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1. 发明申请

US20180116049A1 STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD 审中-公开
公开(公告)号：US20180116049A1
公开(公告)日：2018-04-26
申请号：US15569647
申请日：2017-01-30
申请人： NIPPON MEKTRON, LTD.
发明人： Masayuki Iwase , Takeo Wakabayashi , Eiji Mizuno
IPC分类号： H05K1/02 , H01R12/77 , H01R43/20 , H01R12/70 , H05K3/00
CPC分类号： H05K1/0281 , B32B25/00 , B32B27/00 , H01R12/7041 , H01R12/771 , H01R43/205 , H05K1/0283 , H05K1/03 , H05K1/14 , H05K3/0011 , H05K3/28 , H05K3/36 , H05K2201/0129 , H05K2201/0133 , H05K2203/065 , H05K2203/0759 , H05K2203/0783
摘要： The stretchable circuit board (100) includes: a stretchable base (10); a stretchable wiring portion (20) formed on the stretchable base (10); a reinforcement base (30) having in-plane rigidity higher than that of the stretchable base (10); a draw-out wiring portion (40) formed on the reinforcement base (30), and electrically continuous with the stretchable wiring portion (20); and an elastomer layer (50) formed on the reinforcement base (30). The reinforcement base (30) overlaps with a partial area (10a) of the stretchable base (10). An other area (10b) of the stretchable base (10) is exposed from the reinforcement base (30). The stretchable wiring portion (20) extends on the other area (10b) and over the partial area (10a). The elastomer layer (50) and the stretchable base (10) are layered and joined with each other.

2. 发明授权

US08482110B2 Electronic assemblies without solder and methods for their manufacture 有权
标题翻译：无焊料的电子组件及其制造方法
公开(公告)号：US08482110B2
公开(公告)日：2013-07-09
申请号：US13185323
申请日：2011-07-18
申请人： Joseph C. Fjelstad
发明人： Joseph C. Fjelstad
IPC分类号： H01L21/00
CPC分类号： H05K1/144 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/185 , H05K1/186 , H05K3/284 , H05K3/4046 , H05K2201/041 , H05K2201/10318 , H05K2203/065 , H05K2203/1316 , H05K2203/1327 , Y10T29/49117 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.
摘要翻译：本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1600,1700。组件400不使用焊料。具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 808到组件引线412.然后组件被电镀1200，并且重复进行封装和钻孔工艺1500以构建所需的层422,1502,1702。组件可以配合1800.在配合的组件内，物品可以被插入，包括销 2202a，2202b和2202c，夹层互连设备2204，散热器2402以及散热器和散热器2602组合。边缘卡连接器2802可以附接到配合的组件。

3. 发明授权

US08222365B2 Polyamideimide resin, as well as a colorless and transparent flexible metal-clad laminate and circuit board obtained therefrom 有权
标题翻译：聚酰胺酰亚胺树脂，以及由其制得的无色透明柔性覆金属层压板和电路板
公开(公告)号：US08222365B2
公开(公告)日：2012-07-17
申请号：US12518302
申请日：2007-12-03
申请人： Katsuya Shimeno , Takeshi Ito , Tomohiro Aoyama , Akira Nishimoto , Shoko Nagata , Tomoharu Kurita
发明人： Katsuya Shimeno , Takeshi Ito , Tomohiro Aoyama , Akira Nishimoto , Shoko Nagata , Tomoharu Kurita
IPC分类号： C08G18/34 , C08G73/14 , B32B27/28
CPC分类号： H05K1/0346 , B32B5/147 , B32B7/12 , B32B15/08 , B32B15/088 , B32B15/18 , B32B15/20 , B32B27/18 , B32B27/20 , B32B27/281 , B32B27/34 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2307/30 , B32B2307/306 , B32B2307/412 , B32B2307/54 , B32B2307/546 , B32B2457/08 , B32B2457/20 , C08G73/14 , C09D179/08 , H05K1/0393 , H05K2201/0108 , H05K2201/0154 , H05K2201/0355 , H05K2203/065 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： This disclosure relates to a polyamideimide resin containing a structure represented by formula (1):
摘要翻译：本发明涉及含有式（1）所示结构的聚酰胺酰亚胺树脂：

