会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Workpiece carrier device
    • 工件载体装置
    • US08783673B2
    • 2014-07-22
    • US14018118
    • 2013-09-04
    • Oerlikon Trading AG, Trubbach
    • Stefan EsserMartin Zaech
    • B23Q1/25B23Q1/64C23C14/50C23C16/458F16H21/14
    • B23Q1/64C23C14/505C23C16/458F16H21/14
    • A workpiece carrier has a base frame, a shaft surrounding a drive axis and a workpiece carrier and includes a rotary frame mounted on the base frame so as to be rotatable about the drive axis, workpiece holders mounted on the rotary frame so as to be rotatable about holding axes, a driving part with a holder mounted so as to be rotatable about the drive axis, a transmission part operationally connected to the rotatably mounted workpiece holders, and an intermediate gear attached to the rotatably mounted holder. The intermediate gear is connected to the shaft and to the transmission part in such a way that the transmission part engages with the driving part so as to be rotatable about an output point that is spaced apart from the drive axis by an eccentricity.
    • 工件托架具有基座框架,围绕驱动轴线的轴和工件托架,并且包括安装在基架上的旋转框架,以便绕驱动轴线旋转,安装在旋转框架上的工件保持架可旋转 关于保持轴,具有安装成能够围绕驱动轴线旋转的保持器的驱动部,与可旋转地安装的工件保持器可操作地连接的传动部,以及附接到可旋转地安装的保持器的中间齿轮。 中间齿轮以这样的方式连接到轴和传动部分,使得传动部分与驱动部分接合,以便能够围绕与驱动轴线间隔开的偏心的输出点旋转。
    • 8. 发明申请
    • HIGH-POWER PULSE COATING METHOD
    • 高功率脉冲涂层方法
    • US20150167153A1
    • 2015-06-18
    • US14413480
    • 2013-06-24
    • Oerlikon Trading AG, Trubbach
    • Siegfried KrassnitzerDenis Kurapov
    • C23C14/34
    • C23C14/3485C23C14/345C23C14/3464H01J37/3405H01J37/3467H01J2237/332
    • The invention relates to a method for coating substrates by sputtering of target material, the method comprising the following steps:-applying a first sputtering target made of a first material in a coating chamber to a power pulse by which, during a first time interval, a first amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50 W/cm2 and preferably 500 W/cm2;-applying a second sputtering target made of a second material that is different from the first material in the coating chamber to a power pulse by which, during a second time interval, a second amount of energy is transmitted to the sputtering target, wherein the maximum power density exceeds 50 W/cm 2 and preferably 500W/cm2, characterized in that the first amount of energy differs from the second amount of energy.
    • 本发明涉及通过溅射目标材料涂覆基板的方法,该方法包括以下步骤:将由涂覆室中的第一材料制成的第一溅射靶施加到第一时间间隔内的功率脉冲, 第一量的能量被传送到溅射靶,其中最大功率密度超过50W / cm 2,优选为500W / cm 2;使用与涂层中的第一材料不同的第二材料制成的第二溅射靶 在第二时间间隔内将第二量的能量传递到溅射靶,其中最大功率密度超过50W / cm 2,优选为500W / cm 2,其特征在于,第一量的 能量与第二量的能量不同。
    • 9. 发明申请
    • REACTIVE SPUTTERING PROCESS
    • 反应溅射法
    • US20140311892A1
    • 2014-10-23
    • US14362758
    • 2012-11-23
    • Oerlikon Trading AG, Trubbach
    • Siegfried Krassnitzer
    • C23C14/34
    • C23C14/3485C23C14/0094C23C14/3492H01J37/3467H01J37/3485
    • Reactive sputtering in which, by ion bombardment, material is ejected from the surface of a target and transitions to the gas phase. Negative voltage pulses are applied to the target to establish electric current having a current density greater than 0.5 A/cm2 at the target surface, such that the material transitioning to the gas phase is ionized. Reactive gas flow is established and reacts with the material of the target surface. Voltage pulse duration is such that, during the pulse, the target surface where the current flows is at least partly covered most of the time with a compound composed of reactive gas and target material and, consequently, the target surface is in a first intermediate state, and this covering is smaller at the end of the voltage pulse than at the start and, consequently, the target surface is in a second intermediate state at the end of the voltage pulse.
    • 反应溅射,其中通过离子轰击,材料从靶的表面喷射并转变到气相。 向目标施加负电压脉冲,以在目标表面建立电流密度大于0.5A / cm 2的电流,使得转移到气相的材料被电离。 建立反应性气体流动并与目标表面的材料反应。 电压脉冲持续时间使得在脉冲期间,电流流动的目标表面至少部分地被由反应性气体和靶材料组成的化合物大部分地覆盖,因此目标表面处于第一中间状态 并且该覆盖在电压脉冲结束时比在开始时更小,因此,目标表面在电压脉冲结束时处于第二中间状态。