专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

US20240147619A1 SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY 审中-公开
公开(公告)号：US20240147619A1
公开(公告)日：2024-05-02
申请号：US18406734
申请日：2024-01-08
申请人： Samsung Electronics Co., Ltd.
发明人： Jongwan SHIM , Bumhee BAE , Younho KIM , Jeongnam CHEON
IPC分类号： H05K1/11 , H05K3/34
CPC分类号： H05K1/111 , H05K3/3457 , H05K2201/0154 , H05K2201/0314 , H05K2201/10318 , H05K2201/10659 , H05K2203/041
摘要： A substrate structure is provided. The substrate structure includes a first substrate, a plurality of first elastomer pins arranged on the first substrate, an elastic body disposed on the first substrate to surround the plurality of first elastomer pins, the elastic body including a plurality of spaces for receiving a plurality of solder balls on a second substrate connected to the first substrate, and a plurality of solder ball holders arranged on a boundary area of an opening of each of the plurality of spaces, wherein each of the plurality of solder ball holders has strength higher than that of the elastic body, and wherein each of the plurality of solder ball holders includes a plurality of pieces.

2. 发明申请

US20170330827A1 HYBRID EMBEDDED SURFACE MOUNT MODULE FORM FACTOR WITH SAME SIGNAL SOURCE SUBSET MAPPING 审中-公开
公开(公告)号：US20170330827A1
公开(公告)日：2017-11-16
申请号：US15376458
申请日：2016-12-12
申请人： Digi International Inc.
发明人： Mike Oliver Rohrmoser , Sebastien Joseph Xavier Meyer
IPC分类号： H01L23/498 , H05K1/02 , H01L23/552 , H05K1/11 , H05K1/18
CPC分类号： H05K1/183 , H01L23/13 , H01L23/49805 , H01L23/5386 , H01L23/552 , H05K1/0287 , H05K1/111 , H05K1/117 , H05K1/182 , H05K3/3436 , H05K3/3442 , H05K2201/10159 , H05K2201/10659 , H05K2201/10719
摘要： A surface mount module form factor comprises a substrate having a bottom surface, a top surface, and an outer periphery, with at least one electronic component mounted on the substrate, and a plurality of land grid array pads mounted on the bottom surface of the substrate. At least some of the land grid array pads are coupled to the at least one electronic component. A plurality of castellated edge pads are mounted around the outer periphery of the substrate, with at least some of the castellated edge pads coupled to the at least one electronic component. At least some of the land grid array pads are mapped to at least some of the castellated edge pads.

3. 发明申请

US20120155044A1 ELECTRONIC CIRCUIT BOARD AND A RELATED METHOD THEREOF 审中-公开
标题翻译：电子电路板及其相关方法
公开(公告)号：US20120155044A1
公开(公告)日：2012-06-21
申请号：US12971862
申请日：2010-12-17
申请人： David Mulford Shaddock , Vinayak Tilak , Tan Zhang
发明人： David Mulford Shaddock , Vinayak Tilak , Tan Zhang
IPC分类号： H05K7/00 , H05K3/10
CPC分类号： H05K3/328 , H05K3/4629 , H05K2201/10151 , H05K2201/10659 , H05K2201/10674 , Y10T29/49155
摘要： An apparatus includes a set of first metal contact pads disposed on a low temperature co-fired ceramic substrate. A plurality of metalized interconnectors extend between a digital electronic component and the low temperature co-fired ceramic substrate. The apparatus is configured to operate at a temperature greater than 250 degrees Celsius.
摘要翻译：一种装置包括设置在低温共烧陶瓷基板上的一组第一金属接触焊盘。多个金属化互连器在数字电子部件和低温共烧陶瓷基板之间延伸。该装置被配置为在大于250摄氏度的温度下操作。

4. 发明授权

US08169069B2 Integrated semiconductor outline package 有权
标题翻译：集成半导体外形封装
公开(公告)号：US08169069B2
公开(公告)日：2012-05-01
申请号：US12513906
申请日：2006-12-05
申请人： Stanley Job Doraisamy , Wae Chet Yong
发明人： Stanley Job Doraisamy , Wae Chet Yong
IPC分类号： H01L21/302
CPC分类号： H05K1/18 , H01L23/49541 , H01L23/49555 , H01L23/49562 , H01L2924/0002 , H05K1/0263 , H05K1/181 , H05K2201/10166 , H05K2201/10659 , H01L2924/00
摘要： A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.
摘要翻译：为适用于汽车的控制模块的半导体集成器件提供晶体管外形封装，用于连接印刷电路板和这种模块的母线。封装包括封装壳体，其具有适于安装到PCB并具有宽度的第一端。该封装还形成有引线框架，该引线框架包括适于连接到母线的散热器和接地平面叶片，适合于连接到PCB的多个连接器引线和适于连接到模块连接器的至少一个源极突起引线的这种控制模块。多个连接引线和源极突片从包装壳体的第一端沿着包装壳体的第一端的宽度方向并排地延伸。

