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    • 2. 发明授权
    • Adjusting current ratios in inductively coupled plasma processing systems
    • 在电感耦合等离子体处理系统中调整电流比
    • US09305750B2
    • 2016-04-05
    • US12728112
    • 2010-03-19
    • Maolin LongSeyed Jafar Jafarian-Tehrani
    • Maolin LongSeyed Jafar Jafarian-Tehrani
    • C23C16/00H01L21/306H01J37/32H05H1/46
    • H01J37/32174H01J37/321H01J37/3211H01J37/32137H01J37/32183H05H1/46H05H2001/4652H05H2001/4667
    • A plasma processing system for generating plasma to process at least a wafer. The plasma processing system may include a first coil for conducting a first current for sustaining at least a first portion of the plasma. The plasma processing system may also include a second coil for conducting a second current for sustaining at least a second portion of the plasma. The plasma processing system may also include a power source for powering the first current and the second current. The plasma processing system may also include a parallel circuit for adjusting one of the amperage of the first current and the amperage of the second current. The parallel circuit may be electrically coupled between the power source and at least one of the first coil and the second coil. The parallel circuit may include an inductor and a variable capacitor electrically connected in parallel to each other.
    • 一种用于产生等离子体以处理至少晶片的等离子体处理系统。 等离子体处理系统可以包括用于传导第一电流以维持等离子体的至少第一部分的第一线圈。 等离子体处理系统还可以包括用于传导第二电流以维持等离子体的至少第二部分的第二线圈。 等离子体处理系统还可以包括用于为第一电流和第二电流供电的电源。 等离子体处理系统还可以包括并联电路,用于调节第一电流的电流强度和第二电流的电流强度之一。 并联电路可以电耦合在电源和第一线圈和第二线圈中的至少一个之间。 并联电路可以包括彼此并联电连接的电感器和可变电容器。
    • 4. 发明申请
    • CURRENT CONTROL IN PLASMA PROCESSING SYSTEMS
    • 等离子体处理系统中的电流控制
    • US20110115379A1
    • 2011-05-19
    • US12908468
    • 2010-10-20
    • Maolin LongSeyed Jafar Jafarian-TehraniArthur SatoNeil Martin Paul BenjaminNorman Williams
    • Maolin LongSeyed Jafar Jafarian-TehraniArthur SatoNeil Martin Paul BenjaminNorman Williams
    • H05H1/24
    • H01J37/321H01J37/32174H01J37/32935
    • A plasma processing system for generating plasma to process at least a wafer. The plasma processing system includes a coil for conducting a current for sustaining at least a portion of the plasma. The plasma processing system also includes a sensor coupled with the coil for measuring a magnitude of a supplied current to provide a magnitude measurement without measuring any phase angle of the supplied current. The supplied current is the current or a total current that is used for providing a plurality of currents (e.g., including the current). The plasma processing system also includes a controller coupled with the sensor for generating a command using the magnitude measurement and/or information derived using the magnitude measurement, without using information related to phase angle measurement, and for providing the command for controlling the magnitude of the supplied current and/or a magnitude of the total current.
    • 一种用于产生等离子体以处理至少晶片的等离子体处理系统。 等离子体处理系统包括用于传导用于维持等离子体的至少一部分的电流的线圈。 等离子体处理系统还包括与线圈耦合的传感器,用于测量供电电流的大小以提供幅度测量,而不测量所提供的电流的任何相位角。 所提供的电流是用于提供多个电流(例如,包括电流)的电流或总电流。 等离子体处理系统还包括与传感器耦合的控制器,用于使用使用幅度测量导出的幅度测量和/或信息来生成指令,而不使用与相位角测量有关的信息,并且用于提供用于控制 提供电流和/或总电流的大小。
    • 5. 发明授权
    • Current control in plasma processing systems
    • 等离子体处理系统中的电流控制
    • US08736175B2
    • 2014-05-27
    • US12908468
    • 2010-10-20
    • Maolin LongSeyed Jafar Jafarian-TehraniArthur SatoNeil Martin Paul BenjaminNorman Williams
    • Maolin LongSeyed Jafar Jafarian-TehraniArthur SatoNeil Martin Paul BenjaminNorman Williams
    • H05B31/26
    • H01J37/321H01J37/32174H01J37/32935
    • A plasma processing system for generating plasma to process at least a wafer. The plasma processing system includes a coil for conducting a current for sustaining at least a portion of the plasma. The plasma processing system also includes a sensor coupled with the coil for measuring a magnitude of a supplied current to provide a magnitude measurement without measuring any phase angle of the supplied current. The supplied current is the current or a total current that is used for providing a plurality of currents (e.g., including the current). The plasma processing system also includes a controller coupled with the sensor for generating a command using the magnitude measurement and/or information derived using the magnitude measurement, without using information related to phase angle measurement, and for providing the command for controlling the magnitude of the supplied current and/or a magnitude of the total current.
