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1. 发明授权

US09434611B2 Packaged hydrogen-generating agent, manufacturing method therefor, and hydrogen generation method 有权
标题翻译：包装氢气发生剂，其制备方法和氢气生成方法
公开(公告)号：US09434611B2
公开(公告)日：2016-09-06
申请号：US13265987
申请日：2010-04-21
申请人： Masakazu Sugimoto , Masaya Yano
发明人： Masakazu Sugimoto , Masaya Yano
IPC分类号： C01B3/08 , C01B3/06 , H01M8/06 , H01M8/04
CPC分类号： C01B3/065 , C01B3/08 , H01M8/04208 , H01M8/04216 , H01M8/065 , Y02E60/362 , Y02E60/50
摘要： Provided is a packaged hydrogen-generating agent, the hydrogen-generating reaction of which is highly stable and repeatable, and which preferably is resistant to influence from changes in the environmental temperature. Also provided are a method for manufacturing said package, and a hydrogen generation method. The packaged hydrogen-generating agent is provided with: a hydrogen-generating agent (1); a covering material (2) which encloses the hydrogen-generating agent (1) and allows deformation; and a water-absorbing body (3), part of which is in contact with the hydrogen-generating agent (1). The covering material (2) preferably covers at least the area around the contact part (3a) where the water-absorbing body (3) and the hydrogen-generating agent (1) are in contact, so as to create a firm attachment at the contact part (3a).
摘要翻译：提供了一种包装氢发生剂，其氢产生反应是高度稳定和可重复的，并且其优选地受到环境温度变化的影响。还提供了制造所述包装的方法和氢产生方法。包装的氢发生剂具有：氢发生剂（1）; 包围氢发生剂（1）并且允许变形的覆盖材料（2）; 和吸水体（3），其一部分与氢气发生剂（1）接触。覆盖材料（2）优选至少覆盖吸水体（3）和氢气发生剂（1）接触的接触部分（3a）周围的区域，从而在接触部（3a）。

2. 发明授权

US08183017B2 Method of producing L-lysine 有权
标题翻译：生产L-赖氨酸的方法
公开(公告)号：US08183017B2
公开(公告)日：2012-05-22
申请号：US12915793
申请日：2010-10-29
申请人： Seiko Otsuna , Masakazu Sugimoto , Masako Izui , Atsushi Hayakawa , Eiichi Nakano , Masaki Kobayashi , Yasuhiko Yoshihara , Tsuyoshi Nakamatsu
发明人： Seiko Otsuna , Masakazu Sugimoto , Masako Izui , Atsushi Hayakawa , Eiichi Nakano , Masaki Kobayashi , Yasuhiko Yoshihara , Tsuyoshi Nakamatsu
IPC分类号： C12P13/04 , C12P21/04
CPC分类号： C12N9/0016 , C12N9/1217 , C12N9/88 , C12N15/52 , C12N15/77 , C12P13/08
摘要： The ability and speed with which a coryneform bacterium can produce L-lysine are improved when the coryneform bacterium contains an aspartokinase in which feedback inhibition by L-lysine and L-threonine is substantially desensitized. This is accomplished by successively enhancing the DNA coding for dihydrodipicolinate reductase, the DNA coding for dihydrodipicolinate synthase, the DNA coding for diaminopimelate decarboxylase, and the DNA coding for diaminopimelate dehydrogenase.
摘要翻译：当棒状细菌含有其中L-赖氨酸和L-苏氨酸的反馈抑制基本上脱敏的天冬氨酸激酶时，棒状细菌可以产生L-赖氨酸的能力和速度得到改善。这是通过连续增强编码二氢吡啶二羧酸还原酶的DNA，编码二氢吡啶二羧酸合成酶的DNA，编码二氨基庚二酸脱羧酶的DNA和编码二氨基庚二酸脱氢酶的DNA来实现的。

