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1. 发明申请

US20110175634A1 FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
公开(公告)号：US20110175634A1
公开(公告)日：2011-07-21
申请号：US13075666
申请日：2011-03-30
申请人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
发明人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
IPC分类号： G01R31/3187 , G01R31/20
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

2. 发明申请

US20100304510A1 FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 有权
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20100304510A1
公开(公告)日：2010-12-02
申请号：US12853360
申请日：2010-08-10
申请人： Masayoshi OKAMOTO , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
发明人： Masayoshi OKAMOTO , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
IPC分类号： H01L21/66
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.
摘要翻译：为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

3. 发明申请

US20100175527A1 Paper Cutting Device Having Receiving Part 有权
标题翻译：接收部分的切纸装置
公开(公告)号：US20100175527A1
公开(公告)日：2010-07-15
申请号：US11884365
申请日：2006-03-06
申请人： Kazuo Nishimura , Toshiyuki Majima
发明人： Kazuo Nishimura , Toshiyuki Majima
IPC分类号： B26D7/00
CPC分类号： B26D7/20 , B26D1/085 , B26D7/025 , Y10T83/222 , Y10T83/7573 , Y10T83/8857 , Y10T83/887 , Y10T83/9309
摘要： A paper cutting device for cutting multiple sheets of paper stacked in layers on a table. The paper cutting device comprises a paper retainer (2) lowering from an upper side along a guide and a cutter (3) diagonally rising from the lower side. A receiving part (18) is mounted on the lower surface of a paper retaining frame (20). The receiving part (18) is formed by joining a base plate (36) with a large elastic modulus such as a metal to a resin receiving plate (37). A slip prevention means is installed on the joining surfaces of the base plate (36) and the receiving plate (37) to suppress the extension/retraction of the receiving part of the paper retainer so as to prevent wrinkles from occurring on the paper near a blade receiving surface when the paper is cut off.
摘要翻译：一种用于在桌子上层叠多层纸的切纸装置。切纸装置包括沿着引导件从上侧下降的纸张保持器（2）和从下侧对角地升起的切割器（3）。接收部件（18）安装在纸张保持框架（20）的下表面上。接收部（18）通过将具有大的弹性模量的基板（36）与金属接合而形成在树脂接受板（37）上。在基板（36）和接收板（37）的接合表面上安装有防滑装置，以抑制纸张保持器的接收部分的延伸/缩回，以防止靠近纸张的纸张上发生褶皱当纸被切断时刀片接收表面。

4. 发明申请

US20060130626A1 Paper cutting device with movable mobile receiving wood 失效
标题翻译：切纸装置可移动移动接收木材
公开(公告)号：US20060130626A1
公开(公告)日：2006-06-22
申请号：US10544672
申请日：2005-01-21
申请人： Kazuo Nishimura , Toshiyuki Majima
发明人： Kazuo Nishimura , Toshiyuki Majima
IPC分类号： B26D1/06
CPC分类号： B26D7/20 , Y10T83/8713 , Y10T83/8857 , Y10T83/9309
摘要： In a paper cutting machine for cutting a plurality of sheets of paper stacked one upon another on a table, including a paper support (2) moving down from above along longitudinal beams (19, 19) and a cutter (3) moving up from below in an oblique direction, the paper support (2) having a rest (18) for receiving a cutting edge of the cutter, a function of moving the rest (18) in a predetermined pitch whenever the number of strokes of the cutter (3) reaches a predetermined number of times is provided. Accordingly, even when the cutting edge of the cutter cuts into the rest and gets deteriorated, the cutter need not be exchanged immediately, life of the rest can be elongated and the number of sheets cut till exchange can be drastically improved.
摘要翻译：在用于切割桌子上的多张纸的纸张切割机中，包括沿着纵梁（19,19）从上方向下移动的纸张支架（2）和从下方向上移动的切割器（3）在倾斜方向上，纸支撑件（2）具有用于接收切割器的切割刃的静止部（18），每当刀具（3）的冲程数量都以预定间距移动时，其余部分（18）达到预定次数。因此，即使刀具的切割刃切割到其余部分并且劣化，切割器也不需要立即更换，其余部分的寿命可以延长，切割直到交换的纸张数量可以大大提高。