    • 一种用于产生等离子体以处理至少晶片的等离子体处理系统。 等离子体处理系统包括用于传导用于维持等离子体的至少一部分的电流的线圈。 等离子体处理系统还包括与线圈耦合的传感器,用于测量供电电流的大小以提供幅度测量,而不测量所提供的电流的任何相位角。 所提供的电流是用于提供多个电流(例如,包括电流)的电流或总电流。 等离子体处理系统还包括与传感器耦合的控制器,用于使用使用幅度测量导出的幅度测量和/或信息来生成指令,而不使用与相位角测量相关的信息,并且用于提供用于控制 提供电流和/或总电流的大小。
    • 6. 发明申请
    • ADJUSTING CURRENT RATIOS IN INDUCTIVELY COUPLED PLASMA PROCESSING SYSTEMS
    • 在电感耦合等离子体处理系统中调整电流比
    • US20100314048A1
    • 2010-12-16
    • US12728112
    • 2010-03-19
    • Maolin LongSeyed Jafar Jafarian-Tehrani
    • Maolin LongSeyed Jafar Jafarian-Tehrani
    • H05H1/34H01L21/3065G05F1/00
    • H01J37/32174H01J37/321H01J37/3211H01J37/32137H01J37/32183H05H1/46H05H2001/4652H05H2001/4667
    • A plasma processing system for generating plasma to process at least a wafer. The plasma processing system may include a first coil for conducting a first current for sustaining at least a first portion of the plasma. The plasma processing system may also include a second coil for conducting a second current for sustaining at least a second portion of the plasma. The plasma processing system may also include a power source for powering the first current and the second current. The plasma processing system may also include a parallel circuit for adjusting one of the amperage of the first current and the amperage of the second current. The parallel circuit may be electrically coupled between the power source and at least one of the first coil and the second coil. The parallel circuit may include an inductor and a variable capacitor electrically connected in parallel to each other.
    • 一种用于产生等离子体以处理至少晶片的等离子体处理系统。 等离子体处理系统可以包括用于传导第一电流以维持等离子体的至少第一部分的第一线圈。 等离子体处理系统还可以包括用于传导第二电流以维持等离子体的至少第二部分的第二线圈。 等离子体处理系统还可以包括用于为第一电流和第二电流供电的电源。 等离子体处理系统还可以包括并联电路,用于调节第一电流的电流强度和第二电流的电流强度之一。 并联电路可以电耦合在电源和第一线圈和第二线圈中的至少一个之间。 并联电路可以包括彼此并联电连接的电感器和可变电容器。
    • 7. 发明授权
    • Plasma processing system ESC high voltage control and methods thereof
    • 等离子体处理系统ESC高压控制及其方法
    • US07983018B2
    • 2011-07-19
    • US12848970
    • 2010-08-02
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • H01L21/683H01T23/00
    • H01L21/6831H01L21/67069Y10T29/49998Y10T279/23
    • An arrangement for securing a wafer during substrate processing is provided. The arrangement includes a power supply and an electrostatic chuck (ESC). The ESC supports the wafer and includes a positive and a negative terminal. A positive high voltage is provided to the positive terminal through an RF filter and a negative high voltage is provided to the negative terminal through the RF filter. The arrangement also includes a first and a second trans-impedance amplifiers (TIAs) that measure a first set of voltages for determining a value of a positive load current applied to the positive terminal and a third and fourth TIAs that measure a second set of voltages for determining a value of a negative load current applied to the negative terminal. The arrangement yet also includes a program to adjust a bias voltage using the values of the positive load current and the negative load current.