5. 发明申请

US20110157855A1 INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME 审中-公开
标题翻译：具有连接到印刷电路板表面的引线接触和无铅接触垫的集成电路及其连接方法
公开(公告)号：US20110157855A1
公开(公告)日：2011-06-30
申请号：US13042903
申请日：2011-03-08
申请人： Deepak K. Pai
发明人： Deepak K. Pai
IPC分类号： H05K7/00 , B23K31/02 , B23K31/12 , B23K1/20
CPC分类号： H05K3/341 , H01L23/4822 , H01L24/13 , H01L24/73 , H01L2224/16225 , H01L2924/01006 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H05K3/3421 , H05K3/3436 , H05K2201/10659 , H05K2201/10734 , Y02P70/613 , H01L2924/00
摘要： A method is provided for connecting an integrated circuit to a surface of a printed wiring board. The integrated circuit includes lead contacts and leadless contact pads. A first solder paste is applied to the leadless contact pads of the integrated circuit, and preformed conductive pieces are placed on the first solder paste. The preformed conductive pieces are slugs that have, for example, a cylindrical shape or a rectangular cross-section. The preformed conductive pieces are heated and brought into electrical contact with the leadless contact pads. The lead contacts are formed into gull wings. The bases of the preformed conductive pieces are generally aligned in a plane, and the bases of the gull wings are substantially coplanar with the plane such that they collectively generally define a contact plane. A second solder paste is applied on the surface, and the bases of the gull wings and the preformed conductive pieces are soldered to the second solder paste on the surface so that the integrated circuit is in electrical contact with the surface through both the leadless contact pads and the lead contacts. The preformed conductive pieces comprise a conductive material (e.g., a copper alloy) that has a higher melting point than the first solder paste and the second solder paste such that the preformed conductive pieces do not melt during heating or soldering that is described above.
摘要翻译：提供了一种用于将集成电路连接到印刷电路板的表面的方法。集成电路包括引线触点和无引线接触焊盘。将第一焊膏施加到集成电路的无引线接触焊盘，并将预成型的导电片放置在第一焊膏上。预成型的导电片是具有例如圆柱形或矩形横截面的块塞。预成型的导电片被加热并与无引线接触垫电接触。铅触点形成鸥翼。预制导电片的基部通常在平面中对准，并且鸥翼的基部与平面基本共面，使得它们共同地限定接触平面。在表面上施加第二焊膏，并且将鸥翼和预成型导电片的基底焊接到表面上的第二焊膏，使得集成电路通过两个无引线接触焊盘与表面电接触和铅触点。预成型的导电片包括具有比第一焊膏和第二焊膏更高的熔点的导电材料（例如，铜合金），使得预先形成的导电片在上述加热或焊接期间不熔化。

6. 发明申请

US20110101075A1 Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards 审中-公开
标题翻译：将混合型vlsi芯片连接到印刷电路板的装置和方法
公开(公告)号：US20110101075A1
公开(公告)日：2011-05-05
申请号：US12929224
申请日：2011-01-10
申请人： Deepak K. Pai
发明人： Deepak K. Pai
IPC分类号： B23K31/12 , B23K31/02 , B23K1/20
CPC分类号： H05K3/341 , H01L23/4822 , H01L24/13 , H01L24/73 , H01L2224/16225 , H01L2924/01006 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H05K3/3421 , H05K3/3436 , H05K2201/10659 , H05K2201/10734 , Y02P70/613 , H01L2924/00
摘要： A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface.
摘要翻译：提供了一种用于制备用于连接到表面的集成电路的方法，所述集成电路包括引线触点和无引线触点。该方法包括提供集成电路，将第一焊膏施加到无引线触点，在所施加的焊膏上形成焊球，加热焊球，从而去除至少一部分第一焊膏并使焊球进入电与无引线触点接触，焊球的基部通常在平面中对准，并且将引线触点弯曲成鸥翼，鸥翼的基部与平面基本上共面。鸥翼的基部和至少一个焊球的基部通常限定接触平面，以便将来与表面接触。

7. 发明申请

US20110018669A1 Low Profile Inductors For High Density Circuit Boards 有权
公开(公告)号：US20110018669A1
公开(公告)日：2011-01-27
申请号：US12507751
申请日：2009-07-22
申请人： Alexandr Ikriannikov
发明人： Alexandr Ikriannikov
IPC分类号： H01F27/29
CPC分类号： H01F27/2847 , H01F17/06 , H01F27/292 , H05K1/181 , H05K3/3426 , H05K2201/1003 , H05K2201/10659 , Y02P70/611
摘要： An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.

