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    • 2. 发明授权
    • Plasma processing system ESC high voltage control and methods thereof
    • 等离子体处理系统ESC高压控制及其方法
    • US07983018B2
    • 2011-07-19
    • US12848970
    • 2010-08-02
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • H01L21/683H01T23/00
    • H01L21/6831H01L21/67069Y10T29/49998Y10T279/23
    • An arrangement for securing a wafer during substrate processing is provided. The arrangement includes a power supply and an electrostatic chuck (ESC). The ESC supports the wafer and includes a positive and a negative terminal. A positive high voltage is provided to the positive terminal through an RF filter and a negative high voltage is provided to the negative terminal through the RF filter. The arrangement also includes a first and a second trans-impedance amplifiers (TIAs) that measure a first set of voltages for determining a value of a positive load current applied to the positive terminal and a third and fourth TIAs that measure a second set of voltages for determining a value of a negative load current applied to the negative terminal. The arrangement yet also includes a program to adjust a bias voltage using the values of the positive load current and the negative load current.
    • 提供了一种用于在衬底处理期间固定晶片的布置。 该装置包括电源和静电卡盘(ESC)。 ESC支持晶片,并包括正极和负极。 通过RF滤波器向正端子提供正高电压,并通过RF滤波器将负高压提供给负极端子。 该装置还包括测量第一组电压以确定施加到正极端子的正负载电流的值的第一和第二跨阻放大器(TIA),以及测量第二组电压的第三和第四TIA 用于确定施加到负极端子的负载电流的值。 该装置还包括使用正负载电流和负负载电流的值来调节偏置电压的程序。
    • 3. 发明申请
    • PLASMA PROCESSING SYSTEM ESC HIGH VOLTAGE CONTROL AND METHODS THEREOF
    • 等离子体处理系统ESC高压控制及其方法
    • US20110051307A1
    • 2011-03-03
    • US12848970
    • 2010-08-02
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • H01L21/683
    • H01L21/6831H01L21/67069Y10T29/49998Y10T279/23
    • An arrangement for securing a wafer during substrate processing is provided. The arrangement includes a power supply and an electrostatic chuck (ESC). The ESC supports the wafer and includes a positive and a negative terminal. A positive high voltage is provided to the positive terminal through an RF filter and a negative high voltage is provided to the negative terminal through the RF filter. The arrangement also includes a first and a second trans-impedance amplifiers (TIAs) that measure a first set of voltages for determining a value of a positive load current applied to the positive terminal and a third and fourth TIAs that measure a second set of voltages for determining a value of a negative load current applied to the negative terminal. The arrangement yet also includes a program to adjust a bias voltage using the values of the positive load current and the negative load current.
    • 提供了一种用于在衬底处理期间固定晶片的布置。 该装置包括电源和静电卡盘(ESC)。 ESC支持晶片,并包括正极和负极。 通过RF滤波器向正端子提供正高电压,并通过RF滤波器将负高压提供给负极端子。 该装置还包括测量第一组电压以确定施加到正极端子的正负载电流的值的第一和第二跨阻放大器(TIA),以及测量第二组电压的第三和第四TIA 用于确定施加到负极端子的负载电流的值。 该装置还包括使用正负载电流和负负载电流的值来调节偏置电压的程序。
    • 5. 发明授权
    • Adjusting current ratios in inductively coupled plasma processing systems
    • 在电感耦合等离子体处理系统中调整电流比
    • US09305750B2
    • 2016-04-05
    • US12728112
    • 2010-03-19
    • Maolin LongSeyed Jafar Jafarian-Tehrani
    • Maolin LongSeyed Jafar Jafarian-Tehrani
    • C23C16/00H01L21/306H01J37/32H05H1/46
    • H01J37/32174H01J37/321H01J37/3211H01J37/32137H01J37/32183H05H1/46H05H2001/4652H05H2001/4667
    • A plasma processing system for generating plasma to process at least a wafer. The plasma processing system may include a first coil for conducting a first current for sustaining at least a first portion of the plasma. The plasma processing system may also include a second coil for conducting a second current for sustaining at least a second portion of the plasma. The plasma processing system may also include a power source for powering the first current and the second current. The plasma processing system may also include a parallel circuit for adjusting one of the amperage of the first current and the amperage of the second current. The parallel circuit may be electrically coupled between the power source and at least one of the first coil and the second coil. The parallel circuit may include an inductor and a variable capacitor electrically connected in parallel to each other.