    • 提供了一种用于在衬底处理期间固定晶片的布置。 该装置包括电源和静电卡盘(ESC)。 ESC支持晶片,并包括正极和负极。 通过RF滤波器向正端子提供正高电压,并通过RF滤波器将负高压提供给负极端子。 该装置还包括测量第一组电压以确定施加到正极端子的正负载电流的值的第一和第二跨阻放大器(TIA),以及测量第二组电压的第三和第四TIA 用于确定施加到负极端子的负载电流的值。 该装置还包括使用正负载电流和负负载电流的值来调节偏置电压的程序。
    • 8. 发明申请
    • PLASMA PROCESSING SYSTEM ESC HIGH VOLTAGE CONTROL AND METHODS THEREOF
    • 等离子体处理系统ESC高压控制及其方法
    • US20110051307A1
    • 2011-03-03
    • US12848970
    • 2010-08-02
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • Seyed Jafar Jafarian-TehraniRalph Jan-Pin Lu
    • H01L21/683
    • H01L21/6831H01L21/67069Y10T29/49998Y10T279/23
    • An arrangement for securing a wafer during substrate processing is provided. The arrangement includes a power supply and an electrostatic chuck (ESC). The ESC supports the wafer and includes a positive and a negative terminal. A positive high voltage is provided to the positive terminal through an RF filter and a negative high voltage is provided to the negative terminal through the RF filter. The arrangement also includes a first and a second trans-impedance amplifiers (TIAs) that measure a first set of voltages for determining a value of a positive load current applied to the positive terminal and a third and fourth TIAs that measure a second set of voltages for determining a value of a negative load current applied to the negative terminal. The arrangement yet also includes a program to adjust a bias voltage using the values of the positive load current and the negative load current.
    • 提供了一种用于在衬底处理期间固定晶片的布置。 该装置包括电源和静电卡盘(ESC)。 ESC支持晶片,并包括正极和负极。 通过RF滤波器向正端子提供正高电压,并通过RF滤波器将负高压提供给负极端子。 该装置还包括测量第一组电压以确定施加到正极端子的正负载电流的值的第一和第二跨阻放大器(TIA),以及测量第二组电压的第三和第四TIA 用于确定施加到负极端子的负载电流的值。 该装置还包括使用正负载电流和负负载电流的值来调节偏置电压的程序。
    • 10. 发明授权
    • Systems for detecting unconfined-plasma events
    • 无侧限等离子体事件检测系统
    • US09074285B2
    • 2015-07-07
    • US12101804
    • 2008-04-11
    • John PeaseSeyed Jafar Jafarian-Tehrani
    • John PeaseSeyed Jafar Jafarian-Tehrani
    • C23C16/00C23F4/00H01J37/32H05H1/00
    • C23F4/00H01J37/32935H05H1/0081
    • A system for detecting unconfined-plasma events in a plasma processing chamber is disclosed. The system may include a sensor disposed in the plasma processing chamber for providing a current when unconfined plasma is present in the plasma processing chamber. The system may also include a converter for converting the current into a voltage and a filter for removing noise from the voltage to provide a first signal. The system may also include a detector for determining presence of the unconfined plasma using an amplified level of the first signal and/or the first signal. The system may also include a conductor for coupling the sensor and the converter to conduct the current from the sensor to the converter. The system may also include a shield for enclosing at least a portion of the conductor to at least reduce electromagnetic noise received by the conductor.
    • 公开了一种用于检测等离子体处理室中的无约束等离子体事件的系统。 该系统可以包括设置在等离子体处理室中的传感器,用于当等离子体处理室中存在无约束等离子体时提供电流。 该系统还可以包括用于将电流转换成电压的转换器和用于从电压去除噪声以提供第一信号的滤波器。 该系统还可以包括用于使用第一信号和/或第一信号的放大电平来确定无约束等离子体的存在的检测器。 该系统还可以包括用于耦合传感器和转换器以将电流从传感器传导到转换器的导体。 该系统还可以包括用于封闭导体的至少一部分以至少降低由导体接收的电磁噪声的屏蔽。