专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09673349B2 Stringing device and stringing method as well as photovoltaic module manufacturing device and manufacturing method 有权
公开(公告)号：US09673349B2
公开(公告)日：2017-06-06
申请号：US14381372
申请日：2012-02-28
申请人： Seigo Kodama , Noriaki Iwaki , Shuichi Hirata , Masato Suzuki
发明人： Seigo Kodama , Noriaki Iwaki , Shuichi Hirata , Masato Suzuki
IPC分类号： B23K3/00 , B23K31/00 , H01L31/18 , H01L31/05
CPC分类号： H01L31/188 , H01L31/05 , Y02E10/50
摘要： A stringing device and stringing method usable for manufacturing photovoltaic modules efficiently with an easy configuration, and a photovoltaic module manufacturing device and manufacturing method. A stringing device for electrically connecting electrodes formed respectively in adjacent photovoltaic cells via a conductive member includes: number one joining unit which joins the photovoltaic cell supplied with its light receiving surface facing up and the conductive member to each other; and number two joining unit which joins the photovoltaic cell supplied with its light receiving surface facing down and the conductive member to each other.

2. 发明申请

US20160189862A1 METHOD OF MANUFACTURING REACTOR 审中-公开
标题翻译：制造反应器的方法
公开(公告)号：US20160189862A1
公开(公告)日：2016-06-30
申请号：US14976579
申请日：2015-12-21
申请人： Hiroyuki MIYAUCHI , Shuichi HIRATA , Takeshi OKADA , Satoshi ITO , Kengo HARA
发明人： Hiroyuki MIYAUCHI , Shuichi HIRATA , Takeshi OKADA , Satoshi ITO , Kengo HARA
IPC分类号： H01F41/00
CPC分类号： H01F41/005 , H01F27/022 , H01F27/306 , H01F27/324 , H01F37/00
摘要： Breakage of a ring core or a bobbin upon injection molding of molten resin is to be prevented in a method of manufacturing a reactor including the ring core. A reactor includes a ring core, a bobbin, a pair of coils, and a plastic cover. The bobbin includes a pair of cylinder portions, and flanges connecting ends of the cylinder portions. The reactor is manufactured by following processes. First protrusions that make contact with an inner circumferential surface of the ring core are provided on outer sides of the flanges along a cylinder axis direction. Second protrusions are provided at positions facing the corresponding first protrusions across the ring core are provided on a cavity surface of a mold that forms the plastic cover by injection molding. The plastic cover is formed by injecting molten resin into the mold while clamping the ring core by the first and second protrusions.
摘要翻译：在制造包括环形芯的反应器的方法中，可以防止熔融树脂注射成型时的环芯或线轴的破损。反应器包括环形芯，线轴，一对线圈和塑料盖。筒管包括一对圆筒部分和连接圆筒部分的端部的凸缘。反应器通过以下方法制造。沿着圆筒轴线方向在凸缘的外侧设置与环形芯的内周面接触的第一突起。在通过注射成型形成塑料盖的模具的空腔表面上设置第二凸起，所述第二突起设置在穿过环形芯的相应的第一突起的位置。塑料盖通过将熔融树脂注入模具而形成，同时通过第一和第二突起夹住环形芯。

3. 发明授权

US09343212B2 Reactor 有权
标题翻译：反应堆
公开(公告)号：US09343212B2
公开(公告)日：2016-05-17
申请号：US14169272
申请日：2014-01-31
申请人： Nobuki Shinohara , Shuichi Hirata , Takeshi Okada , Yoshikazu Kamikawa , Kazuo Hirasawa
发明人： Nobuki Shinohara , Shuichi Hirata , Takeshi Okada , Yoshikazu Kamikawa , Kazuo Hirasawa
IPC分类号： H01F27/29 , H01F27/30 , H01F27/02 , H01F5/04 , H01F27/28 , H01F37/00
CPC分类号： H01F5/04 , H01F27/022 , H01F27/2852 , H01F27/306 , H01F37/00
摘要： A reactor includes: a bobbin including flanges at ends of a winding range of a winding, at least one of the flanges being provided with a slit or a hole; a coil formed in a shape in which the winding having a lead portion is wound around the bobbin, the coil being molded by resin, and the lead portion penetrating through the slit or the hole; and a plate through which the lead portion of the coil penetrates, the plate contacting with a circumferential edge of the slit or the hole of the flange so as to close the slit or the hole.
摘要翻译：反应器包括：在绕组的卷绕范围的端部包括法兰的筒管，至少一个凸缘设置有狭缝或孔; 形成为具有引线部分的绕组缠绕在线轴上的线圈，线圈由树脂模制而引线部分穿过狭缝或孔的形状; 以及板的引线部穿过的板，该板与狭缝的周缘或法兰的孔接触，以封闭狭缝或孔。

