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1. 发明授权

US09435106B2 Display system in an excavator and method for controlling same 有权
标题翻译：挖掘机中的显示系统及其控制方法
公开(公告)号：US09435106B2
公开(公告)日：2016-09-06
申请号：US13819260
申请日：2012-02-08
申请人： Ryo Fukano , Azumi Nomura , Takashi Kurihara , Etsuo Fujita , Masao Ando , Toshihiro Koide
发明人： Ryo Fukano , Azumi Nomura , Takashi Kurihara , Etsuo Fujita , Masao Ando , Toshihiro Koide
IPC分类号： E02F3/43 , E02F3/30 , E02F9/26 , G01C21/00
CPC分类号： E02F9/261 , E02F3/43 , E02F9/2045 , E02F9/2054 , E02F9/22 , E02F9/2221 , E02F9/26 , E02F9/264 , G01C21/00 , G01C21/20
摘要： In a display system in an excavator, a position of an upper boundary line and a position of a lower boundary line are calculated. The upper boundary line indicates a height of a top of a cross section of a display object surface. The lower boundary line indicates a height of a bottom of the cross section of the display object surface. When the current position of the excavator is between the upper boundary line and the lower boundary line, a predetermined reference point of a display range is set to a predetermined position between the upper and lower boundary lines. When the current position of the excavator is above the upper boundary line, the reference point is set above the predetermined position. When the current position of the excavator is below the lower boundary line, the reference point is set below the predetermined position.
摘要翻译：在挖掘机的显示系统中，计算上边界的位置和下边界线的位置。上边界线表示显示对象表面的横截面的顶部的高度。下边界线表示显示对象表面的横截面的底部的高度。当挖掘机的当前位置在上边界线和下边界线之间时，将显示范围的预定参考点设置在上边界线和下边界线之间的预定位置。当挖掘机的当前位置高于上边界线时，将参考点设定在预定位置上方。当挖掘机的当前位置低于下边界线时，将参考点设定在预定位置以下。

2. 发明授权

US09158140B2 Physical property measuring method for TFT liquid crystal panel and physical property measuring apparatus for TFT liquid crystal panel 有权
标题翻译： TFT液晶面板的物理性质测量方法和TFT液晶面板的物理测量装置
公开(公告)号：US09158140B2
公开(公告)日：2015-10-13
申请号：US13489198
申请日：2012-06-05
申请人： Masaru Inoue , Kunihiko Sasaki , Takashi Kurihara , Yasuhiro Kume
发明人： Masaru Inoue , Kunihiko Sasaki , Takashi Kurihara , Yasuhiro Kume
IPC分类号： G01R31/00 , G02F1/13 , G09G3/00 , G02F1/1362 , G09G3/36
CPC分类号： G02F1/1309 , G02F2001/136254 , G09G3/006 , G09G3/3648
摘要： There is provided a physical property measuring method for a TFT liquid crystal panel, includes an impedance setting step of setting the impedance between the source and drain of a TFT of the TFT liquid crystal panel to be less than or equal to a predetermined value, a voltage application step of applying a voltage that cyclically varies to a liquid crystal layer of the TFT liquid crystal panel. And the method further includes a physical property measuring step of measuring a transient current flowing through the liquid crystal layer to which the voltage that cyclically varies is applied in the voltage application step to measure physical properties of the liquid crystal layer.
摘要翻译：提供一种用于TFT液晶面板的物理性质测量方法，包括将TFT液晶面板的TFT的源极与漏极之间的阻抗设定为小于或等于预定值的阻抗设定步骤，施加周期性变化的电压到TFT液晶面板的液晶层的电压施加步骤。该方法还包括物理性能测量步骤，用于测量在电压施加步骤中施加循环变化的电压的流过液晶层的瞬态电流，以测量液晶层的物理性质。

