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1. 发明授权

US07791585B2 Method of fabricating flexible display 有权
标题翻译：柔性显示器的制作方法
公开(公告)号：US07791585B2
公开(公告)日：2010-09-07
申请号：US11561068
申请日：2006-11-17
申请人： James D. Jackson , Terrance J. Dishongh , Damion T. Searls
发明人： James D. Jackson , Terrance J. Dishongh , Damion T. Searls
IPC分类号： G09G3/34
CPC分类号： G02F1/091 , G09F9/375 , Y10T428/24008 , Y10T428/25
摘要： A method of fabricating a flexible display, the method comprising selecting a first flexible sheet and a second flexible sheet; and forming a number of magnetic display elements having magnetically controllable reflectivity between the first flexible sheet and the second flexible sheet. In some embodiments, a display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.
摘要翻译：一种制造柔性显示器的方法，所述方法包括选择第一柔性片和第二柔性片; 以及在所述第一柔性片和所述第二柔性片之间形成具有磁性可控反射率的多个磁性显示元件。在一些实施例中，显示器包括具有磁可控反射率的像素。像素形成在一对柔性非导电片之间。每个磁性可控像素包括位于柔性非导电片之间的柔性环。每个磁性可控像素还包括位于柔性环内的磁性颗粒。磁性颗粒相对于柔性非导电片的位置确定像素的反射率。显示器特别适用于便携式电子设备的使用。

2. 发明授权

US07185799B2 Method of creating solder bar connections on electronic packages 有权
标题翻译：在电子封装上创建焊条连接的方法
公开(公告)号：US07185799B2
公开(公告)日：2007-03-06
申请号：US10812625
申请日：2004-03-29
申请人： Tom E. Pearson , Dudi I. Amir , Terrance J. Dishongh
发明人： Tom E. Pearson , Dudi I. Amir , Terrance J. Dishongh
IPC分类号： B23K31/02 , H05K1/11
CPC分类号： H05K3/3436 , H01L21/4853 , H01L23/50 , H01L2924/0002 , H01L2924/15311 , H05K1/0263 , H05K1/162 , H05K3/3452 , H05K2201/09236 , H05K2201/094 , H05K2201/099 , H05K2203/0338 , H05K2203/041 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , H01L2924/00
摘要： Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.
摘要翻译：在电子封装的基板和长度大于宽度的电路板之间产生焊接连接。焊接连接是通过将功率或接地连接的焊球定位得彼此靠近而形成的，使得当回流到电路板时，焊球组合，产生更大的焊接连接。然而，信号焊球保持分离。特定接合焊盘上的电源或接地焊球通过可拆卸焊接掩模的一部分彼此分开，以在焊球附着到电子封装期间使焊球保持球形。然而，它在回流到电路板之前被去除，从而在电子封装和电路板之间产生更大的更长的焊接连接。

3. 发明授权

US06996899B2 Electronic assembly and a method of constructing an electronic assembly 失效
公开(公告)号：US06996899B2
公开(公告)日：2006-02-14
申请号：US10397890
申请日：2003-03-25
申请人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson
发明人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson
IPC分类号： H01R9/00
CPC分类号： H01L23/49838 , H01L2224/16 , H05K1/0263 , H05K1/113 , H05K1/162 , H05K3/3436 , H05K2201/09236 , H05K2201/094 , H05K2201/09618 , H05K2201/10734 , H05K2203/0465 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49179
摘要： Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.