3. 发明授权

US07846698B2 Method of producing L-lysine 有权
标题翻译：生产L-赖氨酸的方法
公开(公告)号：US07846698B2
公开(公告)日：2010-12-07
申请号：US10226136
申请日：2002-08-23
申请人： Seiko Otsuna , Masakazu Sugimoto , Masako Izui , Atsushi Hayakawa , Eiichi Nakano , Masaki Kobayashi , Yasuhiko Yoshihara , Tsuyoshi Nakamatsu
发明人： Seiko Otsuna , Masakazu Sugimoto , Masako Izui , Atsushi Hayakawa , Eiichi Nakano , Masaki Kobayashi , Yasuhiko Yoshihara , Tsuyoshi Nakamatsu
IPC分类号： C12P13/04 , C12P21/04
CPC分类号： C12N9/0016 , C12N9/1217 , C12N9/88 , C12N15/52 , C12N15/77 , C12P13/08
摘要： The L-lysine-producing ability and the L-lysine-producing speed are improved in a coryneform bacterium harboring an aspartokinase in which feedback inhibition by L-lysine and L-threonine is substantially desensitized, by successively enhancing DNA coding for a dihydrodipicolinate reductase, DNA coding for a dihydrodipicolinate synthase, DNA coding for a diaminopimelate decarboxylase, and DNA coding for a diaminopimelate dehydrogenase.
摘要翻译：通过连续增强编码二氢吡啶二羧酸还原酶的DNA，在含有赖氨酸和L-苏氨酸的反馈抑制实质上脱敏的天麸蛋白的棒状细菌的L-赖氨酸生产能力和L-赖氨酸生产速度得到改善，编码二氢吡啶二羧酸合成酶的DNA，编码二氨基庚二酸脱羧酶的DNA，以及编码二氨基庚二酸脱氢酶的DNA。

4. 发明申请

US20050166485A1 Steel pipe pole base and reinforcing method thereof 审中-公开
标题翻译：钢管底座及其加固方法
公开(公告)号：US20050166485A1
公开(公告)日：2005-08-04
申请号：US10753851
申请日：2004-01-07
申请人： Masakazu Sugimoto , Tomonori Tominaga , Tetsumi Kondoh
发明人： Masakazu Sugimoto , Tomonori Tominaga , Tetsumi Kondoh
IPC分类号： B24C1/10 , E04H12/22 , E02D27/00
CPC分类号： E04H12/2261 , B24C1/10
摘要： The present invention: provides a steel pipe pole base and a method for reinforcing the steel pipe pole base that do not allow the strength to lower in the vicinity of the weld toe of a rib even in the event of applying repeated bending moment; and is characterized by forming peening processed portions 20 by ultrasonic vibration at the weld toes 16 of tabular ribs 12 welded to the base of a steel pipe pole 10 in the form of a T-joint or the weld toes of inverted-U shaped ribs 13 or inverted-V shaped ribs 14, the ribs being bent at the upper end portions, welded to the base of a steel pipe pole 10 in the form of a T-joint. Preferable treatment conditions are 20 to 50 μm in amplitude and 10 to 50 kHz in frequency. In particular, the present invention makes it possible to remarkably improve the fatigue property because stress concentration is relaxed by the synergetic effect of bending the upper end portions 16 of the ribs 13 and applying a peening treatment.
摘要翻译：本发明提供一种钢管极基座和加强钢管极基座的方法，即使在施加重复的弯矩的情况下也不允许肋的焊趾附近的强度降低; 其特征在于，在焊接到T形接头的钢管极10的基部的焊接脚趾16上，通过超声波振动形成喷丸处理部20，或者将U形肋13的焊接脚趾或倒V形肋14，肋在上端弯曲，焊接到T形接头形式的钢管杆10的基部。优选的治疗条件是振幅为20至50um，频率为10至50kHz。特别地，本发明能够显着地提高疲劳特性，因为通过弯曲肋13的上端部16并进行喷丸处理的协同效应来减轻应力集中。

5. 发明授权

US06333469B1 Wafer-scale package structure and circuit board attached thereto 失效
标题翻译：晶圆尺寸的封装结构和电路板
公开(公告)号：US06333469B1
公开(公告)日：2001-12-25
申请号：US09353385
申请日：1999-07-15
申请人： Yasushi Inoue , Masakazu Sugimoto , Megumu Nagasawa , Takuji Okeyui , Kei Nakamura
发明人： Yasushi Inoue , Masakazu Sugimoto , Megumu Nagasawa , Takuji Okeyui , Kei Nakamura
IPC分类号： H05K116
CPC分类号： H01L24/94 , H01L23/3114 , H01L23/4985 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.
摘要翻译：一种晶片级封装结构，其中用于重新排列晶片的电极焊盘的电路板一体地层压在晶片上。电路板可分为单个芯片尺寸封装（CSPS），其中包含一层聚酰亚胺树脂，晶圆与电路板之间的连接由焊锡凸块进行，而电路板则以胶粘剂。

