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1. 发明授权

US07488539B2 Adhesive composition and sheet having an adhesive layer of the composition 失效
标题翻译：粘合剂组合物和具有该组合物的粘合剂层的片材
公开(公告)号：US07488539B2
公开(公告)日：2009-02-10
申请号：US11583699
申请日：2006-10-20
申请人： Shouhei Kozakai , Nobuhiro Ichiroku
发明人： Shouhei Kozakai , Nobuhiro Ichiroku
IPC分类号： B32B9/04 , B32B27/00 , B32B27/06
CPC分类号： C09J163/00 , C08L63/00 , C08L79/08 , C08L83/00 , C08L2666/14 , C08L2666/20 , C08L2666/22 , C09J7/22 , C09J7/38 , C09J179/08 , C09J183/10 , C09J2201/36 , C09J2201/622 , C09J2479/08 , C09J2483/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/293 , H01L2224/83191 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/181 , Y10T428/31663 , Y10T428/31721 , H01L2924/0715 , H01L2924/07025 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive composition comprising 5 to 60 wt % of (A) a polyimidesilicone resin 5 to 60 wt % of (B) an epoxy resin having a softening point of 80° C. or lower, 0.001 to 20 wt % of (C) at least one epoxy resin curing catalyst selected from imidazole compounds and dicyandiamide 20 to 70 wt % of (D) spherical silica having an average diameter of 0.1 to 10 μm, and 5 to 30 wt % of (E) spherical fine particles of silicone rubber composite, wt % being based on a total weight of the composition.
摘要翻译：一种粘合剂组合物，其包含5至60重量％的（A）聚酰亚胺硅酮树脂5至60重量％的（B）软化点为80℃或更低的环氧树脂，（C）在选自咪唑化合物和双氰胺的至少一种环氧树脂固化催化剂20至70重量％的（D）平均直径为0.1至10微米的球形二氧化硅和5至30重量％的（E）球形微粒硅橡胶复合材料，wt％是基于组合物的总重量。

2. 发明申请

US20070191552A1 Adhesive composition, adhesive film, and method of producing semiconductor device 有权
标题翻译：粘合剂组合物，粘合剂膜以及半导体装置的制造方法
公开(公告)号：US20070191552A1
公开(公告)日：2007-08-16
申请号：US11706272
申请日：2007-02-15
申请人： Nobuhiro Ichiroku , Shouhei Kozakai
发明人： Nobuhiro Ichiroku , Shouhei Kozakai
IPC分类号： C08L83/04 , C08L63/00 , C08G77/455
CPC分类号： C09J163/00 , C08L63/00 , C08L79/08 , C08L2666/14 , C08L2666/20 , C09J183/10 , C08L2666/22
摘要： Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.
摘要翻译：提供一种粘合剂组合物，其在40〜80℃下的熔融粘度为10000Pa·s以下，在80℃以上的温度下加热1分钟〜2小时后，至（T + 50）℃，在100℃至（T + 30）℃的温度下显示出在100至10,000Pa·s范围内的熔体粘度（其中，T表示组合物的固化开始温度）。粘合剂组合物能够形成具有精细图案化电路的基材的优异填充性，低温下优异的层压性能，低弹性模量和优异的粘合性和耐热性水平的固化产物。粘合剂组合物可用于提供粘合剂膜和用于制造半导体器件。

3. 发明授权

US06808819B2 Heat resistant resin composition and adhesive film 有权
标题翻译：耐热树脂组合物和粘合膜
公开(公告)号：US06808819B2
公开(公告)日：2004-10-26
申请号：US10366388
申请日：2003-02-14
申请人： Nobuhiro Ichiroku , Toshio Shiobara
发明人： Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： B32B2738
CPC分类号： C09J179/08 , C08G73/1085 , C08L63/00 , C08L79/08 , C09J7/10 , C09J2463/00 , C09J2479/08 , H05K3/386 , Y10S525/928 , Y10T428/31721 , C08L2666/20
摘要： A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.
摘要翻译：包含骨架中具有酸酐基团的聚酰亚胺树脂与环氧树脂固化催化剂，环氧树脂和任选的环氧树脂固化剂的相关产物的树脂组合物具有优异的粘附性，耐热性，储存稳定性和溶剂抵抗性。包含树脂组合物的粘合剂膜可用作印刷电路板和半导体封装的粘合剂或密封剂。