4. 发明授权

US06594151B2 Frame support for a printed board assembly 失效
标题翻译：支持印刷电路板组件的框架
公开(公告)号：US06594151B2
公开(公告)日：2003-07-15
申请号：US10004693
申请日：2001-12-05
申请人： Scott Dixon , George Hsieh , Terrance J. Dishongh
发明人： Scott Dixon , George Hsieh , Terrance J. Dishongh
IPC分类号： H05K500
CPC分类号： H05K3/301 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An assembly includes a substrate with mounting apertures. A frame is disposed through the apertures, optionally in a non-core area of the substrate, where a chassis at least partially encompasses a portion of the substrate. A component is coupled with the frame, and the frame is coupled with the chassis.
摘要翻译：组件包括具有安装孔的基板。一个框架设置成穿过该孔，可选地位于基底的非芯区域中，其中底架至少部分地包围基底的一部分。组件与框架相连，框架与底盘相连。

5. 发明授权

US06550531B1 Vapor chamber active heat sink 有权
标题翻译：蒸气室主动散热器
公开(公告)号：US06550531B1
公开(公告)日：2003-04-22
申请号：US09572926
申请日：2000-05-16
申请人： Damion T. Searls , Terrance J. Dishongh , Prateek J. Dujari , Bin Lian
发明人： Damion T. Searls , Terrance J. Dishongh , Prateek J. Dujari , Bin Lian
IPC分类号： F28D1500
CPC分类号： F28D15/0233 , F28D2021/0029 , F28F3/022 , F28F3/04 , H01L23/427 , H01L2224/16 , H01L2224/73253
摘要： A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion. The vapor chamber includes at least one extension on a vapor chamber upper surface which is adapted to direct a condensed working fluid toward a desired location on a vapor chamber lower surface. The vapor chamber lower surface may have at least one depression to collect a greater portion of the working fluid in a desired location(s).
摘要翻译：一种散热装置，包括具有从其延伸的多个突起的基部。基部可以具有限定在其中的蒸气室，并且可以具有从中心顶点部分到基部的边缘的第一表面倾斜。蒸气室包括在蒸气室上表面上的至少一个延伸部，其适于将冷凝的工作流体引导到蒸气室下表面上的期望位置。蒸汽室下表面可以具有至少一个凹陷以在期望的位置收集更大部分的工作流体。

6. 发明授权

US07886809B2 Apparatus and method for passive phase change thermal management 有权
标题翻译：被动相变热管理的装置和方法
公开(公告)号：US07886809B2
公开(公告)日：2011-02-15
申请号：US11930781
申请日：2007-10-31
申请人： Damion T. Searls , Terrance J. Dishongh , David Pullen
发明人： Damion T. Searls , Terrance J. Dishongh , David Pullen
IPC分类号： F28D15/00 , F28F17/00
CPC分类号： F28D15/00 , C09K5/063 , F28D20/021 , F28D2021/0031 , F28F23/00 , G06F1/20 , H01L23/4275 , H01L2924/0002 , Y02E60/145 , Y10T29/49353 , H01L2924/00
摘要： In one embodiment, an apparatus includes a phase change material, a plurality of particles intermixed with the phase change material, and a conductive structure encapsulating the phase change material. The conductive structure includes a cavity including a cone shape. In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.
摘要翻译：在一个实施例中，装置包括相变材料，与相变材料混合的多个颗粒以及封装相变材料的导电结构。导电结构包括包括锥形的空腔。在一个实施例中，一种方法包括形成具有空腔的导电结构，将相变材料注入到空腔中，将多个球注入空腔中并密封空腔。

7. 发明授权

US07512486B2 Fuel efficient navigation system 有权
标题翻译：燃油效率导航系统
公开(公告)号：US07512486B2
公开(公告)日：2009-03-31
申请号：US11171878
申请日：2005-06-29
申请人： Bradford H. Needham , Terrance J. Dishongh , Kevin S. Rhodes
发明人： Bradford H. Needham , Terrance J. Dishongh , Kevin S. Rhodes
IPC分类号： G01C21/00
CPC分类号： G01C21/3469
摘要： A method, device, and system are disclosed. In one embodiment, the method comprises acquiring vehicle fuel consumption information from a plurality of geographic locations, compiling the information to a map, and creating a low fuel consumption path between two locations on the map using the information.
摘要翻译：公开了一种方法，装置和系统。在一个实施例中，该方法包括从多个地理位置获取车辆燃料消耗信息，将信息编译成地图，以及使用该信息在地图上的两个位置之间创建低燃料消耗路径。

