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1. 发明申请

US20160300799A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：具有屏蔽的集成电路包装系统及其制造方法
公开(公告)号：US20160300799A1
公开(公告)日：2016-10-13
申请号：US15091049
申请日：2016-04-05
申请人： Byung Joon Han , Il Kwon Shim , KyoungHee Park , Yaojian Lin , KyoWang Koo , In Sang Yoon , SeungYong Chai , SungWon Cho , SungSoo Kim , Hun Teak Lee , DeokKyung Yang
发明人： Byung Joon Han , Il Kwon Shim , KyoungHee Park , Yaojian Lin , KyoWang Koo , In Sang Yoon , SeungYong Chai , SungWon Cho , SungSoo Kim , Hun Teak Lee , DeokKyung Yang
IPC分类号： H01L23/552 , H01L21/56 , H01L21/48 , H01L23/498 , H01L23/31
CPC分类号： H01L23/552 , H01L21/486 , H01L21/561 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L23/49805 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/97 , H01L25/16 , H01L2221/68327 , H01L2224/13111 , H01L2224/16227 , H01L2224/97 , H01L2924/141 , H01L2924/143 , H01L2924/1434 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/01029 , H01L2224/81
摘要： An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.
摘要翻译：集成电路封装系统及其制造方法包括：衬底，其具有在衬底顶侧，衬底底侧和垂直侧之间的内部电路; 耦合到所述内部电路的集成电路; 直接形成在集成电路和基板的基板顶侧上的模制封装体; 以及直接施加在模制封装主体，垂直侧上并且在衬底底侧下方连接到内部电路的导电保形屏蔽结构。

2. 发明申请

US20120209900A1 COMMUNICATION SYSTEM WITH SIGNAL PROCESSING MECHANISM AND METHOD OF OPERATION THEREOF 有权
标题翻译：具有信号处理机制的通信系统及其操作方法
公开(公告)号：US20120209900A1
公开(公告)日：2012-08-16
申请号：US13163661
申请日：2011-06-17
申请人： Vladislav Sorokine , Jungwon Lee , Sungsoo Kim , Inyup Kang
发明人： Vladislav Sorokine , Jungwon Lee , Sungsoo Kim , Inyup Kang
IPC分类号： G06F17/14 , G06F17/10
CPC分类号： H04L25/0216 , H04L25/022 , H04L27/2647 , H04L2025/03414
摘要： A method of operation of a communication system includes: generating a filter impulse response and a filter time-domain data with a shortening filter; generating a filter frequency response based on the filter impulse response with a filter frequency response calculator; generating a filter frequency-domain data based on the filter time-domain data with a first process unit; and generating a raw channel impulse response with a filter frequency removal unit for removing the filter frequency response from the filter frequency-domain data.
摘要翻译：一种通信系统的操作方法包括：利用缩短滤波器产生滤波器脉冲响应和滤波器时域数据; 利用滤波器频率响应计算器产生基于滤波器脉冲响应的滤波器频率响应; 使用第一处理单元基于所述滤波器时域数据生成滤波器频域数据; 以及用滤波器频率去除单元产生原始信道脉冲响应，以从滤波器频域数据中去除滤波器频率响应。

