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1. 发明授权

US07799608B2 Die stacking apparatus and method 有权
标题翻译：模具堆垛装置及方法
公开(公告)号：US07799608B2
公开(公告)日：2010-09-21
申请号：US11832519
申请日：2007-08-01
申请人： Vincent Chan , Neil McLellan , Kevin O'Neil
发明人： Vincent Chan , Neil McLellan , Kevin O'Neil
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05571 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/16145 , H01L2224/73253 , H01L2225/06513 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30107 , H01L2924/00014
摘要： Various stacked semiconductor devices and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor die that has a first bulk semiconductor side and a first opposite side. A second semiconductor die is provided that has a second bulk semiconductor side and a second opposite side. The second opposite side of the second semiconductor die is coupled to the first opposite side of the first semiconductor die. Electrical connections are formed between the first semiconductor die and the second semiconductor die.
摘要翻译：提供各种叠层半导体器件及其制造方法。一方面，提供一种制造方法，其包括提供具有第一体半导体侧和第一相对侧的第一半导体管芯。提供了具有第二体半导体侧和第二相对侧的第二半导体管芯。第二半导体管芯的第二相对侧耦合到第一半导体管芯的第一相对侧。在第一半导体管芯和第二半导体管芯之间形成电连接。

2. 发明申请

US20090278264A1 Semiconductor Chip Bump Connection Apparatus and Method 有权
标题翻译：半导体芯片凸块连接装置及方法
公开(公告)号：US20090278264A1
公开(公告)日：2009-11-12
申请号：US12119174
申请日：2008-05-12
申请人： Roden R. Topacio , Vincent Chan , Fan Yeung
发明人： Roden R. Topacio , Vincent Chan , Fan Yeung
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H05K3/3452 , H01L23/49811 , H01L23/49816 , H01L23/50 , H01L24/16 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/13099 , H01L2224/13111 , H01L2224/16237 , H01L2224/81136 , H01L2224/81801 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H05K2201/0989 , H05K2201/10674 , H01L2924/00014
摘要： Various semiconductor chip packages and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a solder bump to a side of a semiconductor chip and bringing the solder bump into contact with a conductor pad coupled to a substrate and positioned in an opening of a solder mask on the substrate. The conductor pad has a first lateral dimension and the opening has a second lateral dimension that is larger than the first lateral dimension. A metallurgical bond is established between the solder bump and the conductor pad.
摘要翻译：公开了各种半导体芯片封装及其制造方法。在一个方面，提供了一种制造方法，其包括将焊料凸点耦合到半导体芯片的一侧，并使焊料凸块与耦合到基板的导体焊盘接触并定位在衬底上的焊料掩模的开口中。导体垫具有第一横向尺寸，并且开口具有大于第一横向尺寸的第二横向尺寸。在焊料凸块和导体焊盘之间建立冶金结合。

3. 发明授权

US06929976B2 Multi-die module and method thereof 有权
标题翻译：多模模块及其方法
公开(公告)号：US06929976B2
公开(公告)日：2005-08-16
申请号：US10616342
申请日：2003-07-09
申请人： Vincent Chan , Samuel Ho
发明人： Vincent Chan , Samuel Ho
IPC分类号： H01L25/065 , H01L25/10 , H01L25/18 , H05K1/14 , H05K1/18 , H05K3/34 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H05K1/141 , H01L24/73 , H01L25/03 , H01L25/0655 , H01L25/18 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92125 , H01L2224/92247 , H01L2225/1005 , H01L2924/01067 , H01L2924/01079 , H01L2924/15311 , H05K1/181 , H05K3/3436 , H05K2201/10734 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die module to be interchangeable with conventional multi-die packages. In one embodiment, the unpackaged die is a graphics processor, and the packaged die is a standard memory that has been burned in, functionally tested, and speed rated.
摘要翻译：如本文所公开的，多管芯模块电连接到未封装的管芯和封装的管芯。多模模块具有与不包括封装模具的常规多管芯封装相同的覆盖区，从而允许多模模块可与常规多管芯封装互换。在一个实施例中，未封装的裸片是图形处理器，并且封装的裸片是已被烧录，功能测试和速度评估的标准存储器。