4. 发明授权

US07731469B2 Component feeder 有权
标题翻译：组件馈线
公开(公告)号：US07731469B2
公开(公告)日：2010-06-08
申请号：US10537406
申请日：2003-11-28
申请人： Shoriki Narita , Kanji Hata , Shuichi Hirata , Satoshi Shida , Mamoru Nakao
发明人： Shoriki Narita , Kanji Hata , Shuichi Hirata , Satoshi Shida , Mamoru Nakao
IPC分类号： B65H1/00
CPC分类号： H01L21/67144 , H01L21/67132
摘要： According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.
摘要翻译：根据放置在部件供给器的板放置装置中的板的类型，通过调节用于托盘进给的板加压构件的下降位置，根据板的类型选择性地和自动地执行适当的保持操作和膨胀操作通过释放用于晶片馈送板的降低位置的调节，牢固地保持板并执行晶片扩张，同时牢固地保持晶片馈送板。

5. 发明申请

US20100064510A1 COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE 审中-公开
标题翻译：组件供电头设备和组件安装头设备
公开(公告)号：US20100064510A1
公开(公告)日：2010-03-18
申请号：US12626799
申请日：2009-11-27
申请人： Shoriki NARITA , Satoshi SHIDA , Yasuharu UENO , Makoto MORIKAWA , Hironori KOBAYASHI , Shuichi HIRATA
发明人： Shoriki NARITA , Satoshi SHIDA , Yasuharu UENO , Makoto MORIKAWA , Hironori KOBAYASHI , Shuichi HIRATA
IPC分类号： B23P19/00
CPC分类号： H01L21/67144 , H01L21/67132 , H01L21/6838 , H01L2224/75 , H01L2224/75743 , H01L2924/01087 , Y10T29/49128 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A suction nozzle (65) of a reversing head device (22) has a distal end surface (65a) with a suction hole (65b) opened therein, and a suction passage (65c) communicated with the suction hole (65b) at one end thereof. A portion of the distal end surface (65a) outside of the suction hole (65b) abuts against bumps (39) of an electronic component (12). The suction hole (65b) is opposed with a gap to a portion of a mounting side surface (12a) where no bumps (39) are present. A vacuum pump (65) creates an air flow that flows from the gap between the suction hole (65b) and the mounting side surface (12a) into the suction passage (65c) through the suction hole (65b). The electronic component (12) is held at the distal end surface (65a) by a negative pressure generated by the air flow.
摘要翻译：反转头装置（22）的吸嘴（65）具有在其内开有吸孔（65b）的前端面（65a）和与吸引孔（65b）一端连通的吸入通路（65c）其中。吸入孔（65b）外侧的远端面（65a）的一部分与电子部件（12）的凸块（39）抵接。抽吸孔（65b）与没有凸起（39）的安装侧表面（12a）的一部分相对。真空泵（65）通过吸入孔（65b）产生从吸入孔（65b）和安装侧面（12a）之间的间隙流入吸入通路（65c）的空气流。电子部件（12）由空气流产生的负压保持在前端面（65a）。

6. 发明申请

US20080040917A1 Component Supply Head Device And Component Mounting Head Device 有权
标题翻译：组件供应头设备和组件安装头设备
公开(公告)号：US20080040917A1
公开(公告)日：2008-02-21
申请号：US11596577
申请日：2005-05-16
申请人： Shoriki Narita , Satoshi Shida , Yasuharu Ueno , Makoto Morikawa , Hironori Kobayashi , Shuichi Hirata
发明人： Shoriki Narita , Satoshi Shida , Yasuharu Ueno , Makoto Morikawa , Hironori Kobayashi , Shuichi Hirata
IPC分类号： B23P19/027
CPC分类号： H01L21/67144 , H01L21/67132 , H01L21/6838 , H01L2224/75 , H01L2224/75743 , H01L2924/01087 , Y10T29/49128 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A suction nozzle 65 of a reversing head device 22 has a distal end surface 65a with a suction hole 65b opened therein, and a suction passage 65c communicated with the suction hole 65b at one end thereof. A portion of the distal end surface 65a outside of the suction hole 65b abuts against bumps 39 of an electronic component 12. The suction hole 65b is opposed with a gap to a portion of a mounting side surface 12a where no bumps 39 are present. A vacuum pump 65 creates an air flow that flows from the gap between the suction hole 65b and mounting side surface 12a into the suction passage 65c through the suction hole 65b. The electronic component 12 is held at the distal end surface 65a by a negative pressure generated by the air flow.
摘要翻译：反转头装置22的吸嘴65具有在其中打开的吸入孔65b的远端表面65a和在其一端与吸入孔65b连通的吸入通道65c。远端面65的吸引孔65b的外侧的一部分与电子部件12的凸起39抵接。吸入孔65b与不存在凸块39的安装侧面12a的一部分相对。真空泵65通过吸入孔65b产生从吸入孔65b与安装侧面12a之间的间隙流入吸入通路65c的气流。电子部件12由空气流产生的负压保持在远端面65a。