3. 发明申请

US20120181690A1 Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers 有权
标题翻译：半导体器件在嵌入式和凸起的键合手指上的迹线互连上具有垂直偏移键
公开(公告)号：US20120181690A1
公开(公告)日：2012-07-19
申请号：US13431816
申请日：2012-03-27
申请人： KiYoun Jang , SungSoo Kim , YongHee Kang
发明人： KiYoun Jang , SungSoo Kim , YongHee Kang
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L23/49811 , H01L21/4846 , H01L21/6835 , H01L23/498 , H01L23/49827 , H01L24/06 , H01L2221/68359 , H01L2221/68363 , H01L2224/0401 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K3/108 , H05K3/205 , H05K3/4007 , H05K2201/0367 , H05K2201/0376 , H05K2201/097 , H05K2201/09736 , H05K2203/049 , H05K2203/1476 , H01L2924/00
摘要： A semiconductor device includes a substrate, a first recessed conductive layer embedded and recessed into a first surface of the substrate, and a first raised conductive layer disposed above the first surface. A first vertical offset exists between an upper surface of the first recessed conductive layer and an upper surface of the first raised conductive layer. The device includes a second recessed conductive layer embedded and recessed into a second surface of the substrate. The second surface of the substrate is opposite the first surface. The device includes a second raised conductive layer disposed beneath the second surface and an interconnect structure disposed on the first recessed and raised conductive layers and the second recessed and raised conductive layers. A second vertical offset exists between a lower surface of the second recessed conductive layer and a lower surface of the second recessed conductive layer.
摘要翻译：半导体器件包括衬底，嵌入并凹入到衬底的第一表面中的第一凹陷导电层和设置在第一表面上方的第一凸起导电层。在第一凹陷导电层的上表面和第一凸起导电层的上表面之间存在第一垂直偏移。该器件包括嵌入并凹入到衬底的第二表面中的第二凹陷导电层。基板的第二表面与第一表面相对。该装置包括设置在第二表面下方的第二凸起导电层和设置在第一凹入和凸起导电层上的互连结构和第二凹入和凸起导电层。在第二凹陷导电层的下表面和第二凹陷导电层的下表面之间存在第二垂直偏移。

4. 发明申请

US20120257692A1 RECEIVER SYSTEM AND METHOD OF OPERATION THEREOF 有权
标题翻译：接收机系统及其操作方法
公开(公告)号：US20120257692A1
公开(公告)日：2012-10-11
申请号：US13441896
申请日：2012-04-08
申请人： Chun Kim Au Yeung , Sungsoo Kim , Jungwon Lee
发明人： Chun Kim Au Yeung , Sungsoo Kim , Jungwon Lee
IPC分类号： H04L27/06 , H04B1/10
CPC分类号： H04L25/061 , H04L1/0045 , H04L1/006 , H04L5/0023 , H04L25/067 , H04L27/22 , H04L27/36
摘要： A method of operation of a communication system includes: utilizing an estimation module estimating a log-likelihood ratio for a transmission; and utilizing a slicing module, coupled to the estimation module, slicing a constellation by: reading the log-likelihood ratio from the estimation module, defining a threshold within the constellation, and adjusting the threshold based on the log-likelihood ratio for determining a symbol.
摘要翻译：一种通信系统的操作方法包括：利用估计传输的对数似然比估计模块; 并且利用耦合到所述估计模块的限幅模块，通过以下方式对所述星座进行切片：通过从所述估计模块读取所述对数似然比来定义所述星座图内的阈值，以及基于所述对数似然比来调整所述阈值以确定符号。

5. 发明申请

US20110121452A1 Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers 有权
标题翻译：半导体器件在嵌入式和凸起的键合手指上的迹线互连上具有垂直偏移键
公开(公告)号：US20110121452A1
公开(公告)日：2011-05-26
申请号：US13019562
申请日：2011-02-02
申请人： KiYoun Jang , SungSoo Kim , YongHee Kang
发明人： KiYoun Jang , SungSoo Kim , YongHee Kang
IPC分类号： H01L23/49 , H01L23/48
CPC分类号： H01L23/49811 , H01L21/4846 , H01L21/6835 , H01L23/498 , H01L23/49827 , H01L24/06 , H01L2221/68359 , H01L2221/68363 , H01L2224/0401 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K3/108 , H05K3/205 , H05K3/4007 , H05K2201/0367 , H05K2201/0376 , H05K2201/097 , H05K2201/09736 , H05K2203/049 , H05K2203/1476 , H01L2924/00
摘要： A semiconductor device includes a substrate, a first recessed conductive layer embedded and recessed into a first surface of the substrate, and a first raised conductive layer disposed above the first surface. A first vertical offset exists between an upper surface of the first recessed conductive layer and an upper surface of the first raised conductive layer. The device includes a second recessed conductive layer embedded and recessed into a second surface of the substrate. The second surface of the substrate is opposite the first surface. The device includes a second raised conductive layer disposed beneath the second surface and an interconnect structure disposed on the first recessed and raised conductive layers and the second recessed and raised conductive layers. A second vertical offset exists between a lower surface of the second recessed conductive layer and a lower surface of the second recessed conductive layer.
摘要翻译：半导体器件包括衬底，嵌入并凹入到衬底的第一表面中的第一凹陷导电层和设置在第一表面上方的第一凸起导电层。在第一凹陷导电层的上表面和第一凸起导电层的上表面之间存在第一垂直偏移。该器件包括嵌入并凹入到衬底的第二表面中的第二凹陷导电层。基板的第二表面与第一表面相对。该装置包括设置在第二表面下方的第二凸起导电层和设置在第一凹入和凸起导电层上的互连结构和第二凹入和凸起导电层。在第二凹陷导电层的下表面和第二凹陷导电层的下表面之间存在第二垂直偏移。