4. 发明授权

US08935788B1 Two stage virus detection 有权
标题翻译：两级病毒检测
公开(公告)号：US08935788B1
公开(公告)日：2015-01-13
申请号：US12252205
申请日：2008-10-15
申请人： Lili Diao , Vincent Chan , Patrick Mg Lu
发明人： Lili Diao , Vincent Chan , Patrick Mg Lu
IPC分类号： G06F11/30 , G06F21/56
CPC分类号： G06F21/564 , G06F21/561
摘要： A two stage virus detection system detects viruses in target files. In the first stage, a training application receives a master virus pattern file recording all known virus patterns and generates a features list containing fundamental virus signatures from the virus patterns, a novelty detection model, a classification model, and a set of segmented virus pattern files. In the second stage, a detection application scans a target file for viruses using the generated outputs from the first stage rather than using the master virus pattern file directly to do traditional pattern matching. The results of the scan can vary in detail depending on a fuzzy scan level. For fuzzy scan level “1,” the existence of a virus is returned. For fuzzy scan level “2,” the grant virus type found is returned. For fuzzy scan level “3,” the exact virus name is returned. This invention provides a solution for the problems caused by traditional virus detection solution: slow scanning speed, big pattern file, big burden on computation resource (CPU, RAM etc.), as well as heavy pattern updating traffic via networks.
摘要翻译：两级病毒检测系统检测目标文件中的病毒。在第一阶段，训练应用程序接收记录所有已知病毒模式的主病毒模式文件，并生成包含病毒模式的基本病毒签名的功能列表，新颖性检测模型，分类模型和一组分段病毒模式文件。在第二阶段，检测应用程序使用来自第一阶段的生成输出来扫描目标文件以获取病毒，而不是直接使用主病毒码文件来进行传统的模式匹配。根据模糊扫描级别，扫描结果可能会有详细的变化。对于模糊扫描级别“1”，返回病毒的存在。对于模糊扫描级别“2”，返回发现的授权病毒类型。对于模糊扫描级别“3”，返回确切的病毒名称。本发明为传统病毒检测解决方案提供了一个解决方案：扫描速度慢，格式文件大，计算资源负担大（CPU，RAM等），以及通过网络大量更新流量。

5. 发明授权

US08177644B2 Wagering game with fantasy-sports feature 有权
标题翻译：投注游戏与幻想运动功能
公开(公告)号：US08177644B2
公开(公告)日：2012-05-15
申请号：US12377531
申请日：2007-08-15
申请人： Peter R. Anderson , Rory L. Block , Joel R. Jaffe , Shridhar P. Joshi , Vincent Chan , Patrick H. Kelley , Richard T. Schwartz , Byron A. Uytiepo
发明人： Peter R. Anderson , Rory L. Block , Joel R. Jaffe , Shridhar P. Joshi , Vincent Chan , Patrick H. Kelley , Richard T. Schwartz , Byron A. Uytiepo
IPC分类号： A63F9/24
CPC分类号： G07F17/32
摘要： A gaming system and method of conducting a wagering game having a fantasy-sports feature on a gaming system is disclosed. A wager is received from a user to play the wagering game. A roster having one or more player is created, via user selection. A projected team score and an actual team score for the created roster are determined. A ratio is calculated for the actual team score to the projected team score. An award is provided to the user if the calculated ratio meets a predetermined criterion.
摘要翻译：公开了一种在游戏系统上进行具有幻想运动特征的投注游戏的游戏系统和方法。从用户那里收到下注来玩下注游戏。通过用户选择创建具有一个或多个播放器的花名册。确定了创建的名单的预计团队得分和实际团队得分。计算出实际团队得分与预计团队得分的比率。如果计算的比率满足预定标准，则向用户提供奖励。

6. 发明授权

US07969020B2 Die stacking apparatus and method 有权
标题翻译：模具堆垛装置及方法
公开(公告)号：US07969020B2
公开(公告)日：2011-06-28
申请号：US12868339
申请日：2010-08-25
申请人： Vincent Chan , Neil McLellan , Kevin O'Neil
发明人： Vincent Chan , Neil McLellan , Kevin O'Neil
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/11 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05571 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/16145 , H01L2224/73253 , H01L2225/06513 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30107 , H01L2924/00014
摘要： Various stacked semiconductor devices and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor die that has a first bulk semiconductor side and a first opposite side. A second semiconductor die is provided that has a second bulk semiconductor side and a second opposite side. The second opposite side of the second semiconductor die is coupled to the first opposite side of the first semiconductor die. Electrical connections are formed between the first semiconductor die and the second semiconductor die.
摘要翻译：提供各种叠层半导体器件及其制造方法。一方面，提供一种制造方法，其包括提供具有第一体半导体侧和第一相对侧的第一半导体管芯。提供了具有第二体半导体侧和第二相对侧的第二半导体管芯。第二半导体管芯的第二相对侧耦合到第一半导体管芯的第一相对侧。在第一半导体管芯和第二半导体管芯之间形成电连接。

7. 发明申请

US20100285857A1 Wagering Game With Fantasy-Sports Feature 有权
标题翻译：投注游戏与幻想体育功能
公开(公告)号：US20100285857A1
公开(公告)日：2010-11-11
申请号：US12377531
申请日：2007-08-15
申请人： Peter R. Anderson , Rory L. Block , Joel R. Jaffe , Shridhar P. Joshi , Vincent Chan , Patrick H. Kelley , Richard T. Schwartz
发明人： Peter R. Anderson , Rory L. Block , Joel R. Jaffe , Shridhar P. Joshi , Vincent Chan , Patrick H. Kelley , Richard T. Schwartz
IPC分类号： A63F9/24 , A63F13/00
CPC分类号： G07F17/32
摘要： A gaming system and method of conducting a wagering game having a fantasy-sports feature on a gaming system is disclosed. A wager is received from a user to play the wagering game. A roster having one or more player is created, via user selection. A projected team score and an actual team score for the created roster are determined. A ratio is calculated for the actual team score to the projected team score. An award is provided to the user if the calculated ratio meets a predetermined criterion.
摘要翻译：公开了一种在游戏系统上进行具有幻想运动特征的投注游戏的游戏系统和方法。从用户那里收到下注来玩下注游戏。通过用户选择创建具有一个或多个播放器的花名册。确定了创建的名单的预计团队得分和实际团队得分。计算出实际团队得分与预计团队得分的比率。如果计算的比率满足预定标准，则向用户提供奖励。

