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1. 发明授权

US08525016B2 Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems 有权
标题翻译：包括具有偏置金属焊盘的热电元件和相关结构，方法和系统的热电装置
公开(公告)号：US08525016B2
公开(公告)日：2013-09-03
申请号：US12731546
申请日：2010-03-25
申请人： Philip A. Deane , Ramaswamy Mahadevan , Edward P. Siivola
发明人： Philip A. Deane , Ramaswamy Mahadevan , Edward P. Siivola
IPC分类号： H01L35/02 , H01L37/00
CPC分类号： H01L35/08 , H01L35/32
摘要： A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.
摘要翻译：热电装置可以包括包括热电材料层并具有相对的第一和第二表面的热电元件。可以在热电元件的第一表面上设置第一金属焊盘，并且可以在热电元件的第二表面上设置第二金属焊盘。此外，第一和第二金属焊盘可以在相对于热电元件的第一和第二表面平行的方向上偏移。还讨论了相关方法。

2. 发明申请

US20110132000A1 Thermoelectric Heating/Cooling Structures Including a Plurality of Spaced Apart Thermoelectric Components 审中-公开
标题翻译：包括多个间隔热电组件的热电加热/冷却结构
公开(公告)号：US20110132000A1
公开(公告)日：2011-06-09
申请号：US12963750
申请日：2010-12-09
申请人： Philip A. Deane , Edward P. Siivola , Paul Crocco , Ramaswamy Mahadevan
发明人： Philip A. Deane , Edward P. Siivola , Paul Crocco , Ramaswamy Mahadevan
IPC分类号： F25B21/04
CPC分类号： F25B21/04 , G01R31/2874
摘要： A thermoelectric heating/cooling structure may include a heat exchanger and a heat spreader spaced apart from the heat exchanger. In addition, a plurality of spaced apart thermoelectric components may be thermally coupled in parallel between the heat exchanger and the heat spreader. More particularly, each of the thermoelectric components may include a first header adjacent the heat exchanger, a second header adjacent the heat spreader, and a plurality of thermoelectric elements thermally coupled in parallel between the first and second headers. The first headers of the thermoelectric components may be spaced apart adjacent the heat exchanger, and the second headers of the thermoelectric components may be spaced apart adjacent the heat spreader.
摘要翻译：热电加热/冷却结构可以包括热交换器和与热交换器间隔开的散热器。此外，多个间隔开的热电组件可以在热交换器和散热器之间并联热耦合。更具体地，每个热电部件可以包括邻近热交换器的第一集管，邻近散热器的第二集管和在第一和第二集管之间并联热耦合的多个热电元件。热电部件的第一集管可以邻近热交换器间隔开，并且热电部件的第二集管可以在散热器附近间隔开。

3. 发明授权

US06618518B1 Microelectromechanical optical cross-connect switches including row and column addressing and methods of operating same 有权
标题翻译：微机电光学交叉开关，包括行和列寻址以及操作方法
公开(公告)号：US06618518B1
公开(公告)日：2003-09-09
申请号：US09721415
申请日：2000-11-22
申请人： Ramaswamy Mahadevan , Vivek Agrawal
发明人： Ramaswamy Mahadevan , Vivek Agrawal
IPC分类号： G02B626
CPC分类号： G02B6/357 , G02B6/3518 , G02B6/3542 , G02B6/3546 , G02B6/358 , G02B6/3584 , H04Q11/0005 , H04Q2011/0024 , H04Q2011/003 , H04Q2011/0039 , H04Q2011/0058
摘要： Optical cross-connect switches include input optical paths, output optical paths, and an array of electromechanical optical switches such as movable reflectors that are arranged in rows of the electromechanical optical switches and columns of the electromechanical optical switches, and that selectively move to couple the input optical paths to the output optical paths. Row address lines also are provided, a respective one of which is electromagnetically (i.e. electrically and/or optically) coupled to a respective row of the electromechanical optical switches. Column address lines also are provided, a respective one of which is electromagnetically coupled to a respective column of the electromechanical optical switches. If there are n2 electromechanical optical switches that couple n optical paths to n optical output paths, less than n2 row and column address lines may be provided. Preferably, 2n row and column address lines may be provided. The electromechanical optical switches may be configured upon selection of the respective row address line and column address line, but not selected upon selection of neither or only one of the respective row address line and column address line. Alternatively, the electromechanical optical switches may be configured to be selected except for an electromechanical optical switch that is electromagnetically coupled to the respective row address line and column address line.
摘要翻译：光学交叉连接开关包括输入光路，输出光路，以及诸如可移动反射器的机电光学开关的阵列，其被布置成机电光开关的列和机电光开关的列，并且选择性地移动以耦合输入光路到输出光路。还提供了行地址线，其相应的一个电磁（即电和/或光）耦合到机电光开关的相应行。还提供列地址线，其相应的一个电磁耦合到机电光开关的相应列。如果存在将n个光路耦合到n个光输出路径的n2个机电光开关，则可以提供少于n2行和列地址线。优选地，可以提供2n行和列地址行。可以在选择相应的行地址线和列地址线之后配置机电光学开关，但是在选择相应的行地址线和列地址线中的一个或仅一个之后不进行选择。或者，机电式光开关可以被配置为除了电磁耦合到相应行地址线和列地址线的机电光开关之外。