4. 发明授权

US07244495B2 Dicing/die bonding adhesion tape 失效
标题翻译：切割/芯片粘合胶带
公开(公告)号：US07244495B2
公开(公告)日：2007-07-17
申请号：US10829150
申请日：2004-04-22
申请人： Shouhei Kozakai , Akio Suzuki , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Shouhei Kozakai , Akio Suzuki , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C09J7/02 , B32B7/12
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/2878 , Y10T428/2887 , Y10T428/31663 , H01L2924/00 , H01L2924/01026 , H01L2924/01028
摘要： A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2–2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.
摘要翻译：切割/贴合粘合带包括基底，硅氧烷粘合剂层和粘合层。在硅胶粘合剂层和粘合层之间产生0.2-2.0N / 25mm的粘着强度。接合层由包含（A）聚酰亚胺树脂，（B）环氧树脂和（C）环氧树脂固化催化剂的粘合组合物形成。

5. 发明申请

US20070120271A1 Dicing and die bonding adhesive tape 审中-公开
标题翻译：切割和芯片粘合胶带
公开(公告)号：US20070120271A1
公开(公告)日：2007-05-31
申请号：US11604800
申请日：2006-11-28
申请人： Shouhei Kozakai , Nobuhiro Ichiroku
发明人： Shouhei Kozakai , Nobuhiro Ichiroku
IPC分类号： H01L23/48
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/29 , C09J7/38 , C09J2201/162 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2924/3512
摘要： A dicing and die bonding tape, comprising a substrate 1, a pressure sensitive adhesive layer (A) 2 superimposed on the substrate 1, a substrate 3 superimposed on the pressure sensitive adhesive layer (A) 2, a pressure sensitive adhesive layer (B) 4 superimposed on the substrate 3, and an adhesive layer 5 super imposed on the pressure sensitive adhesive layer (B) 4, said dicing and die bonding tape having an adhesion strength between the pressure sensitive adhesive layer (A) 2 and a dicing flame of 0.6 N/25 mm or larger, and an adhesion strength between the pressure sensitive adhesive layer (B) 4 and the adhesive layer 5 of from 0.05 to 0.5 N/25 mm.
摘要翻译：一种切割和芯片粘合带，包括基板1，叠加在基板1上的压敏粘合剂层（A）2，叠加在压敏粘合剂层（A）2上的基板3，压敏粘合剂层（B） 4和叠加在基板3上的粘合层5和超过施加在压敏粘合剂层（B）4上的粘合剂层5），所述切割和芯片粘合带具有在压敏粘合剂层（A）2和切割火焰之间的粘合强度 0.6N / 25mm以上，粘合剂层（B）4和粘合剂层5之间的粘合强度为0.05〜0.5N / 25mm。

6. 发明申请

US20050261456A1 Partial block polyimide-polysiloxane copolymer, making method , and resin composition comprising the copolymer 有权
标题翻译：部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，制造方法和包含该共聚物的树脂组合物
公开(公告)号：US20050261456A1
公开(公告)日：2005-11-24
申请号：US11131197
申请日：2005-05-18
申请人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C08L63/00 , C08G59/62 , C08G73/10 , C08G77/04 , C08G77/455 , C08L79/08
CPC分类号： C08G77/455 , C08G73/106 , C08L63/00 , C08L79/08 , C08L83/10 , C08L2666/20 , C08L2666/22 , C08L2666/14
摘要： A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.
摘要翻译：提供部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，其包含具有结构式（1）和（2）的重复单元结构，其中X是含芳族或脂族环的四价有机基团，Y 1是二胺残基 Y 2是二氨基硅氧烷残基，共聚物中的Y 1 Y 2和Y 2 2的含量为99-20摩尔％，1- 80mol％，L和m分别为2-50的整数。共聚物对基材的粘合性好，防潮可靠性和低弹性模量。

7. 发明授权

US06949619B2 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition 有权
标题翻译：含酚羟基的聚酰亚胺树脂，制作方法和聚酰亚胺树脂组合物
公开(公告)号：US06949619B2
公开(公告)日：2005-09-27
申请号：US10621527
申请日：2003-07-18
申请人： Nobuhiro Ichiroku , Masachika Yoshino , Hideki Akiba , Toshio Shiobara
发明人： Nobuhiro Ichiroku , Masachika Yoshino , Hideki Akiba , Toshio Shiobara
IPC分类号： C08G59/62 , C08G73/10 , C08G77/455 , C08L63/00 , C08L79/08 , B32B27/28 , C08L77/00
CPC分类号： C08G77/455 , C08G73/10 , C08G73/1042 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08L63/00 , C08L79/08 , H05K2201/0154 , H05K2203/065 , Y10T428/31504 , Y10T428/31511 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , C08L2666/22
摘要： A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.
摘要翻译：在其骨架中具有酚羟基自由基的聚酰亚胺树脂使用具有与其连接的氨基的芳香族的芳族二胺和具有酚羟基的另一芳香环来制备。聚酰亚胺树脂和包含聚酰亚胺树脂，环氧树脂和固化剂的组合物适合用作需要粘合和耐热性的清漆，粘合剂和粘合剂膜。

