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1. 发明授权

US08704264B2 Light emitting diode package structure 有权
标题翻译：发光二极管封装结构
公开(公告)号：US08704264B2
公开(公告)日：2014-04-22
申请号：US12637765
申请日：2009-12-15
申请人： Sheng-Jia Sheu , Chih-Hung Hsu , Chung-Chuan Hsieh
发明人： Sheng-Jia Sheu , Chih-Hung Hsu , Chung-Chuan Hsieh
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/78301 , H01L2924/00014
摘要： A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess.
摘要翻译：提供了包括引线框，壳体，LED芯片和透光密封剂的发光二极管（LED）封装结构。引线框架具有彼此分离的第一电极和第二电极。壳体包裹第一电极和第二电极，并且包括具有底部和侧壁的凹部。所述凹部的底部具有覆盖所述引线框架的覆盖层，并且具有暴露所述第一电极的端部，所述第二电极的端部和设置在其间并与之连接的间隔件的开口，其中所述间隔件，所述第一电极的端部和第二电极的端部基本上共面。 LED芯片设置在凹槽中并电连接到引线框架。透光密封剂填充在凹部中。

2. 发明申请

US20110254025A1 Light-Emitting Diode Packaging Structure and Module and Assembling Method Thereof 有权
标题翻译：发光二极管封装结构及模块及其组装方法
公开(公告)号：US20110254025A1
公开(公告)日：2011-10-20
申请号：US13149309
申请日：2011-05-31
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L27/15 , H01L33/62
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.
摘要翻译：发光二极管封装结构包括发光二极管和安装有发光二极管的第一和第二金属板。发光二极管包括第一和第二电极引线，第二电极引线在第二电极引线的外边缘上具有第一和第二接触表面。第一金属板包括夹持并固定第一金属板上的第一电极引线的至少一个夹持部分。第二金属板至少包括第一和第二夹紧部分。第二电极引线的第一接触表面接触第一夹持部分，第二电极引线的第二接触表面接触第二夹紧部分，使得发光二极管至少在两个维度上固定在第二金属板上平行于其上安装有发光二极管的第二金属板的主表面。

3. 外观设计

USD600846S1 Lampshade of a street lamp 有权
标题翻译：路灯的灯罩
公开(公告)号：USD600846S1
公开(公告)日：2009-09-22
申请号：US29306132
申请日：2008-04-03
申请人： Hsi-Chuan Hsu , Sheng-Jia Sheu
设计人： Hsi-Chuan Hsu , Sheng-Jia Sheu

4. 发明授权

US07960740B2 Structure of light emitting diode and method to assemble thereof 有权
标题翻译：发光二极管的结构及其组装方法
公开(公告)号：US07960740B2
公开(公告)日：2011-06-14
申请号：US12012379
申请日：2008-02-01
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L33/00
CPC分类号： H05K3/326 , H01L33/62 , H01L2924/0002 , H05K3/202 , H05K2201/0382 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/1084 , Y10T29/41 , H01L2924/00
摘要： A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.
摘要翻译：提供发光二极管的结构。发光二极管包括发光二极管管芯; 电子地分别连接到发光二极管管芯的阴极和阳极的两个导电框架和两个基板。每个导电框架具有固定孔，并且每个基板具有突出支柱。固定孔的上部开口比底部开口宽。突出柱插入到固定孔中，突出柱的形状变形以与固定孔嵌合。

5. 发明申请

US20080203422A1 Structure of light emitting diode and method to assemble thereof 有权
标题翻译：发光二极管的结构及其组装方法
公开(公告)号：US20080203422A1
公开(公告)日：2008-08-28
申请号：US12012379
申请日：2008-02-01
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L33/00
CPC分类号： H05K3/326 , H01L33/62 , H01L2924/0002 , H05K3/202 , H05K2201/0382 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/1084 , Y10T29/41 , H01L2924/00
摘要： A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.
摘要翻译：提供发光二极管的结构。发光二极管包括发光二极管管芯; 电子地分别连接到发光二极管管芯的阴极和阳极的两个导电框架和两个基板。每个导电框架具有固定孔，并且每个基板具有突出支柱。固定孔的上部开口比底部开口宽。突出柱插入到固定孔中，突出柱的形状变形以与固定孔嵌合。

6. 发明授权

US08013355B2 High power light emitting diode 失效
标题翻译：大功率发光二极管
公开(公告)号：US08013355B2
公开(公告)日：2011-09-06
申请号：US11939552
申请日：2007-11-13
申请人： Chun-Cheng Lin , Abram Chang , Sheng-Jia Sheu , Eddie Huang
发明人： Chun-Cheng Lin , Abram Chang , Sheng-Jia Sheu , Eddie Huang
IPC分类号： H01L33/00 , H01L31/0203 , H01L31/0232
CPC分类号： H05K1/0203 , H01L33/647 , H05K1/18 , H05K2201/10106 , H05K2201/10659
摘要： A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.
摘要翻译：大功率发光二极管，大功率发光二极管包括发光二极管芯片，主模块，两个第一电极引脚，两个第二电极引脚和至少一个散热板。主模块具有凹面，发光二极管芯片位于凹面。第一电极引脚连接到主模块的第一侧，并且电连接到发光二极管芯片。第二电极引脚布置在主模块的相对于第一电极引脚的第二侧，其中第二电极引脚和第一电极引脚电气相对。第二电极引脚电连接到发光二极管芯片。散热板与主模块的一部分连接在第一电极销和第二电极销之间。