3. 发明授权

US09035169B2 Layered compound-metal particle composite and production method therefor, and suspension, film and flexible solar cell using same 有权
标题翻译：分层复合金属颗粒复合材料及其制备方法，悬浮液，薄膜和柔性太阳能电池使用相同
公开(公告)号：US09035169B2
公开(公告)日：2015-05-19
申请号：US13985193
申请日：2012-02-14
申请人： Sunao Yamada , Masahi Ogawa , Takashi Kurihara , Kengo Ito
发明人： Sunao Yamada , Masahi Ogawa , Takashi Kurihara , Kengo Ito
IPC分类号： H01G9/20 , C09C1/42 , C01B33/44 , B22F1/00 , B82Y30/00 , C09C3/04 , C09C3/08
CPC分类号： H01G9/2022 , B22F1/0018 , B82Y30/00 , C01B33/44 , C01P2002/82 , C01P2004/04 , C01P2006/40 , C09C1/42 , C09C3/041 , C09C3/08 , Y02E10/542 , Y02E10/549 , Y02P70/521 , Y10T428/24942 , Y10T428/256 , Y10T428/2991
摘要： A layered compound-metal particle composite 3 is obtained by the addition, to an organically modified layered compound 1 formed by the intercalation of organic ions between layers of a layered compound, of both an aqueous colloidal metal solution 2 in which metal particles are dispersed as a metal colloid in water, and a nonaqueous solvent which is a poor solvent for the metal colloid and has an excellent ability to swell the organically modified layered compound 1.
摘要翻译：通过将分散有金属粒子的水性胶态金属溶液2和水性胶态金属溶液2两者分散在层状化合物的层之间的有机离子的嵌入而形成的有机改性层叠体1中，得到层状复合金属粒子复合体3 水中的金属胶体和作为金属胶体的不良溶剂的非水溶剂，并且具有优异的溶胀有机改性层状化合物1的能力。

4. 发明授权

US08942895B2 Display system of hydraulic shovel, and control method therefor 有权
标题翻译：液压挖掘机显示系统及其控制方法
公开(公告)号：US08942895B2
公开(公告)日：2015-01-27
申请号：US13819456
申请日：2012-02-08
申请人： Azumi Nomura , Takashi Kurihara , Etsuo Fujita , Masao Ando
发明人： Azumi Nomura , Takashi Kurihara , Etsuo Fujita , Masao Ando
IPC分类号： G06F7/70 , G06F19/00 , G06G7/06 , G06G7/76 , G01S1/00 , G01S5/02 , E02F9/26
CPC分类号： E02F9/26 , E02F9/264
摘要： A display system in a hydraulic shovel has a calculation unit and a display unit. The calculation unit is configured to calculate a distance between a design surface and a position closest to the design surface among positions of a blade edge of a bucket in a widthwise direction of the blade edge based on positional information for the blade edge and the design surface. The display unit is configured and arranged to display a guidance picture. The guidance picture includes an image showing the positional relationship between the design surface and the blade edge of the bucket, and information indicating the distance between the design surface and the position closest to the design surface.
摘要翻译：液压挖掘机中的显示系统具有计算单元和显示单元。计算单元被配置为基于叶片边缘的位置信息和设计表面来计算在叶片边缘的宽度方向上的铲斗的叶片边缘的位置之间的设计表面和最接近设计表面的位置之间的距离。显示单元被配置和布置成显示引导图像。引导图像包括示出设计表面和铲斗边缘之间的位置关系的图像，以及指示设计表面与最靠近设计表面的位置之间的距离的信息。

5. 发明申请

US20140076384A1 LAYERED COMPOUND-METAL PARTICLE COMPOSITE AND PRODUCTION METHOD THEREFOR, AND SUSPENSION, FILM AND FLEXIBLE SOLAR CELL USING SAME 有权
标题翻译：层状化合物金属颗粒复合材料及其制备方法，以及使用其的悬浮液，薄膜和柔性太阳能电池
公开(公告)号：US20140076384A1
公开(公告)日：2014-03-20
申请号：US13985193
申请日：2012-02-14
申请人： Sunao Yamada , Masashi Ogawa , Takashi Kurihara , Kengo Ito
发明人： Sunao Yamada , Masashi Ogawa , Takashi Kurihara , Kengo Ito
IPC分类号： H01G9/20
CPC分类号： H01G9/2022 , B22F1/0018 , B82Y30/00 , C01B33/44 , C01P2002/82 , C01P2004/04 , C01P2006/40 , C09C1/42 , C09C3/041 , C09C3/08 , Y02E10/542 , Y02E10/549 , Y02P70/521 , Y10T428/24942 , Y10T428/256 , Y10T428/2991
摘要： A layered compound-metal particle composite 3 is obtained by the addition, to an organically modified layered compound 1 formed by the intercalation of organic ions between layers of a layered compound, of both an aqueous colloidal metal solution 2 in which metal particles are dispersed as a metal colloid in water, and a nonaqueous solvent which is a poor solvent for the metal colloid and has an excellent ability to swell the organically modified layered compound 1.
摘要翻译：通过将分散有金属粒子的水性胶态金属溶液2和水性胶态金属溶液2两者分散在层状化合物的层之间的有机离子的嵌入而形成的有机改性层叠体1中，得到层状复合金属粒子复合体3 水中的金属胶体和作为金属胶体的不良溶剂的非水溶剂，并且具有优异的溶胀有机改性层状化合物1的能力。