5. 发明申请

US20100275754A1 PUNCHING UNIT 审中-公开
标题翻译：冲压单元
公开(公告)号：US20100275754A1
公开(公告)日：2010-11-04
申请号：US12746612
申请日：2008-12-05
申请人： Kazuo Nishimura , Toshiyuki Majima , Megumi Ichikawa , Susumu Ishii
发明人： Kazuo Nishimura , Toshiyuki Majima , Megumi Ichikawa , Susumu Ishii
IPC分类号： B26D7/18 , B26F1/08
CPC分类号： B26D7/18 , B26D5/32 , B26F1/10 , Y10T83/222 , Y10T83/7809 , Y10T83/9387
摘要： There is provided a punching unit that is readily adjusted, is capable of always punching high quality holes through sheets and is steadily capable of discharging punch chips. A punch shaft and a die shaft are disposed vertically in parallel between side plates and these very punch shaft and the die shaft compose structural members (reinforcing members) of the punching unit. The die shaft has a die shaft body formed into a hollow cylinder and is provided with dies that correspond to the punches of the punch shaft at an outer peripheral surface thereof while fitting into die holes penetrating to the hollow section. A chip discharging screw plate fixed to the right side plate is disposed in the hollow section of the die shaft. Punch chips are transported along slopes of the chip discharging screw plate and discharged out of an opening when the die shaft rotates.
摘要翻译：提供了一种易于调节的冲孔单元，能够始终通过片材冲压高品质的孔，并且能够稳定地排出冲压片。冲头轴和模轴垂直地设置在侧板之间并且这些非常的冲头轴和模轴构成冲压单元的结构构件（加强构件）。模轴具有形成为中空圆筒的模轴主体，并且在其外周面上设置有与冲头轴的冲头相对应的模具，同时嵌入穿入中空部的模孔中。固定在右侧板上的排屑螺钉板设置在模轴的中空部分中。冲切屑沿芯片排出螺旋板的斜面输送，并在模轴旋转时从开口排出。

6. 发明授权

US07458505B2 Boring device 失效
标题翻译：镗孔装置
公开(公告)号：US07458505B2
公开(公告)日：2008-12-02
申请号：US10532135
申请日：2003-10-21
申请人： Toshiyuki Majima , Kazuo Nishimura
发明人： Toshiyuki Majima , Kazuo Nishimura
IPC分类号： B26F1/04 , B26F1/14
CPC分类号： B26D5/16 , B26F1/04 , B26F1/36 , Y10T83/8727 , Y10T83/943
摘要： A punching unit is arranged so that a plurality of punches is grouped into a first group having a predetermined number of punches and a second group containing any one of the punches in the first group and having a smaller number of punches. A punching state of the predetermined number of punches is produced by reciprocating a reciprocating member within a first range and by vertically moving the punches of the first group through the intermediary of cams and followers corresponding to the first group and another punching state of the smaller number of punches is reached by reciprocating the reciprocating member within a second movable range and vertically moving the punches of the second group through the intermediary of cams and followers corresponding to the second group. This arrangement allows the number of punches and dies to be reduced as compared to the prior art.
摘要翻译：冲孔单元布置成使得多个冲头被组合成具有预定数量的冲头的第一组和包含第一组中的任何一个冲头并且具有较小冲头数量的第二组。通过往复运动的构件在第一范围内往复运动并且通过相应于第一组的凸轮和跟随器的中间垂直移动第一组的冲头而产生预定数量的冲头的冲压状态，并且产生较小数量的另一冲压状态通过使往复运动构件在第二可移动范围内往复运动并且通过相应于第二组的凸轮和跟随器的中间垂直地移动第二组的冲头来达到冲头。与现有技术相比，这种布置允许减少冲头和冲头的数量。

7. 发明申请

US20080020498A1 FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20080020498A1
公开(公告)日：2008-01-24
申请号：US11861089
申请日：2007-09-25
申请人： Masayoshi OKAMOTO , Yoshiaki HASEGAWA , Yasuhiro MOTOYAMA , Hideyuki MATSUMOTO , Shingo YORISAKI , Akio HASEBE , Ryuji SHIBATA , Yasunori NARIZUKA , Akira YABUSHITA , Toshiyuki MAJIMA
发明人： Masayoshi OKAMOTO , Yoshiaki HASEGAWA , Yasuhiro MOTOYAMA , Hideyuki MATSUMOTO , Shingo YORISAKI , Akio HASEBE , Ryuji SHIBATA , Yasunori NARIZUKA , Akira YABUSHITA , Toshiyuki MAJIMA
IPC分类号： H01L21/66
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.
摘要翻译：为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

