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1. 发明授权

US09076892B2 Method of producing semiconductor module and semiconductor module 有权
标题翻译：半导体模块和半导体模块的制造方法
公开(公告)号：US09076892B2
公开(公告)日：2015-07-07
申请号：US13470029
申请日：2012-05-11
申请人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
发明人： Takae Sakai , Masahiro Murakami , Masahiko Kushino , Yoshihisa Amano , Shinichi Tokuno
IPC分类号： H01L21/78 , H01L23/00 , H01L23/31 , H01L23/552 , H01L25/065
CPC分类号： H01L23/60 , H01L21/563 , H01L21/78 , H01L23/3121 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01065 , H01L2924/014 , H01L2924/12042 , H01L2924/1421 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.
摘要翻译：为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

2. 发明授权

US08846180B2 Retardation film 有权
标题翻译：延迟膜
公开(公告)号：US08846180B2
公开(公告)日：2014-09-30
申请号：US13128091
申请日：2009-11-06
申请人： Hideaki Nitta , Junichi Shibata , Atsushi Sasaki , Masahiro Murakami
发明人： Hideaki Nitta , Junichi Shibata , Atsushi Sasaki , Masahiro Murakami
IPC分类号： B32B3/00 , B29C47/88 , G02B5/30 , B29C55/06 , B29K69/00
CPC分类号： G02B5/3083 , B29C47/0021 , B29C47/8845 , B29C47/887 , B29C55/06 , B29K2069/00 , B29K2995/0032 , Y10T428/24479
摘要： A retardation film which has few foreign matter defects and small retardation nonuniformity and meets the required quality of a retardation film is provided with high productivity at a low cost by melt extruding a polycarbonate.The retardation film obtained by stretching and orienting a melt extruded film of a polycarbonate is characterized in that: (1) the polycarbonate constituting the film has a viscosity average molecular weight of 1.3×104 to 1.8×104; (2) the retardation R(589) within the plane of the film measured at a wavelength of 589 nm is 50 to 800 nm; (3) the retardation R(589) nonuniformity within the plane of the film is ±5 nm; (4) the average thickness of the film is 10 to 150 μm; and (5) the number of film defects as large as 100 μm or more is 2 or less/m2.
摘要翻译：通过熔融挤出聚碳酸酯，以低成本提供少量异物缺陷和小的延迟不均匀性并且满足延迟膜的所需质量的延迟膜。通过拉伸和取向聚碳酸酯的熔融挤出膜获得的延迟膜的特征在于：（1）构成膜的聚碳酸酯的粘均分子量为1.3×10 4〜1.8×10 4; （2）在波长589nm处测量的膜的平面内的延迟R（589）为50〜800nm; （3）薄膜平面内的延迟R（589）不均匀度为±5nm; （4）膜的平均厚度为10〜150μm; （5）大于100μm以上的膜缺陷的数量为2个以下/ m 2。

3. 发明授权

US08179678B2 Electronic component module 有权
标题翻译：电子元件模块
公开(公告)号：US08179678B2
公开(公告)日：2012-05-15
申请号：US12753436
申请日：2010-04-02
申请人： Mitsuyoshi Yamashita , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
发明人： Mitsuyoshi Yamashita , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
IPC分类号： H05K7/20
CPC分类号： H05K1/0243 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/00014 , H01L2924/19105 , H05K1/181 , H05K9/006 , H05K2201/10371 , H05K2201/10522 , H01L2224/0401
摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.
摘要翻译：提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

4. 发明申请

US20120105113A1 DATA TRANSFER CIRCUIT AND DATA TRANSFER METHOD FOR CLOCK DOMAIN CROSSING 失效
标题翻译：用于时域交叉的数据传输电路和数据传输方法
公开(公告)号：US20120105113A1
公开(公告)日：2012-05-03
申请号：US13267184
申请日：2011-10-06
申请人： Takashi Maeno , Masahiro Murakami
发明人： Takashi Maeno , Masahiro Murakami
IPC分类号： H03L7/00
CPC分类号： G06F13/4217
摘要： A circuit that transfers data between a first clock domain using a first clock and a second clock domain using a second clock synchronized with the first clock. The circuit comprises a data holding circuit operating at the first clock, an enable signal generation circuit connected to the data holding circuit. Preferably, the data transfer circuit includes an edge signal generation circuit connected to the data holding circuit, the edge signal generation circuit generating an edge signal allowing the data holding circuit to receive and send the data when edges of the first clock and the second clock align, and applying the edge signal to the data holding circuit.
摘要翻译：使用与第一时钟同步的第二时钟，使用第一时钟和第二时钟域在第一时钟域之间传送数据的电路。电路包括在第一时钟工作的数据保持电路，连接到数据保持电路的使能信号发生电路。优选地，数据传送电路包括连接到数据保持电路的边沿信号产生电路，边沿信号产生电路产生边沿信号，允许数据保持电路在第一时钟和第二时钟的边缘对准时接收和发送数据，并将边沿信号应用于数据保持电路。