8. 发明授权

US07820742B2 Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C 有权
标题翻译：粘合剂在40〜80℃下显示10,000Pa·s的最大熔融粘度
公开(公告)号：US07820742B2
公开(公告)日：2010-10-26
申请号：US11706272
申请日：2007-02-15
申请人： Nobuhiro Ichiroku , Shouhei Kozakai
发明人： Nobuhiro Ichiroku , Shouhei Kozakai
IPC分类号： B32B27/38 , C08K3/36 , C08L63/02 , C08L79/08
CPC分类号： C09J163/00 , C08L63/00 , C08L79/08 , C08L2666/14 , C08L2666/20 , C09J183/10 , C08L2666/22
摘要： Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.
摘要翻译：本发明提供一种粘合剂组合物，其在40〜80℃下的熔融粘度为10000Pa·s以下，在80℃以上的温度下加热1分钟〜2小时后，至（T + 50）℃，在100℃〜100℃的范围内，在100℃〜（T + 30℃）的温度下具有熔融粘度（其中，T表示组合物的固化开始温度）。粘合剂组合物能够形成具有精细图案化电路的基材的优异填充性，低温下优异的层压性能，低弹性模量和优异的粘合性和耐热性水平的固化产物。粘合剂组合物可用于提供粘合剂膜和用于制造半导体器件。

9. 发明授权

US07722949B2 Adhesive composition and adhesive film therefrom 有权
标题翻译：粘合剂组合物和粘合剂膜
公开(公告)号：US07722949B2
公开(公告)日：2010-05-25
申请号：US11806776
申请日：2007-06-04
申请人： Nobuhiro Ichiroku
发明人： Nobuhiro Ichiroku
IPC分类号： C09J163/00 , C08L63/00 , C08G59/06
CPC分类号： C09J163/00 , C08L71/12 , C08L2666/22 , C08L2666/54 , Y10T428/287
摘要： An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) wherein R1 may be the same with or different from each other and is a substituted or unsubstituted C1-4 alkyl group, and R2 is a substituted or unsubstituted C1-9 monovalent group comprising a moiety selected from the group consisting of amino, cyanato, glycidoxy and thiol groups; 5 to 200 parts by weight of (B) an epoxy resin; a catalytic amount of (C) catalyst for curing the epoxy resin; and (D) an inorganic filler in an amount of from 33 to 300 parts by weight per total 100 parts by weight of the components (A), (B) and (C).
摘要翻译：一种粘合剂组合物，其包含：100重量份的（A）苯氧基树脂，其每分子具有至少一个由下式（I）表示的烷氧基硅烷残基，其中R 1可以彼此相同或不同，并且是取代或未取代的C 1-4烷基，且R 2为取代或未取代的包含选自氨基，氰基，缩水甘油氧基和硫醇基的部分的C1-9一价基团; 5〜200重量份的（B）环氧树脂; 催化量的（C）催化剂，用于固化环氧树脂; 和（D）无机填料的量为33〜300重量份/ 100重量份的成分（A），（B）和（C）。

10. 发明授权

US07683152B2 Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer 有权
标题翻译：部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，制造方法和包含该共聚物的树脂组合物
公开(公告)号：US07683152B2
公开(公告)日：2010-03-23
申请号：US11131197
申请日：2005-05-18
申请人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Hideki Akiba , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： C08G77/24
CPC分类号： C08G77/455 , C08G73/106 , C08L63/00 , C08L79/08 , C08L83/10 , C08L2666/20 , C08L2666/22 , C08L2666/14
摘要： A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.
摘要翻译：提供部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，其包含具有结构式（1）和（2）的重复单元结构，其中X是含芳族或脂族环的四价有机基团，Y1是二胺残基，Y2是二氨基硅氧烷残基，Y1 和Y2分别以99-20摩尔％和1-80摩尔％的量包含在共聚物中，L和m各自为2-50的整数。共聚物对基材的粘合性好，防潮可靠性和低弹性模量。

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