4. 发明授权

US06366186B1 Mems magnetically actuated switches and associated switching arrays 失效
标题翻译： Mems磁力驱动开关和相关的开关阵列
公开(公告)号：US06366186B1
公开(公告)日：2002-04-02
申请号：US09487976
申请日：2000-01-20
申请人： Edward A. Hill , Ramaswamy Mahadevan
发明人： Edward A. Hill , Ramaswamy Mahadevan
IPC分类号： H01H5122
CPC分类号： H01H50/005 , H01H67/22 , H01H2001/0078 , H01H2036/0093
摘要： A MEMS electrical cross-point switch is provided that includes a microelectronic substrate, a magnetic element attached to the microelectronic substrate that is free to move in a predetermined direction in response to a magnetic field and an electrical element connected to the magnetic element for movement therewith to selectively switch electric current. In one embodiment the magnetic element and the electrical element are connected via a tethering device that acts as a platform for the magnetic and electrical elements. The electrical cross-point switch may also comprise a clamping element that serves to lock the switch in an open or closed position to circumvent the magnetic actuation of the switch. In another embodiment, the invention provides for a MEMS electrical cross-point switching array that includes a microelectronic substrate, a magnetic field source in circuit with said microelectronic substrate, a plurality of first and second electrical lines disposed on the microelectronic substrate in an array formation, and a plurality of the in-plane MEMS electrical cross-point switches as described above disposed at the cross point of a first and second electrical line. In one embodiment the array is configured in a N×N or N×M array having a series of crossing first and second electrical load lines. In another configuration the array has a series of first electrical load lines that extend radially from a central point of reference and a series of second electrical load lines that extend outward, in spoke-like fashion, from the central point of reference.
摘要翻译：提供了一种MEMS电交叉点开关，其包括微电子衬底，附接到微电子衬底的磁性元件，其响应于磁场而在预定方向上自由移动，并且连接到磁性元件的电气元件用于与其一起运动以选择性地切换电流。在一个实施例中，磁性元件和电气元件通过用作磁性元件和电气元件的平台的束缚装置连接。电交叉点开关还可以包括夹紧元件，其用于将开关锁定在打开或关闭位置，以绕开开关的磁致动。在另一个实施例中，本发明提供了一种MEMS电交叉点开关阵列，其包括微电子衬底，与所述微电子衬底的电路中的磁场源，设置在微电子衬底上的阵列形成中的多个第一和第二电线以及设置在第一和第二电线的交叉点处的多个如上所述的面内MEMS电气交叉点开关。在一个实施例中，阵列被配置在具有一系列交叉的第一和第二电负载线的N×N或N×M阵列中。在另一种配置中，阵列具有从中心参考点径向延伸的一系列第一电负载线，以及一系列第二电负载线，其以辐射状方式从中心参考点向外延伸。

5. 发明授权

US06333583B1 Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams 失效
标题翻译：微机电系统包括加热器上的热致动梁，其与热致动梁一起移动
公开(公告)号：US06333583B1
公开(公告)日：2001-12-25
申请号：US09537588
申请日：2000-03-28
申请人： Ramaswamy Mahadevan , Edward A. Hill , Robert L. Wood , Allen Cowen
发明人： Ramaswamy Mahadevan , Edward A. Hill , Robert L. Wood , Allen Cowen
IPC分类号： H01N1000
CPC分类号： B81B3/0024 , B81B2201/031 , B81B2203/0109 , B81B2203/051 , F03G7/06 , H01H1/0036 , H01H61/02 , H01H2001/0068 , H01H2061/006
摘要： Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.
摘要翻译：改进的微机电结构包括微电子衬底上的间隔开的支撑件和在间隔开的支撑件之间延伸的梁，并且在施加热量时膨胀，从而导致梁在间隔开的支撑件之间的位移。位于梁上的加热器对梁施加热量，并随着梁的移位而与梁一起移位。因此，可以将热量直接施加到拱形梁上，从而减少加热器与拱形梁之间的热损失。此外，加热器和拱形梁之间的空气间隙可能不需要被加热，从而允许改善的瞬态热响应。此外，当拱形梁移位时移动加热器可以通过当拱形梁移位时减小加热器和拱形梁之间的间隔来进一步减少热损失和瞬态热响应。