5. 发明授权

US08139966B2 Image forming system having a density correction unit 有权
标题翻译：图像形成系统具有密度校正单元
公开(公告)号：US08139966B2
公开(公告)日：2012-03-20
申请号：US11902690
申请日：2007-09-25
申请人： Masahiro Murakami
发明人： Masahiro Murakami
IPC分类号： G03G15/00
CPC分类号： G03G15/553 , G03G15/0194 , G03G15/5058 , G03G15/556 , G03G2215/00059 , G03G2215/0132 , G03G2215/0164
摘要： An image forming system includes an image forming unit, a measurement unit, a correction unit, and an inhibition unit. The image forming unit forms an image. The measurement unit measures densities of a plurality of density patches formed by the image forming unit. The correction unit performs a density correction for the image forming unit based on the densities of the plurality of density patches measured by the measurement unit. The inhibition unit determines whether or not the densities of the plurality of the density patches are normal based on at least one of the densities of the plurality of density patches, and, if the densities are determined not to be normal, inhibits the correction unit from performing a density correction based on the densities of the plurality of density patches determined to be not normal.
摘要翻译：图像形成系统包括图像形成单元，测量单元，校正单元和禁止单元。图像形成单元形成图像。测量单元测量由图像形成单元形成的多个密度斑块的密度。校正单元基于由测量单元测量的多个密度斑块的密度，对图像形成单元执行浓度校正。抑制单元基于多个密度斑块的密度中的至少一个来确定多个密度斑块的密度是否正常，并且如果确定密度不正常，则禁止校正单元基于确定为不正常的多个密度片的密度进行密度校正。

6. 发明申请

US20110046372A1 NOVEL BORON COMPOUNDS, THEIR PRODUCTION PROCESSES, AND FUNCTIONAL ELECTRONIC DEVICES USING SAME 有权
标题翻译：新型硼硼化合物，其生产工艺和使用相同功能的电子设备
公开(公告)号：US20110046372A1
公开(公告)日：2011-02-24
申请号：US12734961
申请日：2008-12-04
申请人： Masahiro Murakami , Naoki Ishida , Mizuna Narumi , Yoichi Arimoto , Munehiro Hasegawa , Tomoya Arai , Tsuyoshi Goya
发明人： Masahiro Murakami , Naoki Ishida , Mizuna Narumi , Yoichi Arimoto , Munehiro Hasegawa , Tomoya Arai , Tsuyoshi Goya
IPC分类号： C07F5/02
CPC分类号： H01L51/008 , C07F5/02 , C07F5/027 , C09K11/06 , C09K2211/1014 , C09K2211/1022 , C09K2211/1029 , C09K2211/1092 , H01L51/5012 , H01L51/5048 , H01L51/5092 , H05B33/14
摘要： The present invention provides novel boron compounds which are useful, depending on their characteristics, as light-emitting materials, electron-transport materials, electron-injection materials, hole-blocking materials, or organic semiconductor materials, and which have new molecular structures quite different from those of the heretofore known boron compounds; their production processes; and functional electronic devices using the same. The novel boron compounds are, for example, those of the following formula (1): These boron compounds can be produced by, for example, reacting boron compounds of the following formula (4): with compounds of the following formula (5): in the presence of a catalyst containing at least one metal element selected from the group consisting of palladium, platinum, and nickel. These boron compounds are used for the functional electronic devices.
摘要翻译：本发明提供新颖的硼化合物，它们根据其特性可用作发光材料，电子传输材料，电子注入材料，空穴阻挡材料或有机半导体材料，并且具有非常不同的新分子结构从迄今已知的硼化合物的那些; 他们的生产工艺; 和使用其的功能电子设备。新的硼化合物是例如下式（1）的那些：这些硼化合物可以通过例如使下式（4）的硼化合物与下式（5）的化合物反应来制备：在含有选自钯，铂和镍的至少一种金属元素的催化剂存在下进行。这些硼化合物用于功能电子器件。

7. 发明申请

US20100265663A1 ELECTRONIC COMPONENT MODULE 有权
标题翻译：电子元件模块
公开(公告)号：US20100265663A1
公开(公告)日：2010-10-21
申请号：US12753436
申请日：2010-04-02
申请人： Mitsuyoshi YAMASHITA , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
发明人： Mitsuyoshi YAMASHITA , Yoshihisa Amano , Akiteru Deguchi , Masahiko Kushino , Masahiro Murakami
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： H05K1/0243 , H01L23/552 , H01L25/165 , H01L2224/16225 , H01L2224/16227 , H01L2224/73253 , H01L2924/00014 , H01L2924/19105 , H05K1/181 , H05K9/006 , H05K2201/10371 , H05K2201/10522 , H01L2224/0401
摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.
摘要翻译：提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

