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1. 发明授权

US07806642B2 Receiver for component feed plates and component feeder 失效
标题翻译：接收器用于部件进料板和部件进料器
公开(公告)号：US07806642B2
公开(公告)日：2010-10-05
申请号：US11579735
申请日：2005-04-20
申请人： Shoriki Narita , Kenichi Ishida , Shuichi Hirata , Satoshi Shida
发明人： Shoriki Narita , Kenichi Ishida , Shuichi Hirata , Satoshi Shida
IPC分类号： H01L21/677
CPC分类号： H01L21/67778 , H01L21/67271 , H01L21/6732 , H01L21/67383 , H01L21/67766 , H01L21/68785
摘要： In a receiver for component feed plates for housing, in multi-stage stacks, a plurality of component feed plates with a plurality of components placed thereon, identification mark portions are formed so as to be placed at end portions or their proximities of support guide portions in a plate feed direction so that each paired set of support guide portions out of individual support guide portions can be distinguished from the other paired sets of support guide portions and moreover visually discerned in the plate feed direction.
摘要翻译：在用于壳体的部件供给板的接收器中，在多级堆叠中，具有放置在其上的多个部件的多个部件供给板，识别标记部分形成为位于支撑引导部分的端部或其近端处在板进给方向上，使得从单独的支撑引导部分出来的每对成对的支撑引导部分可以与其他成对的一组支撑引导部分区分开，并且在板进给方向上视觉辨别。

2. 发明申请

US20080058186A1 TOOL EXCHANGE DEVICE AND TOOL 失效
标题翻译：工具交换设备和工具
公开(公告)号：US20080058186A1
公开(公告)日：2008-03-06
申请号：US11933738
申请日：2007-11-01
申请人： Kanji HATA , Shoriki NARITA
发明人： Kanji HATA , Shoriki NARITA
IPC分类号： B23Q15/00
CPC分类号： B25J15/0491 , H05K13/0409 , Y10T483/16 , Y10T483/17 , Y10T483/18 , Y10T483/1809
摘要： Step portions with an L-shaped section each having a vertical restriction surface and a horizontal engagement surface are provided on both sides of a main body portion of a tool. On one side of a holding portion placing and holding a mounted tool to be exchanged, a first engagement member has a first engagement projection piece that opposes the engagement surface of one of the step portions, and has an end surface in abutment against the restriction surface. On the other side of the holding portion, a second engagement member has a second engagement projection piece having its intermediate part opposed to the engagement surface of the other of the step portions, and end surfaces on both sides are in abutment against the outer periphery of the main both portion on both sides thereof. The first and second engagement members are movable between an engagement position and a withdrawal position with respect to the step portions.
摘要翻译：具有垂直限制表面和水平接合表面的L形截面的台阶部分设置在工具主体部分的两侧。在放置并保持待更换的被安装工具的保持部的一侧，第一接合构件具有与台阶部之一的接合面相对的第一接合突起片，并且具有抵靠限制面的端面。在保持部的另一侧，第二卡合构件具有第二卡合突片，该第二卡合突片的中间部分与另一个台阶部的卡合面相对，两侧的端面与外周面抵接其两侧的主要部分。第一和第二接合构件能够在接合位置和相对于台阶部分的取出位置之间移动。

3. 发明申请

US20060185157A1 Parts packaging device and parts packaging method 有权
标题翻译：零件包装装置及零件包装方法
公开(公告)号：US20060185157A1
公开(公告)日：2006-08-24
申请号：US10549175
申请日：2004-03-18
申请人： Satoshi Shida , Shinji Kanayama , Shunji Onobori , Shuichi Hirata , Mamoru Nakao , Kunio Oe , Akira Kugihara , Shoriki Narita , Yoshitaka Etoh , Hiroshi Haji
发明人： Satoshi Shida , Shinji Kanayama , Shunji Onobori , Shuichi Hirata , Mamoru Nakao , Kunio Oe , Akira Kugihara , Shoriki Narita , Yoshitaka Etoh , Hiroshi Haji
IPC分类号： H05K3/34 , B23P19/00
CPC分类号： H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H05K13/046 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49151 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , H01L2924/00 , H01L2224/0401
摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.
摘要翻译：在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得向其提供粘接辅助剂以允许将粘合助剂供应的部件安装在板上，部件安装过程包括：将粘合助剂施加到多个部件中的第一部件，并开始供应的粘合助剂在第一部件安装到基板上之前，在多个部件中的第二部件上。