6. 发明授权

US08383421B2 Cartridge for automatic measurement and measuring device using the same 有权
标题翻译：墨盒用于自动测量和测量装置使用
公开(公告)号：US08383421B2
公开(公告)日：2013-02-26
申请号：US11332269
申请日：2006-01-17
申请人： Atsushi Yanagida , Takashi Kurihara , Hiroyuki Yokoi , Atsushi Koyata , Yoshikazu Okamura , Daishi Miyamoto
发明人： Atsushi Yanagida , Takashi Kurihara , Hiroyuki Yokoi , Atsushi Koyata , Yoshikazu Okamura , Daishi Miyamoto
IPC分类号： G01N1/10
CPC分类号： B01L3/50851 , B01L3/527 , B01L2300/021 , B01L2300/0809 , B01L2300/1883 , G01N35/026 , Y10T436/25 , Y10T436/2575
摘要： An object of the present invention is to provide a cartridge for automatic measurement used in an automatic measuring device, capable of automatically performing measurement including heat treatment of a sample, and a measuring device using the cartridge.The present invention relates to a cartridge for use in measuring a component to be measured contained in a sample, comprising: at least a heat-treatment well for performing heat treatment of the sample; and a reaction well for reacting the component to be measured in the sample with a material specifically reacting therewith.
摘要翻译：本发明的目的是提供一种用于自动测量的自动测量盒，能够自动执行包括样品的热处理的测量以及使用该盒的测量装置。本发明涉及一种用于测量样品中包含的待测组分的盒，包括：至少一个用于对样品进行热处理的热处理孔; 以及用于使样品中待测量的组分与其特异性反应的材料反应的反应。

7. 发明申请

US20120043005A1 ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD 有权
标题翻译：电子包装设备和电子包装方法
公开(公告)号：US20120043005A1
公开(公告)日：2012-02-23
申请号：US13117584
申请日：2011-05-27
申请人： Takatoyo YAMAKAMI , Hidehiko KIRA , Takashi KUBOTA , Kiyoshi OI , Kiyoaki IIDA , Takashi KURIHARA
发明人： Takatoyo YAMAKAMI , Hidehiko KIRA , Takashi KUBOTA , Kiyoshi OI , Kiyoaki IIDA , Takashi KURIHARA
IPC分类号： B32B37/02 , B32B37/14 , B32B37/12
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/75 , H01L2224/75743 , H01L2224/81001 , H01L2224/83001 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/01006 , H01L2924/01033 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/3512
摘要： A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.
摘要翻译：接合工具将下部芯片保持抵靠由吸力保持的释放带。接合工具具有电子部件吸入口，下部芯片被保持在该电子元件吸入口周围，并且围绕电子部件吸入口，容纳释放带的沟槽。下芯片通过压在底部填充材料上被加热，因此，形成上部芯片安装的区域，使得底部填充材料从下部芯片突出。在加热过程中，由于由于热而膨胀的释放带的扩张部分被插入到沟槽中，所以在底部填充材料的上表面上没有形成折线。

8. 发明授权

US08115300B2 Wiring substrate and manufacturing method thereof, and semiconductor apparatus 有权
标题翻译：配线基板及其制造方法以及半导体装置
公开(公告)号：US08115300B2
公开(公告)日：2012-02-14
申请号：US11763053
申请日：2007-06-14
申请人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
发明人： Shigetsugu Muramatsu , Tsuyoshi Kobayashi , Takashi Kurihara
IPC分类号： H01L23/12
CPC分类号： H05K3/4647 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/48227 , H05K1/111 , H05K3/108 , H05K3/4007 , H05K2201/0367 , H05K2201/09909 , Y02P70/611
摘要： In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wiring patterns are formed are covered with an insulating layer. Surfaces of connection parts of the wiring patterns formed on the tops of the protrusions are formed with the surfaces of the connection parts exposed to a surface of the insulating layer on a level with the surface of the insulating layer or in a position lower than the surface of the insulating layer. The connection parts are formed as pads for connection formed in alignment with connection electrodes of the semiconductor element. The semiconductor element is mounted by making electrical connection to the connection parts by flip chip bonding.
摘要翻译：在半导体装置中，将半导体元件安装在布线基板上。布线图案和突起形成在基板的表面上，布线图案在突起的顶部延伸。其上形成有布线图案的基板的表面被绝缘层覆盖。形成在突起的顶部上的布线图形的连接部分的表面形成有连接部分的表面暴露于绝缘层的表面与绝缘层的表面或低于表面的位置的绝缘层。连接部分形成为与半导体元件的连接电极对准形成的用于连接的焊盘。半导体元件通过倒装芯片接合与连接部分进行电连接来安装。