7. 发明申请

US20070056157A1 Method of controlling contact load in electronic component mounting apparatus 有权
标题翻译：控制电子部件安装装置的接触负荷的方法
公开(公告)号：US20070056157A1
公开(公告)日：2007-03-15
申请号：US10596218
申请日：2005-08-31
申请人： Shuichi Hirata , Yasuharu Ueno , Makoto Morikawa , Hiroyuki Yoshida , Noriaki Yoshida
发明人： Shuichi Hirata , Yasuharu Ueno , Makoto Morikawa , Hiroyuki Yoshida , Noriaki Yoshida
IPC分类号： B23K3/08 , H05K3/30
CPC分类号： B23K3/087 , B23K37/047 , H01L2224/75502 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53187
摘要： A method of controlling contact load in an apparatus for mounting electronic components on a substrate includes moving a head holding an electronic component down by a predetermined distance. Contact load is measured after moving the head down. A determination is made as to whether the measured contact load has reached the target contact load. The moving and measuring are repeated until the measured contact load reaches the predetermined target contact load.
摘要翻译：在将电子部件安装在基板上的装置中控制接触负荷的方法包括将保持电子部件的头部向下移动预定距离。在向下移动头后测量接触负载。确定测量的接触载荷是否达到目标接触载荷。重复移动和测量，直到测得的接触载荷达到预定的目标接触载荷。

8. 发明授权

US5854745A Method and apparatus for mounting electronic component 失效
标题翻译：电子元件安装方法及装置
公开(公告)号：US5854745A
公开(公告)日：1998-12-29
申请号：US413441
申请日：1995-03-30
申请人： Nobuhiko Muraoka , Shinji Kanayama , Shinzo Eguchi , Masaru Ichihara , Shuichi Hirata , Nobuhisa Watanabe
发明人： Nobuhiko Muraoka , Shinji Kanayama , Shinzo Eguchi , Masaru Ichihara , Shuichi Hirata , Nobuhisa Watanabe
IPC分类号： H01L21/00 , G06F19/00
CPC分类号： H01L21/67144 , Y10T29/53087 , Y10T29/53191
摘要： When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.
摘要翻译：当在电子部件供给部拾取电子部件，然后定位并安装在透明板上的预定安装位置时，形成在透明板上的安装位置的安装位置标记与形成在电子部件上的定位标记对准，从而从与要安装电子部件的透明面板的与表面相反的表面相对位置识别，从而基于在安装电子部件之前的识别结果来校正电子部件的位置在透明面板上的预定安装位置。

9. 发明授权

US07353596B2 Component mounting method 有权
标题翻译：组件安装方法
公开(公告)号：US07353596B2
公开(公告)日：2008-04-08
申请号：US10549175
申请日：2004-03-18
申请人： Satoshi Shida , Shinji Kanayama , Shunji Onobori , Shuichi Hirata , Mamoru Nakao , Kunio Oe , Akira Kugihara , Shoriki Narita , Yoshitaka Etoh , Hiroshi Haji
发明人： Satoshi Shida , Shinji Kanayama , Shunji Onobori , Shuichi Hirata , Mamoru Nakao , Kunio Oe , Akira Kugihara , Shoriki Narita , Yoshitaka Etoh , Hiroshi Haji
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H05K13/046 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49151 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , H01L2924/00 , H01L2224/0401
摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.
摘要翻译：在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得向其提供粘合辅助剂，以便将粘合助剂供应的部件安装在板上。所述部件安装工序包括将所述粘接辅助剂供给到所述多个部件中的第一部件，并且在所述粘接助剂的安装完成之前开始向所述多个部件中的第二部件供给所述粘合辅助剂代理提供的第一个组件到板上。

10. 发明授权

US07350289B2 Component feeding head apparatus, for holding a component arrayed 有权
标题翻译：组件馈送头设备，用于保持组件排列
公开(公告)号：US07350289B2
公开(公告)日：2008-04-01
申请号：US10536361
申请日：2003-12-01
申请人： Shoriki Narita , Shuichi Hirata , Kanji Hata , Hirokuni Miyazaki , Youhei Matsumoto
发明人： Shoriki Narita , Shuichi Hirata , Kanji Hata , Hirokuni Miyazaki , Youhei Matsumoto
IPC分类号： B23P19/00
CPC分类号： H05K13/0413 , H01L24/75 , H01L24/81 , H01L2924/14 , H05K13/0406 , Y10T29/4913 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191 , Y10T29/53196 , Y10T483/14 , Y10T483/18 , H01L2924/00
摘要： In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.
摘要翻译：在部件供给头装置中，具有用于可释放地保持部件的保持单元和用于使保持单元围绕其中心旋转的旋转单元的头单元被设置为上下操作和翻转操作的对象，并且提供用于使头单元上下移动的头部提升装置和用于翻转头单元的头翻转装置作为与作为对象的头单元无关的构造。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式