4. 发明申请

US20060102701A1 Bump formation method and bump forming apparatus for semiconductor wafer 失效
公开(公告)号：US20060102701A1
公开(公告)日：2006-05-18
申请号：US11317146
申请日：2005-12-27
申请人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
发明人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
IPC分类号： B23K31/02 , B23Q15/00 , B23K13/08 , B23K31/00
CPC分类号： H01L23/544 , B23K20/007 , H01L24/11 , H01L24/12 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.

5. 发明授权

US06329640B1 Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer 失效
标题翻译：用于凸块焊接的加热装置，凸块接合方法和凸块形成装置以及半导体晶片
公开(公告)号：US06329640B1
公开(公告)日：2001-12-11
申请号：US09690746
申请日：2000-10-18
申请人： Shoriki Narita , Makoto Imanishi , Takaharu Mae , Nobuhisa Watanabe , Shinji Kanayama
发明人： Shoriki Narita , Makoto Imanishi , Takaharu Mae , Nobuhisa Watanabe , Shinji Kanayama
IPC分类号： F27B514
CPC分类号： H01L21/67103 , H01L21/68
摘要： An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.
摘要翻译：本发明的目的是提供一种不涉及大型装置结构并易于处理的凸块焊接加热装置，凸块接合方法和凸块形成装置以及形成凸块的半导体晶片通过使用凸块接合方法。凸点焊接加热装置具有晶片转动部件，转动部件和晶片加热部件。转动构件在不转动晶片加热单元的情况下由转动单元转动，从而转动安装在转动构件上的半导体晶片。像这样，由于晶片加热单元没有转动，所以可以使装置结构紧凑。由于转动构件直接由转动单元转动，与常规气浮式转动方法相比，可以以更高的精度实现半导体晶片的转动角度。

6. 发明授权

US5648729A Board positioning method and apparatus of the methods 失效
标题翻译：板的定位方法和装置的方法
公开(公告)号：US5648729A
公开(公告)日：1997-07-15
申请号：US435616
申请日：1995-05-05
申请人： Hiroshi Yamauchi , Shoriki Narita , Hideo Hongo
发明人： Hiroshi Yamauchi , Shoriki Narita , Hideo Hongo
IPC分类号： G01R31/26 , G01R1/06 , G01R31/02 , G01R31/28 , H05K13/00
CPC分类号： G01R31/2887 , G01R31/2808 , H05K13/0069
摘要： A board positioning method includes the steps of selecting one of a plurality of positioning sections or stations for positioning a particular type of board located in a specified position. The method allows positioning different types of boards in specified positional relationships by locating only a positioning section corresponding to the board to be positioned, so that the positioning section faces the board located in the specified position. The positioning section is moved into the specified location by means of a support member. Thereby, positioning various types of the boards in a specified common position is possible without the need to make adjustments to a single positioning station.
摘要翻译：板定位方法包括以下步骤：选择多个定位部分或站中的一个，以定位位于指定位置的特定类型的板。该方法允许通过仅定位与要定位的板相对应的定位部分将不同类型的板定位在指定的位置关系中，使得定位部分面向位于指定位置的板。定位部通过支撑部件移动到指定位置。因此，可以在不需要对单个定位站进行调整的情况下将各种类型的板定位在指定的公共位置。

7. 发明授权

US07731469B2 Component feeder 有权
标题翻译：组件馈线
公开(公告)号：US07731469B2
公开(公告)日：2010-06-08
申请号：US10537406
申请日：2003-11-28
申请人： Shoriki Narita , Kanji Hata , Shuichi Hirata , Satoshi Shida , Mamoru Nakao
发明人： Shoriki Narita , Kanji Hata , Shuichi Hirata , Satoshi Shida , Mamoru Nakao
IPC分类号： B65H1/00
CPC分类号： H01L21/67144 , H01L21/67132
摘要： According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.
摘要翻译：根据放置在部件供给器的板放置装置中的板的类型，通过调节用于托盘进给的板加压构件的下降位置，根据板的类型选择性地和自动地执行适当的保持操作和膨胀操作通过释放用于晶片馈送板的降低位置的调节，牢固地保持板并执行晶片扩张，同时牢固地保持晶片馈送板。