8. 发明申请

US20100202125A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：US20100202125A1
公开(公告)日：2010-08-12
申请号：US12685306
申请日：2010-01-11
申请人： Masahiro MURAKAMI , Masahiko Kushino , Akiteru Deguchi , Yoshihisa Amano
发明人： Masahiro MURAKAMI , Masahiko Kushino , Akiteru Deguchi , Yoshihisa Amano
IPC分类号： H05K7/00
CPC分类号： H05K1/0271 , H01L25/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H05K1/144 , H05K1/181 , H05K3/341 , H05K2201/09136 , H05K2201/10204 , H01L2224/0401
摘要： A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.
摘要翻译：面对其间具有电子部件的模块板的顶板包括树脂层和金属层，并且具有绝缘特性。金属层包括在树脂层的前侧形成的金属层和形成在树脂层的后侧的金属层。利用这种结构，在将半导体模块安装在主板上进行的回流焊接中，由于在树脂层和形成在该主板上的金属层之间的热膨胀系数的差异，在顶板中在温度变化时引起的翘曲树脂层的前侧由于在树脂层和形成在树脂层的后侧的金属层之间的热膨胀系数的差异而在顶板中由于温度变化引起的翘曲而消除，由此翘曲的顶板被淘汰。这有助于防止由于顶板的翘曲而使粘合剂附着在顶板上的电子部件被压下或从模块板拉出。

9. 发明申请

US20090186168A1 Polycarbonate Resin Film and Manufacturing Process Thereof 有权
标题翻译：聚碳酸酯树脂薄膜及其制造方法
公开(公告)号：US20090186168A1
公开(公告)日：2009-07-23
申请号：US12227982
申请日：2006-12-27
申请人： Hideaki Nitta , Masahiro Murakami , Kunio Hatanaka , Takatsune Yanagida , Hironobu Katoh , Kinji Hasegawa
发明人： Hideaki Nitta , Masahiro Murakami , Kunio Hatanaka , Takatsune Yanagida , Hironobu Katoh , Kinji Hasegawa
IPC分类号： B32B27/00 , B29C47/88
CPC分类号： G11B7/252 , B29C47/0021 , B29C47/8845 , B29C47/886 , B29C47/887 , B29C47/889 , B29C47/92 , B29C2947/92019 , B29C2947/92028 , B29C2947/92142 , B29C2947/92209 , B29C2947/92314 , B29C2947/92428 , B29C2947/92438 , B29C2947/9259 , B29C2947/92647 , B29C2947/92695 , B29C2947/92923 , B29C2947/92933 , B29K2069/00 , B29L2011/00 , B29L2031/3475 , C08J5/18 , C08J2369/00 , G11B7/2534 , Y10T428/10 , Y10T428/24479
摘要： A polycarbonate resin film which has an average thickness of 10 to 150 μm, a thickness nonuniformity of 2% or less, a retardation R(589) in the plane of the film measured at a wavelength of 589 nm of 12 nm or less, a retardation Rth(589) in the thickness direction of the film measured at a wavelength of 589 nm of 35 nm or less and is used for optical purposes.
摘要翻译：平均厚度为10〜150μm，厚度不均匀度为2％以下的聚碳酸酯树脂膜，在波长589nm处测定的膜的平面中的相位差R（589）为12nm以下，a 在波长589nm处测量的膜的厚度方向的延迟Rth（589）为35nm以下，用于光学目的。

10. 发明授权

US07206502B2 Apparatus and method for recording and reproducing digital data 失效
标题翻译：用于记录和再现数字数据的装置和方法
公开(公告)号：US07206502B2
公开(公告)日：2007-04-17
申请号：US09961020
申请日：2001-09-21
申请人： Hiroaki Kubo , Masahiro Murakami , Katsuyuki Sugita
发明人： Hiroaki Kubo , Masahiro Murakami , Katsuyuki Sugita
IPC分类号： H04N7/26
CPC分类号： H04N5/76 , H04N9/8042
摘要： An apparatus for recording and reproducing digital data, which is capable of recording digital broadcast data while reproducing previously-recorded digital broadcast data is provided. An apparatus 10 for recording and reproducing digital data, which is capable of recording MPEG2-PES data 42 generated from record control means 16 in recording means 20 by controlling the record control means 16 and reproduction control means 22 by time division control means 18 while reading the MPEG2-PES data 42 recorded in the recording means 20 by reproduction control means 22.
摘要翻译：提供了一种用于记录和再现数字数据的装置，其能够在再现先前记录的数字广播数据的同时记录数字广播数据。一种用于记录和再现数字数据的装置10，其能够通过在读取时由时间分配控制装置18控制记录控制装置16和再现控制装置22，将从记录控制装置16产生的MPEG2-PES数据42记录在记录装置20中由再现控制装置22记录在记录装置20中的MPEG2-PES数据42。

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