8. 发明申请

US20100327709A1 SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME 有权
标题翻译：使用相同的半导体模块和电子电路集成电动机
公开(公告)号：US20100327709A1
公开(公告)日：2010-12-30
申请号：US12822403
申请日：2010-06-24
申请人： Hideki MINATO , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
发明人： Hideki MINATO , Hideki Kabune , Atsushi Furumoto , Ayako Iwai
IPC分类号： H02K5/22 , H02K11/00 , H05K1/02
CPC分类号： H05K1/18 , H01L2224/73221 , H01L2924/0002 , H02K11/33 , H02K2211/03 , H02M7/003 , H05K2201/1003 , H05K2201/1053 , H05K2201/10659 , H01L2924/00
摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.
摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。结果，减少了连接电子部件所需的部件数量。此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。

9. 发明申请

US20100127402A1 Interconnect System without Through-Holes 审中-公开
标题翻译：没有通孔的互连系统
公开(公告)号：US20100127402A1
公开(公告)日：2010-05-27
申请号：US12692974
申请日：2010-01-25
申请人： Kevin P. Grundy , Joseph C. Fjelstad , Gary Yasumura , William F. Wiedemann , Para K. Segaram
发明人： Kevin P. Grundy , Joseph C. Fjelstad , Gary Yasumura , William F. Wiedemann , Para K. Segaram
IPC分类号： H01L23/48
CPC分类号： H01L23/13 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/0401 , H01L2224/05599 , H01L2224/16235 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/85399 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/30111 , H05K1/182 , H05K1/183 , H05K3/308 , H05K3/3405 , H05K3/3421 , H05K3/3447 , H05K3/4046 , H05K3/4602 , H05K3/4697 , H05K2201/0919 , H05K2201/092 , H05K2201/09845 , H05K2201/10189 , H05K2201/1053 , H05K2201/10545 , H05K2201/1059 , H05K2201/10659 , H05K2201/10689 , H05K2201/10704 , H05K2201/10727 , H05K2201/10734 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.
摘要翻译：由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。公开的结构可以与通孔实现共存。

10. 发明申请

US20100006863A1 OPTICAL SEMICONDUCTOR DEVICE 有权
标题翻译：光学半导体器件
公开(公告)号：US20100006863A1
公开(公告)日：2010-01-14
申请号：US12484196
申请日：2009-06-13
申请人： Takuma Ban , Michihide Sasada , Masanobu Okayasu
发明人： Takuma Ban , Michihide Sasada , Masanobu Okayasu
IPC分类号： H01L31/12 , H01L33/00
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2924/01078 , H01L2924/01079 , H01L2924/3011 , H01S5/02212 , H01S5/06226 , H05K1/0219 , H05K1/028 , H05K1/147 , H05K1/189 , H05K3/28 , H05K3/3421 , H05K3/3447 , H05K2201/0305 , H05K2201/09727 , H05K2201/10121 , H05K2201/10659 , H01L2924/00014
摘要： A metal pattern for a high frequency signal is patterned on a flexile substrate, and the flexile substrate is bent in such a way as to form a substantially right angle at a spot corresponding to an end of the metal pattern for the signal. And an end of the metal pattern is fixedly attached to a lead pin for signaling, attached to a stem, for electrical continuity, so as to be in a posture horizontal with each other. Meanwhile, a part of the lead pins attached to the stem, being in such a state as penetrated through respective holes provided in the flexible substrate, is fixedly attached to a part of metal patterns provided on the flexible substrate so as to ensure electrical continuity therebetween.
摘要翻译：用于高频信号的金属图案在柔性基板上被图案化，并且柔性基板被弯曲成在对应于该信号的金属图案的端部的点处形成基本上直角。并且金属图案的端部固定地附接到引线销，用于发信号通知，连接到杆上以进行电连续性，以便处于相互水平的姿势。同时，安装在杆上的引脚的一部分处于处于设置在柔性基板上的相应孔的穿透状态下，固定地附接到设置在柔性基板上的金属图案的一部分，以确保其间的电连续性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式