6. 发明授权

US06310391B1 Mounted structure of circuit board and multi-layer circuit board therefor 失效
标题翻译：电路板和多层电路板的安装结构
公开(公告)号：US06310391B1
公开(公告)日：2001-10-30
申请号：US09334631
申请日：1999-06-17
申请人： Megumu Nagasawa , Masakazu Sugimoto , Yasushi Inoue , Kei Nakamura
发明人： Megumu Nagasawa , Masakazu Sugimoto , Yasushi Inoue , Kei Nakamura
IPC分类号： H01L23053
CPC分类号： H05K3/462 , H01L23/142 , H01L23/3677 , H01L23/5385 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/0206 , H05K1/0207 , H05K3/28 , H05K3/4038 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/068 , H05K2201/09536 , H05K2201/096 , H05K2201/10674 , H01L2924/00 , H01L2224/0401
摘要： The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other. The mounted structure of circuit board comprises a 6-layer circuit board 2 having a laminate of three sheets of double-sided circuit boards 1 and a chip 13 connected to a circuit 5 on the uppermost layer. The core material 3 embedded in the intraboard insulating layer 4 in various double-sided circuit board 1 comprises a copper layer 3a having a heat conductivity of 393 W/·K provided on at least one side of an Ni—Fe alloy foil 25. The chip 13 and the underlying core material 3 are connected to each other with a solder metal member 10. The core material 3 on the horizontally adjacent double-sided circuit boards 1 are similarly connected to each other with the solder metal member 10.
摘要翻译：本发明提供了一种电路板的安装结构，其可以通过简单的方法制备，并且显示出来自芯片的良好散热并经受松弛的热应力，并且将多层电路板并入安装的结构中。提供一种电路板的新型安装结构，其包括嵌入绝缘层中的芯材，所述芯材具有设置在Ni-Fe合金的至少一侧上的导热率不小于100W / mK的金属层箔，所述绝缘层包括设置的导线导体和安装在其至少一侧上的半导体元件，其特征在于，设置用于导热的焊料金属构件插入在所述半导体元件和所述芯材之间，使得所述半导体元件和所述芯材彼此连接。电路板的安装结构包括具有三片双面电路板1和连接到最上层电路5的芯片13的叠层的6层电路板2。在各种双面电路板1中嵌入在内部绝缘层4中的芯材3包括设置在Ni-Fe合金箔25的至少一侧上的导热率为393W / K.的铜层3a。芯片13和下面的芯材3通过焊料金属部件10彼此连接。水平相邻的双面电路板1上的芯材3类似地用焊料金属部件10彼此连接。