    • 一种用于产生等离子体以处理至少晶片的等离子体处理系统。 等离子体处理系统可以包括用于传导第一电流以维持等离子体的至少第一部分的第一线圈。 等离子体处理系统还可以包括用于传导第二电流以维持等离子体的至少第二部分的第二线圈。 等离子体处理系统还可以包括用于为第一电流和第二电流供电的电源。 等离子体处理系统还可以包括并联电路,用于调节第一电流的电流强度和第二电流的电流强度之一。 并联电路可以电耦合在电源和第一线圈和第二线圈中的至少一个之间。 并联电路可以包括彼此并联电连接的电感器和可变电容器。
    • 6. 发明授权
    • Systems for detecting unconfined-plasma events
    • 无侧限等离子体事件检测系统
    • US09074285B2
    • 2015-07-07
    • US12101804
    • 2008-04-11
    • John PeaseSeyed Jafar Jafarian-Tehrani
    • John PeaseSeyed Jafar Jafarian-Tehrani
    • C23C16/00C23F4/00H01J37/32H05H1/00
    • C23F4/00H01J37/32935H05H1/0081
    • A system for detecting unconfined-plasma events in a plasma processing chamber is disclosed. The system may include a sensor disposed in the plasma processing chamber for providing a current when unconfined plasma is present in the plasma processing chamber. The system may also include a converter for converting the current into a voltage and a filter for removing noise from the voltage to provide a first signal. The system may also include a detector for determining presence of the unconfined plasma using an amplified level of the first signal and/or the first signal. The system may also include a conductor for coupling the sensor and the converter to conduct the current from the sensor to the converter. The system may also include a shield for enclosing at least a portion of the conductor to at least reduce electromagnetic noise received by the conductor.
    • 公开了一种用于检测等离子体处理室中的无约束等离子体事件的系统。 该系统可以包括设置在等离子体处理室中的传感器,用于当等离子体处理室中存在无约束等离子体时提供电流。 该系统还可以包括用于将电流转换成电压的转换器和用于从电压去除噪声以提供第一信号的滤波器。 该系统还可以包括用于使用第一信号和/或第一信号的放大电平来确定无约束等离子体的存在的检测器。 该系统还可以包括用于耦合传感器和转换器以将电流从传感器传导到转换器的导体。 该系统还可以包括用于封闭导体的至少一部分以至少降低由导体接收的电磁噪声的屏蔽。
    • 7. 发明申请
    • ESC HIGH VOLTAGE CONTROL AND METHODS THEREOF
    • ESC高压控制及其方法
    • US20120018095A1
    • 2012-01-26
    • US13185339
    • 2011-07-18
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • C23F1/08B23Q7/00C23C16/52C23C16/458C23C16/50
    • H01L21/6831H01L21/67069Y10T29/49998Y10T279/23
    • A plasma processing system for processing a wafer is provided. The system includes an electrostatic chuck (ESC) positioned inside a plasma processing chamber and configured to support the wafer. The ESC includes a positive terminal for providing a first force to the wafer and a negative terminal for providing a second force to the wafer. The system also includes a first circuit arrangement configured to measure at least a first voltage for determining a value of a positive load current applied to the positive terminal. The system further includes a second circuit arrangement configured to measure at least a second voltage for determining a value of a negative load current applied to the negative terminal. The system yet also includes circuitry configured to adjust a bias voltage using the values of the positive load current and the negative load current for balancing the first force and the second force.