8. 发明申请

US20070292018A1 Semiconductor failure analysis apparatus, failure analysis method, and failure analysis program 有权
标题翻译：半导体故障分析装置，故障分析方法和故障分析程序
公开(公告)号：US20070292018A1
公开(公告)日：2007-12-20
申请号：US11586721
申请日：2006-10-26
申请人： Toshiyuki Majima , Akira Shimase , Hirotoshi Terada , Kazuhiro Hotta
发明人： Toshiyuki Majima , Akira Shimase , Hirotoshi Terada , Kazuhiro Hotta
IPC分类号： G01R31/303
CPC分类号： G01N21/95607 , G01N2021/95615
摘要： A failure analysis apparatus 10 is composed of an inspection information acquirer 11 for acquiring a failure observed image P2 of a semiconductor device, a layout information acquirer 12 for acquiring layout information, and a failure analyzer 13 for analyzing a failure. The failure analyzer 13 extracts as a candidate interconnection for a failure, an interconnection passing an analysis region, out of a plurality of interconnections, using interconnection information to describe a configuration of interconnections in the semiconductor device by a pattern data group of interconnection patterns in respective layers, and, for extracting the candidate interconnection, it performs an equipotential trace of the interconnection patterns using the pattern data group, thereby extracting the candidate interconnection. This substantializes a semiconductor failure analysis apparatus, failure analysis method, and failure analysis program capable of securely and efficiently performing the analysis of the failure of the semiconductor device using the failure observed image.
摘要翻译：失效分析装置10由用于获取半导体器件的故障观察图像P 2的检查信息获取器11，用于获取布局信息的布局信息获取器12以及用于分析故障的故障分析器13组成。故障分析器13通过互连信息提取出故障的候选互连，通过分析区域的互连，使用互连信息，以通过相应的互连模式的图案数据组来描述半导体器件中的互连的配置并且为了提取候选互连，它使用模式数据组来执行互连模式的等势线，从而提取候选互连。这实现了半导体故障分析装置，故障分析方法和故障分析程序，其能够安全有效地执行使用故障观察图像的半导体器件的故障的分析。

9. 发明申请

US20070020781A1 Semiconductor failure analysis apparatus, failure analysis method, and failure analysis program 审中-公开
标题翻译：半导体故障分析装置，故障分析方法和故障分析程序
公开(公告)号：US20070020781A1
公开(公告)日：2007-01-25
申请号：US11409272
申请日：2006-04-24
申请人： Toshiyuki Majima , Akira Shimase , Hirotoshi Terada , Kazuhiro Hotta , Masahiro Takeda
发明人： Toshiyuki Majima , Akira Shimase , Hirotoshi Terada , Kazuhiro Hotta , Masahiro Takeda
IPC分类号： H01L21/66
CPC分类号： G01N21/956 , G06T7/001 , G06T2207/30148
摘要： A failure analysis apparatus 10 is composed of an inspection information acquirer 11 for acquiring a failure observed image P2 of a semiconductor device, a layout information acquirer 12 for acquiring layout information, a failure analyzer 13 for analyzing a failure of the semiconductor device, and an analysis screen display controller 14 for letting a display device 40 display information about a result of the analysis. The failure analyzer 13 sets an analysis region with reference to the failure observed image P2, and extracts a net passing the analysis region, from a plurality of nets included in a layout of the semiconductor device. This substantializes a semiconductor failure analysis apparatus, analysis method, and analysis program capable of securely and efficiently performing the analysis of the failure of the semiconductor device.
摘要翻译：失效分析装置10由用于获取半导体装置的故障观察图像P 2的检查信息获取部11，用于获取布局信息的布局信息获取部12，用于分析半导体装置的故障的故障分析部13，以及用于使显示装置40显示关于分析结果的信息的分析屏幕显示控制器14。故障分析器13参照故障观察图像P 2设定分析区域，从包含在半导体装置的布局中的多个网络提取通过分析区域的网络。这实现了能够安全有效地执行半导体器件的故障分析的半导体故障分析装置，分析方法和分析程序。

10. 发明申请

US20050093565A1 Fabrication method of semiconductor integrated circuit device 审中-公开
标题翻译：半导体集成电路器件的制造方法
公开(公告)号：US20050093565A1
公开(公告)日：2005-05-05
申请号：US10968215
申请日：2004-10-20
申请人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
发明人： Masayoshi Okamoto , Yoshiaki Hasegawa , Yasuhiro Motoyama , Hideyuki Matsumoto , Shingo Yorisaki , Akio Hasebe , Ryuji Shibata , Yasunori Narizuka , Akira Yabushita , Toshiyuki Majima
IPC分类号： G01R1/06 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/66 , H01L21/822 , H01L27/04 , G01R31/26
CPC分类号： H01L22/14 , G01R1/06711 , G01R1/06744 , G01R1/07307 , G01R3/00 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/49171 , H01L2924/014 , H01L2924/3011 , H01L2924/00
摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.
摘要翻译：为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

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