7. 发明授权

US06258573B1 Method of producing L-serine by fermentation 失效
标题翻译：通过发酵生产L-丝氨酸的方法
公开(公告)号：US06258573B1
公开(公告)日：2001-07-10
申请号：US09222786
申请日：1998-12-30
申请人： Mikiko Suga , Masakazu Sugimoto , Tsuyoshi Osumi , Tsuyoshi Nakamatsu , Wataru Hibino , Mika Ito
发明人： Mikiko Suga , Masakazu Sugimoto , Tsuyoshi Osumi , Tsuyoshi Nakamatsu , Wataru Hibino , Mika Ito
IPC分类号： C12P1306
CPC分类号： C12N9/0006 , C12P13/06 , C12R1/13 , C12R1/15 , C12R1/19
摘要： Disclosed is a coryneform bacterium having resistance to azaserine or &bgr;-(2-thienyl)-DL-alanine and having L-serine productivity. Also, disclosed are D-3-phosphoglycerate dehydrogenase derived from a coryneform bacterium, in which feedback inhibition by L-serine is desensitized; the D-3-phosphoglycerate dehydrogenase, which is obtainable from a coryneform bacterium having resistance to azaserine or &bgr;-(2-thienyl)-DL-alanine and having L-serine productivity; the D-3-phosphoglycerate dehydrogenase having an amino acid sequence depicted in SEQ ID NO: 12 in Sequence Listing or the sequence including substitution, addition or deletion of one or more amino acids, wherein an amino acid residue corresponding to the 325th glutamic acid residue of the amino acid sequence in the SEQ ID NO: 12 is replaced with an amino acid other than glutamic acid; the D-3-phosphoglycerate dehydrogenase that has an amino acid sequence depicted in SEQ ID NO: 11 in Sequence Listing; a DNA coding for the D-3-phosphoglycerate dehydrogenase described above; the DNA that has a base sequence depicted in SEQ ID NO: 13 in Sequence Listing; a coryneform bacterium which harbors a recombinant DNA containing the DNA; and a method of producing L-serine, comprising the steps of cultivating the bacterium described above in a medium to allow accumulation of L-serine in the medium, and collecting the L-serine from the medium.
摘要翻译：公开了具有对丝氨酸或β-（2-噻吩基）-DL-丙氨酸具有L-丝氨酸生产力的抗性的棒状细菌。此外，公开了衍生自棒状细菌的D-3-磷酸甘油酸脱氢酶，其中L-丝氨酸的反馈抑制被脱敏; D-3-磷酸甘油酸脱氢酶，其可从具有对β-丝氨酸或β-（2-噻吩基）-DL-丙氨酸具有抗丝氨酸生产力的棒状细菌获得; 具有序列表中SEQ ID NO：12所示氨基酸序列的D-3-磷酸甘油酸脱氢酶或包含一个或多个氨基酸的取代，添加或缺失的序列，其中对应于第325位谷氨酸残基的氨基酸残基 SEQ ID NO：12中的氨基酸序列被除了谷氨酸以外的氨基酸替换; 具有序列表中SEQ ID NO：11所示的氨基酸序列的D-3-磷酸甘油酸脱氢酶; 编码上述D-3-磷酸甘油酸脱氢酶的DNA; 具有序列表中SEQ ID NO：13所示碱基序列的DNA; 含有含DNA的重组DNA的棒状细菌; 以及生产L-丝氨酸的方法，包括以下步骤：在培养基中培养上述细菌以允许L-丝氨酸积累在培养基中，并从培养基中收集L-丝氨酸。

8. 发明授权

US06258449B1 Low-thermal expansion circuit board and multilayer circuit board 失效
标题翻译：低热膨胀电路板和多层电路板
公开(公告)号：US06258449B1
公开(公告)日：2001-07-10
申请号：US09328485
申请日：1999-06-09
申请人： Megumu Nagasawa , Masakazu Sugimoto , Yasushi Inoue , Kei Nakamura
发明人： Megumu Nagasawa , Masakazu Sugimoto , Yasushi Inoue , Kei Nakamura
IPC分类号： B32B300
CPC分类号： H01L23/5385 , H01L23/3735 , H01L23/5384 , H01L2924/0002 , H05K1/056 , H05K1/09 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K2201/0154 , H05K2201/0338 , H05K2201/09536 , Y10S428/901 , Y10T428/24917 , H01L2924/00
摘要： A low-thermal expansion circuit board comprising an insulating layer made of an organic polymer having thereon a wiring conductor for bare chip mounting, wherein the wiring conductor is an iron-nickel-based alloy layer having a copper layer on at least one side thereof; and a low-thermal expansion multilayer circuit board having a plurality of the low-thermal expansion circuit boards via an adhesive layer, the adhesive layer having through-holes filled with solder to connect the circuits layers.
摘要翻译：一种低热膨胀电路板，包括由有机聚合物制成的绝缘层，其上具有用于裸芯片安装的布线导体，其中所述布线导体是在其至少一侧上具有铜层的铁镍基合金层; 以及通过粘合剂层具有多个低热膨胀电路板的低热膨胀多层电路板，所述粘合剂层具有填充有焊料的通孔，以连接电路层。

