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1. 发明申请

US20170149155A1 SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR RADIAL FEATURE 审中-公开
公开(公告)号：US20170149155A1
公开(公告)日：2017-05-25
申请号：US14952242
申请日：2015-11-25
申请人： MERCURY SYSTEMS, INC.
发明人： Darryl J. MCKENNEY , Absu METHRATTA , Erica OUELLETTE
IPC分类号： H01R12/71 , H05K1/02 , H01R12/58
CPC分类号： H01R12/58 , H01R4/028 , H01R12/00 , H01R12/526 , H01R12/714 , H01R12/716 , H01R13/05 , H01R13/405 , H01R13/652 , H05K1/0213 , H05K1/0237 , H05K1/0298 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/181 , H05K1/184 , H05K3/308 , H05K3/34 , H05K3/3421 , H05K3/42 , H05K3/421 , H05K2201/09472 , H05K2201/09509 , H05K2201/09545 , H05K2201/09827 , H05K2201/10098 , H05K2201/10189 , H05K2201/10295 , H05K2201/1078 , H05K2201/10803 , H05K2201/10871 , H05K2201/10878 , H05K2201/10901 , H05K2203/0455 , Y02P70/611
摘要： According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

2. 发明授权

US08354595B2 Adhesive reinforced open hole interconnect 有权
标题翻译：粘合剂增强开孔互连
公开(公告)号：US08354595B2
公开(公告)日：2013-01-15
申请号：US12764854
申请日：2010-04-21
申请人： Kevin C. Rolston , Alberto F. Viscarra , Derek Pruden , Cindy W. Ma
发明人： Kevin C. Rolston , Alberto F. Viscarra , Derek Pruden , Cindy W. Ma
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K1/118 , H05K3/321 , H05K3/4635 , H05K2201/10666 , H05K2203/0455
摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
摘要翻译：一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。

3. 发明授权

US08243468B2 Low-thickness electronic module comprising a stack of electronic packages provided with connection balls 有权
标题翻译：低厚度电子模块包括设置有连接球的电子封装的堆叠
公开(公告)号：US08243468B2
公开(公告)日：2012-08-14
申请号：US11910433
申请日：2006-04-03
申请人： Christian Val
发明人： Christian Val
IPC分类号： H01R12/16
CPC分类号： H01L23/4985 , H01L23/3114 , H01L23/49816 , H01L23/5387 , H01L25/105 , H01L2225/1064 , H01L2225/107 , H01L2924/0002 , H01L2924/19041 , H05K1/116 , H05K1/189 , H05K3/3436 , H05K2201/09572 , H05K2201/09663 , H05K2203/041 , H05K2203/0455 , Y02P70/613 , H01L2924/00
摘要： The invention relates to an electronic module comprising a stack of n packages of predetermined thickness E, which are provided on a lower surface with connection balls of predetermined thickness eb, said connection balls being connected to a printed circuit for interconnecting the package. The printed circuit is placed on the lower surface of the package level with the balls, is drilled with metallized holes, in which the balls are located and to which they are connected, and has a thickness eci less than eb so as to obtain a module with a total thickness not exceeding n (E+10% eb).
摘要翻译：本发明涉及一种电子模块，其包括具有预定厚度E的n个封装的堆叠，其在具有预定厚度eb的连接球的下表面上提供，所述连接球连接到用于互连封装的印刷电路。印刷电路被放置在具有滚珠的包装水平的下表面上，钻有金属化的孔，其中滚珠位于其中并且它们被连接，并且具有小于eb的厚度eci以获得模块总厚度不超过n（E + 10％eb）。

4. 发明授权

US08146246B2 Method of manufacturing a wired circuit board 有权
标题翻译：布线电路板的制造方法
公开(公告)号：US08146246B2
公开(公告)日：2012-04-03
申请号：US12929520
申请日：2011-01-31
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： H05K1/112 , G11B5/4833 , H01L2224/11003 , H01L2224/742 , H05K1/056 , H05K3/06 , H05K3/244 , H05K3/28 , H05K3/363 , H05K3/44 , H05K2201/0394 , H05K2201/09063 , H05K2201/0969 , H05K2201/10666 , H05K2203/0323 , H05K2203/041 , H05K2203/0455 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204
摘要： A method of manufacturing a wired circuit board, including: forming an insulating layer in a pattern thereby forming second through holes penetrating the insulating layer in a thickness direction thereof; and after forming the insulating layer, forming, on the insulating layer, a conductive pattern in a pattern having terminals which are continuous with an upper surface and a side surface of a side end portion of the insulating layer such that the terminals extend into the second through holes. The terminals are operative for connecting with external terminals via a molten metal. The terminals include annular, step-shaped shoulder portions aligned with the second through holes and that are recessed downward from an upper surface, and first through holes having a diameter smaller than that of the second through holes and which pass through the terminals in a thickness direction thereof.
摘要翻译：一种制造布线电路板的方法，包括：以图案形成绝缘层，从而形成沿其厚度方向穿过绝缘层的第二通孔; 并且在形成绝缘层之后，在绝缘层上形成具有与绝缘层的侧端部的上表面和侧表面连续的端子的图案的导电图案，使得端子延伸到第二通孔。端子用于通过熔融金属与外部端子连接。端子包括与第二通孔对准的并且从上表面向下凹陷的环状的阶梯形肩部，以及具有小于第二通孔的直径的第一通孔，并且以贯穿端子的厚度方向。

