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    • 7. 发明申请
    • INSULATION FORMULATIONS
    • 绝缘配方
    • US20140125439A1
    • 2014-05-08
    • US14115767
    • 2012-04-13
    • Mohamed EsseghirWilliam J. Harris
    • Mohamed EsseghirWilliam J. Harris
    • H01B3/40H01F27/22H01B19/04
    • H01F27/22C08G59/42C08G59/686C08K9/06H01B3/40H01B19/04C08L63/00
    • A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one liquid epoxy resin; (b) at least one liquid cyclic anhydride hardener; (c) at least one thermally conducting and electrically insulating filler, wherein the filler includes an epoxy-silane treated filler; and (d) at least one cure catalyst with no amine hydrogens; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 120° C.
    • 一种可用作电气设备绝缘的可固化环氧树脂配制组合物,包括(a)至少一种液体环氧树脂; (b)至少一种液体环状酸酐硬化剂; (c)至少一种导热和电绝缘的填料,其中所述填料包括环氧硅烷处理的填料; 和(d)至少一种不含胺氢的固化催化剂; 其中所述环氧树脂配方组合物在固化时提供具有所需平衡的电气,机械和热性质如Tg,拉伸强度,介电强度和体积电阻率的固化产物,使得固化产物可用于在 温度大于或等于120℃