6. 发明授权

US5994816A Thermal arched beam microelectromechanical devices and associated fabrication methods 失效
标题翻译：热拱形梁微机电装置及相关制造方法
公开(公告)号：US5994816A
公开(公告)日：1999-11-30
申请号：US936598
申请日：1997-09-24
申请人： Vijayakumar R. Dhuler , Robert L. Wood , Ramaswamy Mahadevan
发明人： Vijayakumar R. Dhuler , Robert L. Wood , Ramaswamy Mahadevan
IPC分类号： B81B3/00 , B81C1/00 , F03G7/06 , F15C5/00 , F16K99/00 , G02B6/38 , G02B6/42 , H01H1/00 , H01H9/14 , H01H61/00 , H01H61/02 , H01H65/00 , H01H67/26 , H04Q1/16 , H02K15/00
CPC分类号： F16K99/0001 , B81B3/0024 , B81B3/0054 , F03G7/06 , F15C5/00 , F16K99/0011 , F16K99/0044 , H01H1/0036 , H01H61/02 , B81B2201/031 , B81B2201/054 , B81B2203/0109 , B81B2203/051 , F16K2099/0071 , F16K2099/0074 , F16K2099/008 , F16K99/0034 , G02B6/3803 , G02B6/4226 , H01H2001/0042 , H01H2001/0047 , H01H2001/0068 , H01H2061/006 , H01H61/00 , H01H67/26 , H01H9/14 , Y10T29/49105
摘要： A MEMS actuator is provided that produces significant forces and displacements while consuming a reasonable amount of power. The MEMS actuator includes a microelectronic substrate, spaced apart supports on the substrate and a metallic arched beam extending between the spaced apart supports. The MEMS actuator also includes a heater for heating the arched beam to cause further arching of the beam. In order to effectively transfer heat from the heater to the metallic arched beam, the metallic arched beam extends over and is spaced, albeit slightly, from the heater. As such, the MEMS actuator effectively converts the heat generated by the heater into mechanical motion of the metallic arched beam. A family of other MEMS devices, such as relays, switching arrays and valves, are also provided that include one or more MEMS actuators in order to take advantage of its efficient operating characteristics. In addition, a method of fabricating a MEMS actuator is further provided.
摘要翻译：提供了一种MEMS致动器，其在消耗合理的功率的同时产生显着的力和位移。 MEMS致动器包括微电子基板，在基板上的间隔开的支撑件和在间隔开的支撑件之间延伸的金属拱形梁。 MEMS致动器还包括用于加热拱形梁以进一步拱起梁的加热器。为了有效地将热量从加热器传递到金属拱形梁，金属拱形梁从加热器延伸过去并且稍微间隔开。因此，MEMS致动器有效地将由加热器产生的热量转换成金属拱形梁的机械运动。还提供了一系列其它MEMS器件，例如继电器，开关阵列和阀，其包括一个或多个MEMS致动器以便利用其有效的操作特性。此外，还提供了一种制造MEMS致动器的方法。

7. 发明授权

US09601677B2 Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces 有权
公开(公告)号：US09601677B2
公开(公告)日：2017-03-21
申请号：US13048191
申请日：2011-03-15
申请人： Edward P. Siivola , Ramaswamy Mahadevan
发明人： Edward P. Siivola , Ramaswamy Mahadevan
IPC分类号： H01L35/32
CPC分类号： H01L35/32
摘要： A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.

8. 发明申请

US20110220162A1 Thermoelectric (TE) Devices/Structures Including Thermoelectric Elements with Exposed Major Surfaces 有权
标题翻译：热电（TE）器件/结构包括具有暴露的主表面的热电元件
公开(公告)号：US20110220162A1
公开(公告)日：2011-09-15
申请号：US13048191
申请日：2011-03-15
申请人： Edward P. Siivola , Ramaswamy Mahadevan
发明人： Edward P. Siivola , Ramaswamy Mahadevan
IPC分类号： H01L35/28
CPC分类号： H01L35/32
摘要： A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.
摘要翻译：热电结构可以包括导热基板和布置在导热基板的表面上的多个热电元件。此外，每个热电元件可以相对于导热基板的表面是不平行的和非正交的。例如，每个热电元件可以是平面热电元件，并且每个热电元件的平面可以相对于导热基板的表面倾斜地取向。