5. 发明申请

US20110261539A1 ADHESIVE REINFORCED OPEN HOLE INTERCONNECT 有权
标题翻译：粘合加强开孔连接
公开(公告)号：US20110261539A1
公开(公告)日：2011-10-27
申请号：US12764854
申请日：2010-04-21
申请人： Kevin C. Rolston , Alberto F. Viscarra , Derek Pruden , Cindy W. Ma
发明人： Kevin C. Rolston , Alberto F. Viscarra , Derek Pruden , Cindy W. Ma
IPC分类号： H05K1/00 , B29C65/52
CPC分类号： H05K3/361 , H05K1/118 , H05K3/321 , H05K3/4635 , H05K2201/10666 , H05K2203/0455
摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
摘要翻译：一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。

6. 发明申请

US20110119911A1 Wired circuit board 有权
标题翻译：有线电路板
公开(公告)号：US20110119911A1
公开(公告)日：2011-05-26
申请号：US12929520
申请日：2011-01-31
申请人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
发明人： Hitoki Kanagawa , Tetsuya Ohsawa , Yasunari Ooyabu
IPC分类号： H05K3/34
CPC分类号： H05K1/112 , G11B5/4833 , H01L2224/11003 , H01L2224/742 , H05K1/056 , H05K3/06 , H05K3/244 , H05K3/28 , H05K3/363 , H05K3/44 , H05K2201/0394 , H05K2201/09063 , H05K2201/0969 , H05K2201/10666 , H05K2203/0323 , H05K2203/041 , H05K2203/0455 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204
摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.
摘要翻译：一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，从而导线4a，4b，4c，4d，磁头连接端子7和外部连接端子8一体形成，并且在外部连接端子8中也形成有第一通孔9.然后，在形成绝缘覆盖层10之后，在支撑板2上形成第三通孔20和第二通孔19，绝缘基底层3分别与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时可以进行连接，同时确认焊球的位置 21从相应的通孔。

7. 发明申请

US20100276797A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20100276797A1
公开(公告)日：2010-11-04
申请号：US12433429
申请日：2009-04-30
申请人： Stefan Landau , Ralf Otremba , Uwe Kirchner , Andreas Schloegl , Christian Fachmann , Joachim Mahler
发明人： Stefan Landau , Ralf Otremba , Uwe Kirchner , Andreas Schloegl , Christian Fachmann , Joachim Mahler
IPC分类号： H01L23/495 , H01L21/60 , H01L23/367
CPC分类号： H01L23/49548 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/32 , H01L24/40 , H01L2224/32245 , H01L2224/40095 , H01L2224/40247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0105 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19043 , H01L2924/30107 , H05K3/32 , H05K3/3442 , H05K3/3447 , H05K3/3468 , H05K3/3473 , H05K2201/09472 , H05K2201/10303 , H05K2201/1059 , H05K2201/10727 , H05K2201/10962 , H05K2201/10984 , H05K2203/0455 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a substrate having a chip island, a chip attached to the chip island, and encapsulation material deposited on the chip and part of the chip island. The chip island includes a first main face to which the chip is attached opposite a second main face, with the second main face of the chip island defining at least one cavity.
摘要翻译：半导体器件包括具有芯片岛的衬底，附接到芯片岛的芯片以及沉积在芯片岛和芯片岛的一部分上的封装材料。芯片岛包括第一主面，芯片与第二主面相对，芯片岛的第二主面限定至少一个空腔。

