351 , C08L2666/24 , H01L2924/00
摘要： An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.
摘要翻译：包含在常温下为液态的环氧树脂的封装环氧树脂组合物，含有常温液体的芳香胺，无机填料和橡胶颗粒的固化剂; 包含该组合物的密封剂; 以及具有包含该密封剂的固化产物的封装构件的电子器件

7. 发明授权

US5985954A Epoxy resin composition for sealing photo-semiconductor element and photo-semiconductor device sealed with the epoxy resin composition 失效
标题翻译：用于密封光半导体元件的环氧树脂组合物和用环氧树脂组合物密封的光电半导体器件
公开(公告)号：US5985954A
公开(公告)日：1999-11-16
申请号：US985208
申请日：1997-12-02
申请人： Satoru Tsuchida , Masahiko Osaka
发明人： Satoru Tsuchida , Masahiko Osaka
IPC分类号： C08L63/00 , C08G59/40 , C08K3/34 , C08L63/02 , C08L83/12 , H01L23/29 , H01L23/31 , H01L31/02 , H01L33/56
CPC分类号： C08L63/00
摘要： An epoxy resin composition for sealing a photo-semiconductor element, comprising(A) an epoxy resin,(B) a curing agent and(C) a polyether-modified silicone oil which is represented by the following general formula (1) ##STR1## wherein m, n and a are each independently a number of 1 or more, b is 0 or a positive number, and R is an alkyl group of 1 to 6 carbon atoms or H,and has a weight average molecular weight of 1,000 to 100,000, a silicone unit content {[(m+n+2)/(m+n+2+a+b+1)].times.100} of 10 to 60% and a polyether unit content {[(a+b+1)/(m+n+2+a+b+1)].times.100} of 40 to 90%and a photo-semiconductor device produced by sealing a photo-semiconductor element with the epoxy resin composition.
摘要翻译：一种用于密封光半导体元件的环氧树脂组合物，其包含（A）环氧树脂，（B）固化剂和（C）由以下通式（1）表示的聚醚改性的硅油，其中m， n和a各自独立地为1或更多数，b为0或正数，R为1至6个碳原子的烷基或H，重均分子量为1,000至100,000，硅氧烷单位含量{[（m + n + 2）/（m + n + 2 + a + b + 1）]×100}为10〜60％，聚醚单元含量{[（a + b + 1）/（m + n + 2 + a + b + 1）]×100}为40〜90％，通过用环氧树脂组合物密封光半导体元件而制造的光电半导体装置。

8. 发明授权

US5661440A PLL frequency synthesizer employing plural control frequencies to minimize overshoot 失效
标题翻译： PLL频率合成器采用多个控制频率以最小化过冲
公开(公告)号：US5661440A
公开(公告)日：1997-08-26
申请号：US437059
申请日：1995-05-09
申请人： Masahiko Osaka
发明人： Masahiko Osaka
IPC分类号： H03L7/183 , H03L7/10 , H03L7/197 , H03L7/18
CPC分类号： H03L7/1972
摘要： To switch a frequency of an output signal of a voltage controlled oscillator from a first frequency to a second frequency, a controller provides to a variable frequency divider such a frequency divisor that the voltage controlled oscillator produces a signal having a predetermined frequency ranging between the first and second frequencies. When the detected frequency of the signal output by the voltage controlled oscillator reaches a predetermined frequency, the controller changes the frequency divisor provided to the variable frequency divider to such a frequency divisor that the voltage controlled oscillator produces a signal having the second frequency.
摘要翻译：为了将压控振荡器的输出信号的频率从第一频率切换到第二频率，控制器向可变分频器提供频率除数器，使得压控振荡器产生具有在第一频率之间的预定频率的信号和第二频率。当由压控振荡器输出的信号的检测频率达到预定频率时，控制器将提供给可变分频器的频率除数器改变为压控振荡器产生具有第二频率的信号的频率除数。

9. 发明授权

US5252039A Enclosed motor-driven compressor 失效
标题翻译：封闭式电动压缩机
公开(公告)号：US5252039A
公开(公告)日：1993-10-12
申请号：US801567
申请日：1991-12-02
申请人： Masao Mangyo , Hideki Kawai , Satoshi Wada , Masahiko Osaka
发明人： Masao Mangyo , Hideki Kawai , Satoshi Wada , Masahiko Osaka
IPC分类号： F01M1/06 , F04B39/00 , F04B39/02
CPC分类号： F01M1/06 , F04B39/0094 , F04B39/0238
摘要： An enclosed motor-driven compressor includes a vertical crankshaft rotatably supported by two ball bearings and having an eccentric portion through which a motor element and a compressor element are operatively connected. The two ball bearings are disposed on opposite sides of the eccentric portion so that a reaction force of a piston which is exerted on the eccentric portion is supported evenly by the ball bearings. With the ball bearings thus arranged, the load on the crankshaft is lowered and the efficiency of the motor element is increased. A lubricating oil held at the bottom of a container is sucked through an internal groove of the crankshaft and then supplied from outlets to the respective ball bearings. The ball bearings thus lubricated have a prolonged service life. The compressor may have an oil sump disposed either above or below the ball bearing for improving lubricating condition of the ball bearing.

10. 发明申请

US20110237300A1 CELLULAR PHONE 失效
标题翻译：手机
公开(公告)号：US20110237300A1
公开(公告)日：2011-09-29
申请号：US12671844
申请日：2008-08-12
申请人： Masahiko Osaka
发明人： Masahiko Osaka
IPC分类号： H04W88/02
CPC分类号： H04M1/22 , G02B6/0081 , H04M1/0225 , H04M1/0233 , H04M1/0235 , H04M1/0241
摘要： A cellular phone of the present invention comprises upper housing 10 and lower housing 20 connected together for displacement relative to each other. Upper housing 10 incorporates liquid crystal unit 30 which includes light source 35 and liquid crystal panel 34 illuminated by light emitted from light source 35. Lower housing 20 incorporates an input device. Upper housing 10 comprises slit 13 which communicates with the interior and exterior of upper housing 10, and light guide means for guiding light emitted from light source 35 to slit 35. Operating unit 21 of the input device arranged on lower housing 20 is illuminated by light which is guided by the light guide means and which is emitted to the outside of upper housing 10 through slit 13.
摘要翻译：本发明的便携式电话机包括连接在一起以便相对于彼此移位的上壳体10和下壳体20。上壳体10包括液晶单元30，其包括由光源35和由从光源35发射的光照射的液晶面板34.下壳体20包括输入装置。上壳体10包括与上壳体10的内部和外部连通的狭缝13和用于将从光源35发射的光引导到狭缝35的导光装置。布置在下壳体20上的输入装置的操作单元21被光照射其由导光装置引导，并且通过狭缝13发射到上壳体10的外部。

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