9. 发明授权

US06396975B1 MEMS optical cross-connect switch 有权
标题翻译： MEMS光交叉连接开关
公开(公告)号：US06396975B1
公开(公告)日：2002-05-28
申请号：US09489264
申请日：2000-01-21
申请人： Robert L. Wood , Edward A. Hill , Ramaswamy Mahadevan
发明人： Robert L. Wood , Edward A. Hill , Ramaswamy Mahadevan
IPC分类号： G02B626
CPC分类号： G02B6/3572 , G02B6/3512 , G02B6/3546 , G02B6/3582 , G02B6/3584 , G02B26/085
摘要： A microelectromechanical structure capable of switching optical signals from an input fiber to one of two or more output fibers. In one embodiment, the MEMS optical cross-connect switch comprises a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a rotational magnetic field source, such as a variably controlled magnetic field source. The rotational magnetic field source allows for reliable actuation of the pop-up mirror from a non-reflective state to a reflective state. Additionally the invention is embodied in a MEMS optical cross-connect switch having a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a positioning structure disposed in a fixed positional relationship relative to the first substrate. The positioning structure may comprise a positioning structure extending from a second microelectronic substrate that is in a fixed positional relationship relative to the first microelectronic substrate. The positioning structure serves to restrict further movement of the pop-up mirror when the pop-up mirror has been actuated into a reflective state.
摘要翻译：一种能够将光信号从输入光纤切换到两个或更多个输出光纤之一的微机电结构。在一个实施例中，MEMS光学交叉连接开关包括具有设置在基板的表面上的弹出反射镜的第一微电子基板和诸如可变控制的磁场源的旋转磁场源。旋转磁场源允许将弹出反射镜从非反射状态可靠地致动到反射状态。另外，本发明体现在具有第一微电子衬底的MEMS光学交叉连接开关中，第一微电子衬底具有设置在衬底的表面上的弹出反射镜和相对于第一衬底以固定位置关系设置的定位结构。定位结构可以包括从相对于第一微电子衬底处于固定位置关系的第二微电子衬底延伸的定位结构。当弹起反射镜已经被启动成反射状态时，定位结构用于限制弹出反射镜的进一步移动。

10. 发明授权

US06262512B1 Thermally actuated microelectromechanical systems including thermal isolation structures 有权
标题翻译：热致动微机电系统，包括热隔离结构
公开(公告)号：US06262512B1
公开(公告)日：2001-07-17
申请号：US09436939
申请日：1999-11-08
申请人： Ramaswamy Mahadevan
发明人： Ramaswamy Mahadevan
IPC分类号： H02N1000
CPC分类号： H01H1/0036 , F16K31/002 , H01H61/02 , H01H2061/006
摘要： Microelectromechanical structures include a microelectronic substrate and spaced apart supports on the microelectronic substrate. A beam extends between the spaced apart supports and expands upon application of heat thereto, to thereby cause displacement of the beam between the spaced apart supports. The application of heat to the beam creates a thermal conduction path from the beam through the spaced apart supports and into the substrate. A thermal isolation structure in the heat conduction path reduces thermal conduction from the beam, through the spaced apart supports and into the substrate, compared to absence of the thermal isolation structure. The thermal isolation structure preferably has lower thermal conductivity than the beam and the supports. The heat that remains in the beam thereby can be increased. The thermal isolation structure may include a thermally insulating structure at each end of the beam, a thermally insulating structure in each spaced apart support, a thermally insulating structure in the substrate adjacent each spaced apart support, and/or at least one thermally insulating structure in the beam. Accordingly, improved thermal efficiency for microelectromechanical structures may be provided, to thereby allow lower power, higher deflection, larger force and/or higher speed.
摘要翻译：微机电结构包括微电子衬底和微电子衬底上的间隔开的支撑。梁在间隔开的支撑件之间延伸并且在施加热量时膨胀，从而导致梁在间隔开的支撑件之间的位移。向梁施加热量产生从光束通过间隔开的支撑件并进入衬底的热传导路径。与不存在热隔离结构相比，热传导路径中的热隔离结构减少了来自梁的热传导，通过间隔开的支撑件并进入衬底。隔热结构优选具有比梁和支撑件更低的热导率。由此可以增加留在光束中的热量。热隔离结构可以包括在梁的每个端部处的隔热结构，每个间隔开的支撑件中的隔热结构，邻近每个间隔开的支撑件的衬底中的隔热结构，和/或至少一个隔热结构梁。因此，可以提供用于微机电结构的改善的热效率，从而允许更低的功率，更高的偏转，更大的力和/或更高的速度。

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