6. 发明授权

US07897502B2 Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers 有权
标题翻译：在凹陷和凸起的粘结指状物上的迹线互连上形成垂直偏移粘结的方法
公开(公告)号：US07897502B2
公开(公告)日：2011-03-01
申请号：US12207986
申请日：2008-09-10
申请人： KiYoun Jang , SungSoo Kim , YongHee Kang
发明人： KiYoun Jang , SungSoo Kim , YongHee Kang
IPC分类号： H01L21/44
CPC分类号： H01L23/49811 , H01L21/4846 , H01L21/6835 , H01L23/498 , H01L23/49827 , H01L24/06 , H01L2221/68359 , H01L2221/68363 , H01L2224/0401 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K3/108 , H05K3/205 , H05K3/4007 , H05K2201/0367 , H05K2201/0376 , H05K2201/097 , H05K2201/09736 , H05K2203/049 , H05K2203/1476 , H01L2924/00
摘要： A method of making a semiconductor device comprises forming a first conductive layer recessed below a surface of a substrate. The method further comprises forming a second conductive layer raised above the surface of the substrate to create a vertical offset between the first and second conductive layers. The method further comprises forming an interconnect structure on the first and second conductive layers.
摘要翻译：制造半导体器件的方法包括形成在衬底的表面下方凹入的第一导电层。该方法还包括形成在衬底的表面上方升高的第二导电层，以在第一和第二导电层之间产生垂直偏移。该方法还包括在第一和第二导电层上形成互连结构。

7. 发明授权

US08774326B2 Receiver system and method of operation thereof 有权
标题翻译：接收机系统及其操作方法
公开(公告)号：US08774326B2
公开(公告)日：2014-07-08
申请号：US13441896
申请日：2012-04-08
申请人： Chun Kin Au Yeung , Sungsoo Kim , Jungwon Lee
发明人： Chun Kin Au Yeung , Sungsoo Kim , Jungwon Lee
IPC分类号： H04L27/06
CPC分类号： H04L25/061 , H04L1/0045 , H04L1/006 , H04L5/0023 , H04L25/067 , H04L27/22 , H04L27/36
摘要： A method of operation of a communication system includes: utilizing an estimation module estimating a log-likelihood ratio for a transmission; and utilizing a slicing module, coupled to the estimation module, slicing a constellation by: reading the log-likelihood ratio from the estimation module, defining a threshold within the constellation, and adjusting the threshold based on the log-likelihood ratio for determining a symbol.
摘要翻译：一种通信系统的操作方法包括：利用估计传输的对数似然比估计模块; 并且利用耦合到所述估计模块的限幅模块，通过以下方式对所述星座进行切片：通过从所述估计模块读取所述对数似然比来定义所述星座图内的阈值，以及基于所述对数似然比来调整所述阈值以确定符号。

