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    • 8. 发明申请
    • Nitride Semiconductor Laser and Method for Fabricating Same
    • 氮化物半导体激光器及其制造方法
    • US20090323746A1
    • 2009-12-31
    • US11922137
    • 2006-04-12
    • Susumu OhmiTakeshi Kamikawa
    • Susumu OhmiTakeshi Kamikawa
    • H01S5/22H01S5/323H01S5/343H01S5/00H01L21/18H01L33/00
    • H01S5/0201B82Y20/00H01S5/0202H01S5/0425H01S5/22H01S5/34333
    • In one embodiment of the present invention, in a method of fabricating a nitride semiconductor laser device, after an insulating film is formed on a layered nitride semiconductor portion on a substrate, a resist mask is formed on the insulating film, such that the insulating film is exposed near a position where an exit-side cleaved facet and a reflection-side cleaved facet are formed. The insulating film near a position where the exit-side cleaved facet and the reflection-side cleaved facet are formed is then removed, and, after the resist mask is removed, cleavage is performed. As a result, even if the substrate and the layered nitride semiconductor portion are cleaved at a position where the exit-side cleaved facet and the reflection-side cleaved facet are formed, the insulating film is not broken. This helps prevent fragments produced from the insulating film from being adhered to the exit-side cleaved facet and to the reflection-side cleaved facet.
    • 在本发明的一个实施例中,在制造氮化物半导体激光器件的方法中,在衬底上的层状氮化物半导体部分上形成绝缘膜之后,在绝缘膜上形成抗蚀剂掩模,使得绝缘膜 在出射侧切开面和反射侧切开面形成的位置附近露出。 然后除去形成出口侧劈开面和反射侧劈开面的位置附近的绝缘膜,在除去抗蚀剂掩模后,进行切割。 结果,即使在形成出射侧劈开面和反射面劈开面的位置处分离基板和层状氮化物半导体部分,绝缘膜也不会断裂。 这有助于防止从绝缘膜产生的碎片粘附到出射侧切割面和反射侧切割面。