8. 发明授权

US07766665B2 Printed circuit board direct connection and method of forming the same 有权
标题翻译：印刷电路板直接连接及其形成方法
公开(公告)号：US07766665B2
公开(公告)日：2010-08-03
申请号：US12364445
申请日：2009-02-02
申请人： Fred Jessup , Erik Cegnar , Mike Maughan , David G. Alexander
发明人： Fred Jessup , Erik Cegnar , Mike Maughan , David G. Alexander
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： H05K3/366 , H05K2201/048 , H05K2201/09027 , H05K2201/09172 , H05K2201/09236 , H05K2201/09645 , H05K2201/10598 , H05K2203/0455
摘要： A system for directly connecting multiple printed circuit boards (PCB) circuits without the need for peripheral connectors. Multiple PCBs are electrically and mechanically interfaced with one or more plated holes or tabs on at least one first PCB and one or more plated tabs or holes on at least one second PCB. The plated tab(s)/hole(s) from said second PCB mate with the corresponding plated tab(s)/hole(s) from said first PCB to form a mechanical and electrical interconnect.
摘要翻译：用于直接连接多个印刷电路板（PCB）电路而不需要外围连接器的系统。多个PCB电气和机械地与至少一个第一PCB上的一个或多个电镀孔或突片相接合，并且在至少一个第二PCB上具有一个或多个镀覆的突片或孔。来自所述第二PCB的电镀突片/孔与来自所述第一PCB的相应的电镀突片/孔匹配以形成机械和电互连。

9. 发明申请

US20090040415A1 Flexible Printed Circuit Board and Liquid Crystal Display Device Using the Same 有权
标题翻译：柔性印刷电路板和使用其的液晶显示装置
公开(公告)号：US20090040415A1
公开(公告)日：2009-02-12
申请号：US12167743
申请日：2008-07-03
申请人： Wal-Hee Kim
发明人： Wal-Hee Kim
IPC分类号： G02F1/1333 , B23K1/00 , H05K1/00
CPC分类号： H05K1/189 , G02F1/13452 , G02F2001/133612 , H05K1/147 , H05K3/281 , H05K3/363 , H05K2201/058 , H05K2201/10106 , H05K2203/0455
摘要： A flexible printed circuit board for use in a liquid crystal display device includes: a body section having a light source portion embedded therein; a leg section including a solder pad connected to an external printed circuit board, the leg section being extended from the body section and integrally formed with the body section; and a single conductive layer formed across the body section and the leg section for electrically interconnecting the light source portion and the solder pad.
摘要翻译：一种用于液晶显示装置的柔性印刷电路板包括：具有嵌入其中的光源部分的主体部分; 腿部，其包括连接到外部印刷电路板的焊盘，所述腿部从所述主体部分延伸并与所述主体部分一体形成; 以及形成在主体部分和腿部上的单个导电层，用于将光源部分和焊盘电连接。

10. 发明申请

US20080206516A1 SURFACE MOUNT CIRCUIT BOARD, METHOD FOR MANUFACTURING SURFACE MOUNT CIRCUIT BOARD, AND METHOD FOR MOUNTING SURFACE MOUNT ELECTRONIC DEVICES 审中-公开
标题翻译：表面安装电路板，制造表面安装电路板的方法以及用于安装表面安装电子器件的方法
公开(公告)号：US20080206516A1
公开(公告)日：2008-08-28
申请号：US12032847
申请日：2008-02-18
申请人： Yoshihiko Matsushima
发明人： Yoshihiko Matsushima
IPC分类号： B32B3/10 , C23C26/00
CPC分类号： H05K1/112 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H05K1/0206 , H05K1/0212 , H05K3/3484 , H05K3/3494 , H05K3/4046 , H05K2201/0347 , H05K2201/0394 , H05K2201/09563 , H05K2201/09572 , H05K2201/0959 , H05K2201/10416 , H05K2203/0455 , H05K2203/1581 , Y10T428/24273 , H01L2924/00014
摘要： A surface mount circuit board includes: an insulating substrate having through holes each extending from front to rear surfaces of the insulating substrate; high thermal conductive members each filing a different one of the though holes; lands each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the front surface around the peripheral edge of the corresponding through hole; and heat receiving members each disposed to cover an end surface of a different one of the high thermal conductive members and also cover part of the rear surface around the peripheral edge of the corresponding through hole. Each land may be made of solder cream filled into and flashed out of the through hole. Alternatively to the high thermal conductive members, wire rods may be fitted into the respective through holes.
摘要翻译：表面安装电路板包括：具有各自从绝缘基板的前后表面延伸的通孔的绝缘基板; 高导热构件，每个填充不同的通孔; 每个设置成覆盖不同的一个高导热构件的端表面并且还覆盖围绕相应通孔的周缘的前表面的一部分; 以及热接收构件，每个热接收构件设置成覆盖不同的一个高导热构件的端表面，并且还覆盖围绕相应通孔的周缘的后表面的一部分。每个地面可以由填充并从通孔中闪烁的焊膏制成。作为高导热构件的替代方案，线材可以装配到相应的通孔中。

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