7. 发明申请

US20100148211A1 LIGHT EMITTING DIODE PACKAGE STRUCTURE 有权
标题翻译：发光二极管封装结构
公开(公告)号：US20100148211A1
公开(公告)日：2010-06-17
申请号：US12637765
申请日：2009-12-15
申请人： Sheng-Jia Sheu , Chih-Hung Hsu , Chung-Chuan Hsieh
发明人： Sheng-Jia Sheu , Chih-Hung Hsu , Chung-Chuan Hsieh
IPC分类号： H01L33/62
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/78301 , H01L2924/00014
摘要： A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess.
摘要翻译：提供了包括引线框，壳体，LED芯片和透光密封剂的发光二极管（LED）封装结构。引线框架具有彼此分离的第一电极和第二电极。壳体包裹第一电极和第二电极，并且包括具有底部和侧壁的凹部。所述凹部的底部具有覆盖所述引线框架的覆盖层，并且具有暴露所述第一电极的端部，所述第二电极的端部和设置在其间并与之连接的间隔件的开口，其中所述间隔件，所述第一电极的端部和第二电极的端部基本上共面。 LED芯片设置在凹槽中并电连接到引线框架。透光密封剂填充在凹部中。

8. 发明授权

US08987770B2 Structure of light emitting diode and method to assemble thereof 有权
标题翻译：发光二极管的结构及其组装方法
公开(公告)号：US08987770B2
公开(公告)日：2015-03-24
申请号：US13095059
申请日：2011-04-27
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L33/36 , H05K3/32 , H01L33/62 , H05K3/20
CPC分类号： H05K3/326 , H01L33/62 , H01L2924/0002 , H05K3/202 , H05K2201/0382 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/1084 , Y10T29/41 , H01L2924/00
摘要： A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.
摘要翻译：提供发光二极管的结构。在一个方面，发光二极管结构包括发光二极管，导电框架和基板。导电框架电连接到发光二极管，并且具有连接导电框架的第一侧和导电框架与第一侧相对的第二侧的固定孔。固定孔具有梯形内侧壁，其内侧壁的第一半径与第一侧相邻，小于邻近第二侧的内侧壁的第二半径。基板具有通过从导电框架的第一侧进入固定孔而被固定在固定孔中的导电柱，并使其导电柱粘附到固定孔的梯形内侧壁。

9. 发明授权

US07982308B2 Light-emitting diode packaging structure and light-emitting diode module 有权
标题翻译：发光二极管封装结构和发光二极管模块
公开(公告)号：US07982308B2
公开(公告)日：2011-07-19
申请号：US12076487
申请日：2008-03-19
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L23/34
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two metal plates, wherein each of the metal plates has at least a clamping portion; holding the electrode leads against the metal plates respectively; and bending the clamping portion of each of the metal plates to fix the electrode leads on the metal plates. Further, a plurality of light-emitting diodes are allowed to be mounted on the metal plates to form the light-emitting diode packaging module.
摘要翻译：公开了一种发光二极管封装结构，封装模块及其组装方法。组装方法包括以下步骤：提供发光二极管，其中发光二极管具有两个电极引线; 提供两个金属板，其中每个金属板具有至少一个夹紧部分; 将电极引线分别固定在金属板上; 并且弯曲每个金属板的夹紧部分以将电极引线固定在金属板上。此外，允许多个发光二极管安装在金属板上以形成发光二极管封装模块。

10. 发明申请

US20090166661A1 Light-emitting diode packaging structure and module and assembling method thereof 有权
标题翻译：发光二极管封装结构及模块及其组装方法
公开(公告)号：US20090166661A1
公开(公告)日：2009-07-02
申请号：US12076487
申请日：2008-03-19
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two metal plates, wherein each of the metal plates has at least a clamping portion; holding the electrode leads against the metal plates respectively; and bending the clamping portion of each of the metal plates to fix the electrode leads on the metal plates. Further, a plurality of light-emitting diodes are allowed to be mounted on the metal plates to form the light-emitting diode packaging module.
摘要翻译：公开了一种发光二极管封装结构，封装模块及其组装方法。组装方法包括以下步骤：提供发光二极管，其中发光二极管具有两个电极引线; 提供两个金属板，其中每个金属板具有至少一个夹紧部分; 将电极引线分别固定在金属板上; 并且弯曲每个金属板的夹紧部分以将电极引线固定在金属板上。此外，允许多个发光二极管安装在金属板上以形成发光二极管封装模块。

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