9. 发明授权

US06221636B1 Method for producing L-lysine 失效
标题翻译：生产L-赖氨酸的方法
公开(公告)号：US06221636B1
公开(公告)日：2001-04-24
申请号：US08985916
申请日：1997-12-05
申请人： Atsushi Hayakawa , Masakazu Sugimoto , Yasuhiko Yoshihara , Tsuyoshi Nakamatsu
发明人： Atsushi Hayakawa , Masakazu Sugimoto , Yasuhiko Yoshihara , Tsuyoshi Nakamatsu
IPC分类号： C12P1308
CPC分类号： C12N9/1217 , C12N9/88 , C12P13/08
摘要： A recombinant DNA autonomously replicable in cells of coryneform bacteria, comprising a DNA sequence coding for an aspartokinase in which feedback inhibition by L-lysine and L-threonine is substantially desensitized, and a DNA sequence coding for a diaminopimelate decarboxylase; a coryneform bacterium harboring an aspartokinase in which feedback inhibition by L-lysine and L-threonine is substantially desensitized, and comprising an enhanced DNA sequence coding for a diaminopimelate decarboxylase; and a method for producing L-lysine comprising the steps of cultivating the coryneform bacterium in an appropriate medium to allow L-lysine to be produced and accumulated in a culture of the bacterium, and collecting L-lysine from the culture.
摘要翻译：在棒状杆菌细胞的细胞中自主复制的重组DNA，其中包含编码天冬氨酸激酶的DNA序列，其中L-赖氨酸和L-苏氨酸的反馈抑制基本上脱敏，以及编码二氨基庚二酸脱羧酶的DNA序列; 携带天冬氨酸激酶的棒状细菌，其中L-赖氨酸和L-苏氨酸的反馈抑制基本上脱敏，并且包含编码二氨基庚二酸脱羧酶的增强的DNA序列; 以及L-赖氨酸的制造方法，其特征在于，在合适的培养基中培养棒状细菌，使L-赖氨酸在细菌培养物中产生并积累，从培养物中收集L-赖氨酸。

10. 发明授权

US6157084A Film carrier and semiconductor device using same 失效
标题翻译：薄膜载体和使用其的半导体器件
公开(公告)号：US6157084A
公开(公告)日：2000-12-05
申请号：US913571
申请日：1997-09-17
申请人： Atsushi Hino , Toshiki Naito , Masakazu Sugimoto
发明人： Atsushi Hino , Toshiki Naito , Masakazu Sugimoto
IPC分类号： H01L23/00 , H01L23/31 , H01L23/367 , H01L23/498 , H05K3/40 , H05K3/42 , H01L23/48 , H01L23/40 , H01L23/52
CPC分类号： H01L23/564 , H01L23/3121 , H01L23/3135 , H01L23/3677 , H01L23/49827 , H01L23/4985 , H01L24/31 , H05K3/4007 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2201/10378 , H05K2203/1572 , H05K3/423
摘要： A semiconductor device capable of meeting the demand for fine-pitched wiring of semiconductor element and highly dense mounting thereof, as well as the demand for a thin structure thereof, which device being superior in the adhesion property of an insulating resin to be used for sealing a semiconductor element and a film carrier, and thus highly reliable. In FIG. 1, a conductive circuit (5) is embedded so that it will not be exposed at the both surfaces (6a, 6b) of an insulator layer (6), and conductive paths (7, 8) are formed in a pair from the both surfaces (5a, 5b) of the conductive circuit (5), the conductive paths slipping relative to each other in the direction of the surface of the conductive circuit (5). The conductive paths (7, 8) are respectively connected to bumps (9, 10), and the conductive circuit (5) and bumps (9, 10) are conducted via conductive paths (7, 8). The bump (9) formed on one end of the one conductive path (7) of the film carrier (2) contacts an electrode (12) of the semiconductor element (3) and is electrically connected, whereby the semiconductor element (3) is mounted on the film carrier (2). An insulating resin layer (4) is formed on one surface (6a) of the insulator layer (6) to cover the semiconductor element (3).
摘要翻译： PCT No.PCT / JP95 / 00493 Sec。 371日期1997年9月17日 102（e）日期1997年9月17日PCT 1995年3月17日提交的能够满足对半导体元件的精细布线的需求和高密度安装的半导体器件，以及对其薄型结构的需求，器件在用于密封半导体元件和薄膜载体的绝缘树脂的粘合性方面优异，因此高度可靠。在图如图1所示，嵌入导电电路（5），使其不会在绝缘体层（6）的两个表面（6a，6b）处露出，并且导电路径（7,8）从两者形成成对导电电路（5）的表面（5a，5b），导电路径在导电电路（5）的表面方向上相对于彼此滑动。导电路径（7,8）分别连接到凸块（9,10），并且导电电路（5）和凸块（9,10）通过导电路径（7,8）传导。形成在薄膜载体（2）的一个导电路径（7）的一端上的凹凸（9）与半导体元件（3）的电极（12）接触并被电连接，由此半导体元件安装在胶片载体（2）上。绝缘树脂层（4）形成在绝缘体层（6）的一个表面（6a）上以覆盖半导体元件（3）。

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