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    • 10. 发明授权
    • Power converter
    • 电源转换器
    • US08693193B2
    • 2014-04-08
    • US13194352
    • 2011-07-29
    • Satoshi IshibashiToshio WatanabeShinsuke Idenoue
    • Satoshi IshibashiToshio WatanabeShinsuke Idenoue
    • H05K7/20
    • H02M7/003H01L23/473H01L23/642H01L25/117H01L2924/0002H05K7/209H01L2924/00
    • In a power converter in which semiconductor modules are arranged on both surfaces of a cooler for downsizing, an excellent connection between control boards and a low inductance connection between smoothing capacitors and the semiconductor modules are performed at the same time. The semiconductor modules are disposed on both surfaces of the cooler, and control boards that control the semiconductor modules are arranged opposite to the respective semiconductor modules. The semiconductor modules and the cooler are held between the control boards. A current detector or a terminal block is disposed at a position perpendicular to a surface on which the cooler and the semiconductor modules contact each other, opposite to the cooler. The respective control boards disposed on both surfaces of the cooler are electrically connected by using wirings provided in the current detector or the terminal block.
    • 在其中半导体模块布置在用于小型化的冷却器的两个表面上的功率转换器中,同时执行控制板之间良好的连接和平滑电容器与半导体模块之间的低电感连接。 半导体模块设置在冷却器的两个表面上,并且控制半导体模块的控制板布置成与各个半导体模块相对。 半导体模块和冷却器保持在控制板之间。 电流检测器或端子块设置在垂直于冷却器和半导体模块与冷却器相对的表面的位置。 设置在冷却器的两个表面上的各个控制板通过使用设置在电流检测器或端子块中的配线电连接。