8. 发明申请

US20100064510A1 COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE 审中-公开
标题翻译：组件供电头设备和组件安装头设备
公开(公告)号：US20100064510A1
公开(公告)日：2010-03-18
申请号：US12626799
申请日：2009-11-27
申请人： Shoriki NARITA , Satoshi SHIDA , Yasuharu UENO , Makoto MORIKAWA , Hironori KOBAYASHI , Shuichi HIRATA
发明人： Shoriki NARITA , Satoshi SHIDA , Yasuharu UENO , Makoto MORIKAWA , Hironori KOBAYASHI , Shuichi HIRATA
IPC分类号： B23P19/00
CPC分类号： H01L21/67144 , H01L21/67132 , H01L21/6838 , H01L2224/75 , H01L2224/75743 , H01L2924/01087 , Y10T29/49128 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.
摘要翻译：反转头装置（22）的吸嘴（65）具有在其内开有吸孔（65b）的前端面（65a）和与吸引孔（65b）一端连通的吸入通路（65c）其中。吸入孔（65b）外侧的远端面（65a）的一部分与电子部件（12）的凸块（39）抵接。抽吸孔（65b）与没有凸起（39）的安装侧表面（12a）的一部分相对。真空泵（65）通过吸入孔（65b）产生从吸入孔（65b）和安装侧面（12a）之间的间隙流入吸入通路（65c）的空气流。电子部件（12）由空气流产生的负压保持在前端面（65a）。

9. 发明授权

US07516878B2 Bump formation method and bump forming apparatus for semiconductor wafer 失效
标题翻译：用于半导体晶片的凸起形成方法和凸块形成装置
公开(公告)号：US07516878B2
公开(公告)日：2009-04-14
申请号：US11317146
申请日：2005-12-27
申请人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
发明人： Shoriki Narita , Masahiko Ikeya , Yasutaka Tsuboi , Takaharu Mae , Shinji Kanayama
IPC分类号： B23K37/00 , B23K37/04
CPC分类号： H01L23/544 , B23K20/007 , H01L24/11 , H01L24/12 , H01L2223/54453 , H01L2223/54473 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/45144 , H01L2224/78301 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.
摘要翻译：提供了一种用于半导体晶片的凸块形成方法和凸块形成装置，其中与常规技术相比，提高了在半导体晶片上形成凸块时的生产率。提供了凸块形成头，识别装置和控制装置。形成在半导体晶片上的IC被分成基本块。对于包含在一个基本块中的IC，连续执行凸块形成。只有当凸块形成操作从一个基本块移动到另一个基本块时，才执行其他基本块的位置识别。因此，与在每个IC上形成凸块时进行位置识别操作的现有技术相比，大大降低了执行位置识别的次数，从而可以提高生产率。

10. 发明授权

US07350684B2 Apparatus and method for forming bump 失效
标题翻译：用于形成凸块的装置和方法
公开(公告)号：US07350684B2
公开(公告)日：2008-04-01
申请号：US11114084
申请日：2005-04-26
申请人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
发明人： Shoriki Narita , Koichi Yoshida , Masahiko Ikeya , Takaharu Mae , Shinji Kanayama , Makoto Imanishi , Kazushi Higashi , Kenji Fukumoto , Hiroshi Wada
IPC分类号： B23K37/00
CPC分类号： H01L24/742 , H01L21/67138 , H01L21/67144 , H01L21/67248 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01052 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10329 , H01L2924/351 , Y10T29/4921 , H01L2924/00 , H01L2924/00014
摘要： A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).
摘要翻译：提供预热装置（160），用于在形成凸起（16）到电极部件（15）之前执行用于粘接促进的预制温度控制，以促进在凸块形成期间电极部件和凸块之间的接合。电极部分的金属颗粒可以在凸点形成之前变成适当的状态。与现有技术相比，现在可以改善电极部分和凸块之间的结合状态。在本发明的另一方面中，通过控制器（317）的加热来控制加热，可以通过接合台（316）在接合强度改善条件下加热具有凸块的半导体部件。

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