4. 发明申请

US20120174387A1 SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS 有权
标题翻译：制造层压电路板的系统
公开(公告)号：US20120174387A1
公开(公告)日：2012-07-12
申请号：US13247574
申请日：2011-09-28
申请人： Anthony FARACI , Gary N. SORTINO
发明人： Anthony FARACI , Gary N. SORTINO
IPC分类号： B23P21/00 , B23Q15/00
CPC分类号： H05K3/4638 , H05K1/0269 , H05K3/00 , H05K3/4691 , H05K2201/09918 , H05K2203/06 , H05K2203/065 , H05K2203/101 , H05K2203/107 , H05K2203/1476 , H05K2203/166 , Y10T29/49126 , Y10T29/49213 , Y10T29/53087 , Y10T29/5317
摘要： The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.
摘要翻译：本发明涉及一种无针对配准和感应加热系统，其涉及使用用于对层压元件的初始位置进行成像的预对准工位，成像和计算机操作控制系统，用于确定所需的校正因子，预对准工位的叠层元件以及用于层压元件的优选堆叠方向，以及用于使用优选的四层结构将层压元件从顶部位置牢固地夹紧，转移和重新定位到优选堆叠方向的对准和传送系统，轴方向。

5. 发明申请

US20120088109A1 LINEAR POLYIMIDE PRECURSOR, LINEAR POLYIMIDE AND HEAT-CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING THEM 审中-公开
标题翻译：线性聚酰亚胺前体，线性聚酰亚胺和热固化产品及其生产方法
公开(公告)号：US20120088109A1
公开(公告)日：2012-04-12
申请号：US12994163
申请日：2009-05-26
申请人： Masatoshi Hasegawa , Naoyuki Kitamura
发明人： Masatoshi Hasegawa , Naoyuki Kitamura
IPC分类号： B32B15/08 , C09J179/08 , C08G73/10
CPC分类号： B32B15/20 , B32B7/12 , B32B15/08 , C08F299/02 , C08G73/1014 , C09J179/08 , H05K3/386 , H05K2201/0154 , H05K2203/065 , Y10T428/31681 , Y10T428/31721
摘要： A linear polyimide is produced from mellophanic dianhydride, diamine (NH2-A-NH2), and a monofunctional acid anhydride and contains a repeating unit represented by the following general formula (3): wherein A represents a divalent aromatic diamine residue or aliphatic diamine residue, B represents a monofunctional acid anhydride residue, and n represents a degree of polymerization.
摘要翻译：线性聚酰亚胺由二茂乙酸二酐（NH2-A-NH2）和单官能酸酐制成，含有下述通式（3）表示的重复单元：其中A表示二价芳族二胺残基或脂族二胺残基 B表示单官能酸酐残基，n表示聚合度。

6. 发明申请

US20100090902A1 MULTILAYER ELECTRONIC COMPONENT SYSTEMS AND METHODS OF MANUFACTURE 有权
标题翻译：多层电子元件系统及其制造方法
公开(公告)号：US20100090902A1
公开(公告)日：2010-04-15
申请号：US11993890
申请日：2005-11-23
申请人： Dane Thompson , Guoan Wang , Nickolas D. Kingsley , Ioannis Papapolumerou , Emmanouil M. Tentzeris , Ramanan Bairavasubramanian 1 , Gerald DeJean , RongLin Li
发明人： Dane Thompson , Guoan Wang , Nickolas D. Kingsley , Ioannis Papapolumerou , Emmanouil M. Tentzeris , Ramanan Bairavasubramanian 1 , Gerald DeJean , RongLin Li
IPC分类号： H01Q1/38 , H01Q5/00
CPC分类号： H01Q1/40 , H01Q5/42 , H01Q21/065 , H01Q21/24 , H05K1/16 , H05K3/4626 , H05K2201/0141 , H05K2203/065 , Y10T29/49016
摘要： Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.
摘要翻译：提供了多层电子元件系统和制造方法。在这方面，示例性系统包括第一层液晶聚合物（LCP），由第一层支撑的第一电子部件和第二层LCP。第一层通过热键连接到第二层。此外，第一电子部件的至少一部分位于第一层和第二层之间。

7. 发明申请

US20090056981A1 THIN FILM-LAMINATED POLYIMIDE FILM AND FLEXIBLE PRINTED WIRING BOARD 审中-公开
标题翻译：薄膜层压聚酰胺薄膜和柔性印刷线路板
公开(公告)号：US20090056981A1
公开(公告)日：2009-03-05
申请号：US11911947
申请日：2005-07-01
申请人： Satoshi Maeda , Keizo Kawahara , Masayuki Tsutsumi , Takefumi Yoshida
发明人： Satoshi Maeda , Keizo Kawahara , Masayuki Tsutsumi , Takefumi Yoshida
IPC分类号： H05K1/18 , B32B27/06 , B32B15/08
CPC分类号： H05K1/0346 , H05K3/181 , H05K3/388 , H05K2201/0154 , H05K2201/0317 , H05K2201/0326 , H05K2203/065 , Y10T428/31681 , Y10T428/31721
摘要： The thin film-laminated polyimide film contains a substrate film and a thin film layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. Use of this thin film-laminated polyimide film as a substrate of electronic parts such as solar battery, capacitor and the like exposed to high temperatures prevents easy development of warpage and distortion during production, and can improve quality and yield of electronic parts.
摘要翻译：薄膜层叠聚酰亚胺膜含有基材膜和在基材膜的至少一个表面上形成的薄膜层。基材膜由聚酰亚胺膜制成，其在300℃下热处理后的卷曲度不大于10％。使用这种薄膜叠层聚酰亚胺薄膜作为暴露于高温的太阳能电池，电容器等电子部件的基板，防止了生产过程中的翘曲和变形的容易发展，并且可以提高电子部件的质量和产量。