8. 发明授权

US08773348B2 Micro projector driving device and driving method 有权
标题翻译：微型投影机驱动装置及驱动方法
公开(公告)号：US08773348B2
公开(公告)日：2014-07-08
申请号：US13146154
申请日：2010-01-13
申请人： Songtaek Kwan , Donghyub Kim , Sungsoo Kim
发明人： Songtaek Kwan , Donghyub Kim , Sungsoo Kim
IPC分类号： G09G3/36 , G03B21/14 , G03B21/12 , H04N9/31
CPC分类号： G03B21/12 , G03B21/14 , G03B21/2053 , H04N9/312 , H04N9/3173 , H04N9/3197
摘要： A micro projector driving device and a driving method are provided, where pixels of the first and last images at a specified location are compared, and the light intensity of the light sources is then adjusted according to the compared results so as to avoid the continual display of images with different contrast requirements at the highest light intensity, thus saving power under a guaranteed visual effect, and prolonging the battery life of a portable micro projector. A higher power drive light source should be used for a static image rather than for a video image. Images are divided into sections, and then the pixels from each section are selected at random for comparison, therefore greatly reducing the amount of computing but still having a rather high accuracy.
摘要翻译：提供一种微型投影仪驱动装置和驱动方法，其中比较在指定位置处的第一和最后图像的像素，然后根据比较的结果调整光源的光强度，以避免连续显示在最高光强度下具有不同对比度要求的图像，从而在保证视觉效果的情况下节省电力，并延长便携式微型投影机的电池寿命。更高的功率驱动光源应该用于静态图像而不是视频图像。图像被划分为几个部分，然后随机选择每个部分的像素进行比较，从而大大减少了计算量但仍具有相当高的精度。

9. 发明授权

US08706785B2 Communication system with signal processing mechanism and method of operation thereof 有权
标题翻译：具有信号处理机制的通信系统及其操作方法
公开(公告)号：US08706785B2
公开(公告)日：2014-04-22
申请号：US13163661
申请日：2011-06-17
申请人： Vladislav Sorokine , Jungwon Lee , Sungsoo Kim , Inyup Kang
发明人： Vladislav Sorokine , Jungwon Lee , Sungsoo Kim , Inyup Kang
IPC分类号： G06F17/10
CPC分类号： H04L25/0216 , H04L25/022 , H04L27/2647 , H04L2025/03414
摘要： A method of operation of a communication system includes: generating a filter impulse response and a filter time-domain data with a shortening filter; generating a filter frequency response based on the filter impulse response with a filter frequency response calculator; generating a filter frequency-domain data based on the filter time-domain data with a first process unit; and generating a raw channel impulse response with a filter frequency removal unit for removing the filter frequency response from the filter frequency-domain data.
摘要翻译：一种通信系统的操作方法包括：利用缩短滤波器产生滤波器脉冲响应和滤波器时域数据; 利用滤波器频率响应计算器产生基于滤波器脉冲响应的滤波器频率响应; 使用第一处理单元基于所述滤波器时域数据生成滤波器频域数据; 以及用滤波器频率去除单元产生原始信道脉冲响应，以从滤波器频域数据中去除滤波器频率响应。

10. 发明申请

US20130196670A1 MOBILE COMMUNICATION SYSTEM WITH DEVICE HANDOVER AND METHOD OF OPERATION THEREOF 有权
标题翻译：具有设备切换的移动通信系统及其操作方法
公开(公告)号：US20130196670A1
公开(公告)日：2013-08-01
申请号：US13360547
申请日：2012-01-27
申请人： Sungsoo Kim , Inyup Kang , Jungwon Lee
发明人： Sungsoo Kim , Inyup Kang , Jungwon Lee
IPC分类号： H04W36/00
CPC分类号： H04W36/32 , G01S11/06 , H04W36/0083 , H04W64/006
摘要： A method of operation of a mobile communication system includes: receiving a base carrier frequency signal from a cell tower location; generating a power spectral density from the base carrier frequency signal; measuring a Rician K factor from the power spectral density; estimating a line-of-sight Doppler frequency based on the base carrier frequency signal; determining the cell tower location based on the Rician K factor; and activating a handover decision handler based on the cell tower location.
摘要翻译：移动通信系统的操作方法包括：从小区塔位置接收基载波频率信号; 从所述基本载波频率信号产生功率谱密度; 从功率谱密度测量Rician K因子; 基于所述基本载波频率信号估计视线多普勒频率; 基于Rician K因子确定细胞塔位置; 以及基于所述小区塔位置激活切换判定处理器。

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