    • 提供了一种用于处理晶片的等离子体处理系统。 该系统包括位于等离子体处理室内的并配置成支撑晶片的静电卡盘(ESC)。 ESC包括用于向晶片提供第一力的正端子和用于向晶片提供第二力的负端子。 该系统还包括配置成测量至少第一电压以确定施加到正极端子的正负载电流的值的第一电路装置。 该系统还包括第二电路装置,其配置成测量至少一个第二电压,用于确定施加到负极端子的负载电流的值。 该系统还包括被配置为使用正负载电流和负负载电流的值来调整偏置电压的电路,用于平衡第一力和第二力。
    • 8. 发明申请
    • ARRANGEMENTS FOR DETECTING DISCONTINUITY OF FLEXIBLE CONNECTIONS FOR CURRENT FLOW AND METHODS THEREOF
    • 用于检测电流流动的柔性连接不连续的安排及其方法
    • US20100271040A1
    • 2010-10-28
    • US12431593
    • 2009-04-28
    • SEYED JAFAR JAFARIAN-TEHRANI
    • SEYED JAFAR JAFARIAN-TEHRANI
    • G01R31/02G01R27/00
    • G01R31/026H01J37/32568H01J37/32577H01J37/32935
    • A detection circuit arrangement in a plasma processing chamber having movable lower electrode is provided. The arrangement includes flexible connector having a first flexible connector end, a second flexible connector end and at least a slit. At least portion of the slit is disposed in a direction parallel to a line drawn between two flexible connector ends. One end is coupled to the movable lower electrode and another end is coupled to a component of the plasma processing chamber. Flexible connector provides low impedance current path between the movable lower electrode and the component of the plasma processing chamber. The arrangement also includes means for detecting current flow through conductor material disposed on one side of the slit. The means for detecting includes at least a coil wound around the conductor material and a detector circuit coupled to the coil for detecting the current flow interruption due to a tear.
    • 提供具有可移动下电极的等离子体处理室中的检测电路装置。 该装置包括具有第一柔性连接器端,第二柔性连接器端和至少狭缝的柔性连接器。 狭缝的至少一部分设置在平行于两个柔性连接器端之间的线的方向上。 一端连接到可移动的下电极,另一端与等离子体处理室的部件连接。 柔性连接器在可动下电极和等离子体处理室的部件之间提供低阻抗电流通路。 该装置还包括用于检测设置在狭缝一侧的通过导体材料的电流的装置。 用于检测的装置包括至少缠绕在导体材料上的线圈和耦合到线圈的检测器电路,用于检测由于撕裂引起的电流流动中断。
    • 9. 发明授权
    • Methods and array for creating a mathematical model of a plasma processing system
    • 用于创建等离子体处理系统的数学模型的方法和阵列
    • US07435926B2
    • 2008-10-14
    • US10816211
    • 2004-03-31
    • Seyed Jafar Jafarian-Tehrani
    • Seyed Jafar Jafarian-Tehrani
    • B23K10/00
    • H01J37/32082H01J37/32935H05H1/46
    • A method of creating a simplified equivalent circuit model of a plasma processing system, including an electrical measuring device, a lower electrode, an upper electrode, and a signal generator device is described. The method includes creating a simplified equivalent circuit equation, including a set of variables, of the plasma processing system, wherein the electrical measuring device comprises a first subset of variables, the lower electrode comprises a second subset of variables, the upper electrode comprises a third subset of variables, and the signal generator device comprises a forth subset of variables. The method also includes generating a set of signals, each of the set of signals being generated at a different frequency, wherein the signal generator device is coupled to the electrical measuring device, the lower electrode, and the upper electrode. The method further includes measuring the set of signals with the electrical measuring device, wherein at least one measured signal is generated for each of the set of variables; and, creating a simplified equivalent circuit model from the set of signals.
    • 描述了一种创建包括电测量装置,下电极,上电极和信号发生装置的等离子体处理系统的简化等效电路模型的方法。 该方法包括创建包括等离子体处理系统的一组变量的简化的等效电路方程,其中电测量装置包括变量的第一子集,下电极包括变量的第二子集,上电极包括第三 变量的子集,并且信号发生器装置包括变量的第四子集。 该方法还包括产生一组信号,该组信号中的每一个以不同的频率产生,其中信号发生器装置耦合到电测量装置,下电极和上电极。 所述方法还包括用所述电测量装置测量所述信号集合,其中为所述一组变量中的每一个生成至少一个测量信号; 并且从该组信号创建简化的等效电路模型。