8. 发明授权

US07041357B2 Selective PCB stiffening with preferentially oriented fibers 失效
公开(公告)号：US07041357B2
公开(公告)日：2006-05-09
申请号：US10742024
申请日：2003-12-17
申请人： George Hsieh , Terrance J. Dishongh , Scott Dixon
发明人： George Hsieh , Terrance J. Dishongh , Scott Dixon
IPC分类号： B32B9/00
CPC分类号： B29C70/083 , B32B5/12 , B32B27/04 , H05K1/0271 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , Y10S428/901 , Y10T428/24058 , Y10T428/24074 , Y10T428/24091 , Y10T428/24099 , Y10T428/24116 , Y10T428/24124
摘要： Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

9. 发明授权

US06878305B2 Attaching components to a printed circuit card 失效
标题翻译：将组件连接到印刷电路板
公开(公告)号：US06878305B2
公开(公告)日：2005-04-12
申请号：US10696521
申请日：2003-10-28
申请人： George Hsieh , Terrance J. Dishongh , Norman J. Armendariz , David V. Spaulding
发明人： George Hsieh , Terrance J. Dishongh , Norman J. Armendariz , David V. Spaulding
IPC分类号： C03C10/02 , H05K3/32 , B32B31/00 , H01L29/43 , H01L35/24
CPC分类号： H05K3/321 , H05K2201/0248 , H05K2201/083 , H05K2201/10636 , H05K2203/104 , Y02P70/611 , Y10T428/2852 , Y10T428/2896 , Y10T428/32
摘要： Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
摘要翻译：使用聚合物和磁性材料颗粒的组合物将组分偶联到下面的衬底上。当在组件和印刷电路板之间施加组合物时，可以对组合物进行磁场以将磁性材料颗粒对准到组件和下层衬底之间的导电路径中。同时，聚合物基材料可以固化或固化，以固定由磁性材料颗粒形成的导电路径。

10. 发明授权

US06803527B2 Circuit board with via through surface mount device contact 失效
标题翻译：电路板通孔通过表面贴装器件接触
公开(公告)号：US06803527B2
公开(公告)日：2004-10-12
申请号：US10108127
申请日：2002-03-26
申请人： Terrance J. Dishongh , Bryce Horine
发明人： Terrance J. Dishongh , Bryce Horine
IPC分类号： H05K116
CPC分类号： H05K1/114 , H05K1/113 , H05K3/3421 , H05K2201/09709 , H05K2203/0455 , Y10T29/4913 , Y10T29/49147
摘要： A circuit board apparatus and a method for a circuit board. An embodiment of a circuit board includes a first layer and a second layer; a substrate between the first layer and the second layer; a first surface mount device pad on the first layer of the substrate; a first via, the first via being formed partially or wholly through a first end of the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer; a second surface mount device pad adjacent to the first surface mount device pad; and a second via, the second via being formed partially or wholly through a first end of the second surface mount device pad, the second via passing through the substrate, the first end of the first surface mount device pad being the end of the first surface mount device pad that is the farthest from the first end of the second surface mount device pad.
摘要翻译：一种电路板装置和电路板的方法。电路板的一个实施例包括第一层和第二层; 第一层和第二层之间的衬底; 在所述基板的第一层上的第一表面安装器件焊盘; 第一通孔，部分地或全部地通过第一表面安装器件焊盘的第一端形成，第一通孔在第一层和第二层之间穿过衬底; 与所述第一表面安装装置垫相邻的第二表面安装装置垫; 和第二通孔，所述第二通孔部分地或全部地通过所述第二表面安装器件焊盘的第一端形成，所述第二通孔穿过所述衬底，所述第一表面安装器件衬垫的第一端是所述第一表面的端部安装器件焊盘，其距离第二表面安装器件焊盘的第一端最远。

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