8. 发明申请

US20080314629A1 MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：多层基板及其制造方法
公开(公告)号：US20080314629A1
公开(公告)日：2008-12-25
申请号：US11960107
申请日：2007-12-19
申请人： Chih-kuang Yang , Cheng-yi Chang
发明人： Chih-kuang Yang , Cheng-yi Chang
IPC分类号： H05K1/02 , H05K3/38
CPC分类号： H05K3/28 , H05K3/0058 , H05K3/381 , H05K3/4682 , H05K2201/0154 , H05K2203/016 , H05K2203/065 , H05K2203/0759 , H05K2203/095 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.
摘要翻译：公开了多层基板的多层基板和多层基板的制造方法。通过使用载体交替地在其上形成介电层和金属结构层。每个电介质层与相邻的电介质层粘合以将金属结构层嵌入与其对应的电介质层中。与现有技术相比，当热压和粘附不同材料的不同层时，必须使用预浸料，本发明采用较少的工艺，因此在不使用预浸料的情况下，材料种类较少。因此，本发明可以提高制造多层基板的整体质量和产率，以满足多层基板的机械特性匹配并降低整个制造工艺的成本。重要的是，根据本发明的具有薄介电层的多层基板因此可以满足阻抗匹配的关注，并且可以减少串扰影响以保持良好的信号完整性。

9. 发明授权

US07448126B2 Coupler resource module 失效
标题翻译：耦合器资源模块
公开(公告)号：US07448126B2
公开(公告)日：2008-11-11
申请号：US11369300
申请日：2006-03-06
申请人： James J. Logothetis
发明人： James J. Logothetis
IPC分类号： H01P11/00 , H01P3/08 , H05K3/36
CPC分类号： H01L23/66 , H01L24/97 , H01L2223/6627 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/12034 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/1903 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01P3/085 , H01P3/16 , H05K1/0237 , H05K1/056 , H05K1/183 , H05K3/4614 , H05K3/4641 , H05K3/4697 , H05K2203/063 , H05K2203/065 , Y10T29/49016 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , H01L2924/00
摘要： A coupling assembly includes multiple composite substrate layers and a flange layer fusion bonded together in a stacked arrangement. The substrate layers are positioned on top of the flange layer and include embedded signal processing circuitry connected to a signal input and a signal output. A cavity is formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are coupled to the embedded signal processing circuitry and they enable the addition of a circuit element to the assembly after the fusion bonding of the flange and substrate layers, and they enable the coupling of that added element to the signal processing circuitry.
摘要翻译：耦合组件包括多个复合衬底层和以堆叠布置结合在一起的凸缘层熔合。衬底层位于凸缘层的顶部，并且包括连接到信号输入和信号输出的嵌入式信号处理电路。通过衬底层的区域形成空腔以暴露信号连接端子。这些信号连接端子耦合到嵌入式信号处理电路，并且它们使得能够在法兰和衬底层的熔接之后将电路元件添加到组件，并且它们使得能够将该添加的元件耦合到信号处理电路。

10. 发明授权

US07356917B2 Method for manufacturing multi-layer printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US07356917B2
公开(公告)日：2008-04-15
申请号：US11116320
申请日：2005-04-28
申请人： Toshikazu Harada , Koji Kondo
发明人： Toshikazu Harada , Koji Kondo
IPC分类号： H05K3/30 , H05K1/03
CPC分类号： H05K1/0242 , H05K1/024 , H05K3/382 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0191 , H05K2201/0352 , H05K2203/065 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163 , Y10T428/24917
摘要： A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.
摘要翻译：多层印刷电路板包括绝缘基板; 设置在所述绝缘基板的表面上的表面导电图案; 以及嵌入绝缘基板中的内导电图案。表面导电图案在绝缘基板侧具有表面粗糙度，表面导电图案的表面粗糙度大于内部导电图案的表面粗糙度。

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