会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • METHOD FOR FABRICATING SEMICONDUCTOR DEVICES WITH FINE PATTERNS
    • 用精细图案制作半导体器件的方法
    • US20120214103A1
    • 2012-08-23
    • US13030533
    • 2011-02-18
    • Ming Kang WeiPei Lin HuangYi Ming WangYing Chung Tseng
    • Ming Kang WeiPei Lin HuangYi Ming WangYing Chung Tseng
    • G03F7/20
    • H01L21/31144G03F7/094G03F7/095H01L21/0274
    • A method for fabricating semiconductor devices with fine patterns includes the steps of providing a semiconductor substrate, forming a first photoresist layer on the semiconductor substrate, forming a second photoresist layer on the first photoresist layer, and performing an exposing process to change the state of at least one first portion of the first photoresist layer and the state of at least one second portion of the second photoresist layer. The conventional double patterning technique requires that the exposure processes be performed twice, which requires very precise alignment between the two exposure processes. In contrast, the embodiment of the present invention can perform the double patterning process with only one exposure process without requiring the precise alignment between the two exposure processes.
    • 用于制造具有精细图案的半导体器件的方法包括以下步骤:提供半导体衬底,在半导体衬底上形成第一光致抗蚀剂层,在第一光致抗蚀剂层上形成第二光致抗蚀剂层,以及执行曝光过程以改变 第一光致抗蚀剂层的至少一个第一部分和第二光致抗蚀剂层的至少一个第二部分的状态。 传统的双重图案化技术要求曝光过程进行两次,这需要两次曝光过程之间非常精确的对准。 相反,本发明的实施例可以仅用一次曝光工艺进行双重图案化处理,而不需要两次曝光过程之间的精确对准。
    • 5. 发明授权
    • Pixel structure
    • 像素结构
    • US07675078B2
    • 2010-03-09
    • US11162528
    • 2005-09-14
    • Liang-Yuan WangChih-Kwang TzenPei-Lin HuangYi-Lung KaoYa-Ping TsaiShuenn-Jiun Tang
    • Liang-Yuan WangChih-Kwang TzenPei-Lin HuangYi-Lung KaoYa-Ping TsaiShuenn-Jiun Tang
    • H01L31/0216H01L31/0232
    • H01L51/5265H01L27/3244
    • A pixel structure including a control unit, an organic electro-luminescent (OEL) unit, and a filter structure is provided. The control unit is disposed on a substrate and is driven by a scan line and a data line. The OEL unit is disposed on the substrate, and includes a transparent electrode, a light-emitting layer, and a metal electrode. The transparent electrode is electrically connected with the control unit, and the light-emitting layer and the metal electrode are sequentially placed on the transparent electrode. The filter structure is sandwiched between the substrate and the OEL unit, and the filter structure includes a plurality of the first and second dielectric layers. The first and second dielectric layers are alternately stacked, and the refractive index of the first dielectric layers is different from that of the second dielectric layers.
    • 提供了包括控制单元,有机电致发光(OEL)单元和滤波器结构的像素结构。 控制单元设置在基板上并由扫描线和数据线驱动。 OEL单元设置在基板上,并且包括透明电极,发光层和金属电极。 透明电极与控制单元电连接,并且发光层和金属电极依次放置在透明电极上。 过滤器结构被夹在基板和OEL单元之间,并且过滤器结构包括多个第一和第二电介质层。 第一和第二电介质层交替层叠,并且第一电介质层的折射率不同于第二电介质层的折射率。
    • 6. 发明申请
    • TOUCH PEN
    • 触摸笔
    • US20120280949A1
    • 2012-11-08
    • US13462560
    • 2012-05-02
    • Pei-Lin HUANG
    • Pei-Lin HUANG
    • G06F3/033
    • G02B27/20G06F3/03542G06F3/03545
    • A touch pen comprises a barrel, a laser module, a touch head and batteries: the barrel with a hollow interior which is separated into a barrel part and a necking nib part; the laser module which is disposed in the barrel and close to the nib part for generation of a laser beam as one pointer; the touch head featuring conductivity, covering the nib part and provided with a penetrating optical channel for a laser beam; the batteries held in the barrel part and supplying electricity necessary to the laser module; the touch pen is applicable to operation of a capacitive touch panel and regarded as one pointer projecting a laser spot.
    • 触摸笔包括镜筒,激光模块,触摸头和电池:具有中空内部的镜筒,其分离成镜筒部分和颈缩笔尖部分; 所述激光模块设置在所述镜筒中并且靠近所述笔尖部分以产生作为指针的激光束; 触摸头具有导电性,覆盖笔尖部分,并具有用于激光束的穿透光通道; 电池保持在筒体中并供应激光模块所需的电力; 触摸笔适用于电容式触摸屏的操作,并被认为是投射激光点的一个指针。
    • 7. 发明授权
    • Semiconductor manufacturing process
    • 半导体制造工艺
    • US08142086B2
    • 2012-03-27
    • US12907035
    • 2010-10-19
    • Pei-Lin HuangYi-Ming WangChun-Yen Huang
    • Pei-Lin HuangYi-Ming WangChun-Yen Huang
    • G03D5/00
    • G03D5/00
    • A semiconductor manufacturing process is provided. First, a wafer with a material layer and an exposed photoresist layer formed thereon is provided, wherein the wafer has a center area and an edge area. Thereafter, the property of the exposed photoresist layer is varied, so as to make a critical dimension of the exposed photoresist layer in the center area different from that of the same in the edge area. After the edge property of the exposed photoresist layer is varied, an etching process is performed to the wafer by using the exposed photoresist layer as a mask, so as to make a patterned material layer having a uniform critical dimension formed on the wafer.
    • 提供半导体制造工艺。 首先,提供其上形成有材料层和曝光的光致抗蚀剂层的晶片,其中晶片具有中心区域和边缘区域。 此后,暴露的光致抗蚀剂层的性质是变化的,以便使得在边缘区域中的不同于中心区域的曝光光致抗蚀剂层的临界尺寸不同。 在暴露的光致抗蚀剂层的边缘性质改变之后,通过使用暴露的光致抗蚀剂层作为掩模对晶片进行蚀刻处理,以便在晶片上形成具有均匀临界尺寸的图案化材料层。