9. 发明申请

US20110285326A1 DISPLAY DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREFOR 审中-公开
标题翻译：显示器件基板及其制造方法
公开(公告)号：US20110285326A1
公开(公告)日：2011-11-24
申请号：US13147554
申请日：2010-02-02
申请人： Masaru Kajitani , Takashi Kurihara , Yukiya Nishioka
发明人： Masaru Kajitani , Takashi Kurihara , Yukiya Nishioka
IPC分类号： H05B37/02 , H01J9/24
CPC分类号： H01L27/3253 , H01L27/3246
摘要： A display device substrate to be bonded to a driving substrate provided with a driving circuit for driving a plurality of organic electroluminescent elements, the display device substrate comprising a substrate main body; a plurality of organic electroluminescent elements provided on the substrate main body; a bank sectioning the plurality of organic electroluminescent elements on the substrate main body; a protruding pedestal provided on the substrate main body; and a first connecting electrode arranged so as to extend from the organic electroluminescent element and over the pedestal, wherein in a state where the display device substrate has been bonded to the driving substrate, the pedestal is arranged at a position where the first connecting electrode arranged on the pedestal is connected with a second connecting electrode that the driving circuit has, and the bank and the pedestal have the same height.
摘要翻译：一种显示装置用基板，其与被配置有驱动多个有机电致发光元件的驱动电路的驱动基板接合，所述显示装置用基板包括基板主体; 设置在所述基板主体上的多个有机电致发光元件; 在所述基板主体上划分所述多个有机电致发光元件的堤; 设置在基板主体上的突出台座; 以及第一连接电极，其从所述有机电致发光元件延伸并且在所述基座上方布置，其中在所述显示装置基板已经接合到所述驱动基板的状态下，所述基座被布置在所述第一连接电极布置在基座上与驱动电路所具有的第二连接电极连接，堤岸和基座具有相同的高度。

10. 发明申请

US20110127656A1 SEMICONDUCTOR-DEVICE MOUNTED BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件安装板及其制造方法
公开(公告)号：US20110127656A1
公开(公告)日：2011-06-02
申请号：US12952452
申请日：2010-11-23
申请人： Toshio KOBAYASHI , Takaharu YAMANO , Takashi KURIHARA
发明人： Toshio KOBAYASHI , Takaharu YAMANO , Takashi KURIHARA
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L23/5389 , H01L21/6835 , H01L23/49816 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/13022 , H01L2224/20 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/18162 , H01L2224/82
摘要： In a method of manufacturing a semiconductor-device mounted board, connection terminals are formed on electrode pads on a semiconductor integrated circuit respectively. A first insulating layer is formed to cover the connection terminals. A plate-like medium having a rough surface is disposed on the first insulating layer. The rough surface of the plate-like medium is pressed onto the first insulating layer so that a part of each of the connection terminals is exposed. A semiconductor device is produced by removing the plate-like medium. A second insulating layer is formed to cover side surfaces of the semiconductor device. A wiring pattern is formed to cover surfaces of the first and second insulating layers, the wiring pattern being electrically connected to the exposed connection terminal parts.
摘要翻译：在制造半导体器件安装板的方法中，分别在半导体集成电路上的电极焊盘上形成连接端子。形成第一绝缘层以覆盖连接端子。具有粗糙表面的板状介质设置在第一绝缘层上。板状介质的粗糙表面被压在第一绝缘层上，使每个连接端子的一部分露出。通过去除板状介质来制造半导体器件。形成第二绝缘层以覆盖半导体器件的侧表面。形成布线图案以覆盖第一和第二绝缘层的表面，布线图案电连接到暴露的连接端子部分。

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