8. 发明授权

US07764171B2 Adjusting a communications channel between control unit and remote sensor 有权
标题翻译：调整控制单元和遥控传感器之间的通讯通道
公开(公告)号：US07764171B2
公开(公告)日：2010-07-27
申请号：US11860154
申请日：2007-09-24
申请人： Chung Ming Cheng , Ho Sin Vincent Chan
发明人： Chung Ming Cheng , Ho Sin Vincent Chan
IPC分类号： G08B1/08
CPC分类号： H04B17/318 , H04B17/23
摘要： The present invention provides apparatuses and systems for adjusting a communication channel between a control unit and a remote sensor. A system may include a control unit that controls an environmental unit and a remote sensor that provides data about an environmental factor as measured at the remote sensor. The remote sensor transmits a radio frequency (RF) signal that conveys the data to control unit through a directional antenna. The RF signal is received by the control unit through an omnidirectional antenna, and a signal strength parameter is determined from the received RF signal. A signal strength indication unit provides an indication from the signal strength parameter as a user adjusts the position of the directional antenna. With embodiments of the invention, a signal strength module generates an audio signal in accordance with an audio characteristic, which is indicative of the signal strength of the received RF signal.
摘要翻译：本发明提供了用于调整控制单元和远程传感器之间的通信信道的设备和系统。系统可以包括控制环境单元的控制单元和提供关于在远程传感器处测量的环境因素的数据的远程传感器。远程传感器通过定向天线传送将数据传送到控制单元的射频（RF）信号。 RF信号由控制单元通过全向天线接收，并且从接收的RF信号确定信号强度参数。当用户调整定向天线的位置时，信号强度指示单元从信号强度参数提供指示。利用本发明的实施例，信号强度模块根据音频特性产生音频信号，音频特征指示所接收的RF信号的信号强度。

9. 发明申请

US20100140798A1 SEMICONDUCTOR CHIP BUMP CONNECTION APPARATUS AND METHOD 有权
标题翻译：半导体芯片连接装置和方法
公开(公告)号：US20100140798A1
公开(公告)日：2010-06-10
申请号：US12692239
申请日：2010-01-22
申请人： Roden R. Topacio , Vincent Chan , Fan Yeung
发明人： Roden R. Topacio , Vincent Chan , Fan Yeung
IPC分类号： H01L23/498
CPC分类号： H05K3/3452 , H01L23/49811 , H01L23/49816 , H01L23/50 , H01L24/16 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/13099 , H01L2224/13111 , H01L2224/16237 , H01L2224/81136 , H01L2224/81801 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H05K2201/0989 , H05K2201/10674 , H01L2924/00014
摘要： Various semiconductor chip packages and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a solder bump to a side of a semiconductor chip and bringing the solder bump into contact with a conductor pad coupled to a substrate and positioned in an opening of a solder mask on the substrate. The conductor pad has a first lateral dimension and the opening has a second lateral dimension that is larger than the first lateral dimension. A metallurgical bond is established between the solder bump and the conductor pad.
摘要翻译：公开了各种半导体芯片封装及其制造方法。在一个方面，提供了一种制造方法，其包括将焊料凸点耦合到半导体芯片的一侧，并使焊料凸块与耦合到基板的导体焊盘接触并定位在衬底上的焊料掩模的开口中。导体垫具有第一横向尺寸，并且开口具有大于第一横向尺寸的第二横向尺寸。在焊料凸块和导体焊盘之间建立冶金结合。

10. 发明申请

US20090248145A1 METHOD OF FORMING A THREE-DIMENSIONAL STRUCTURE OF UNIDIRECTIONALLY ALIGNED CELLS 审中-公开
标题翻译：形成非均匀对齐细胞的三维结构的方法
公开(公告)号：US20090248145A1
公开(公告)日：2009-10-01
申请号：US12058580
申请日：2008-03-28
申请人： Bee Eng Chan , Jie Feng , Jinye Shen , Vincent Chan
发明人： Bee Eng Chan , Jie Feng , Jinye Shen , Vincent Chan
IPC分类号： A61F2/06 , C12N5/06
CPC分类号： C12N5/0691 , A61L27/3891 , A61L27/3895 , A61L27/507 , C12N2535/10
摘要： The present invention provides a method of forming a three-dimensional structure of unidirectionally aligned cells. The method comprises providing a substrate with a microchannel. The microchannel is defined by at least a pair of opposing lateral walls and a base. In at least a portion of the microchannel the distance between the pair of opposing lateral walls is within the micrometer range. A first plurality of cells is seeded in the microchannel and the cells are allowed to proliferate up to at least a density of at least 90%. Thereby contact guidance cues are provided by the pair of opposing lateral walls of the microchannel, such that the cells align unidirectionally. Thereby a first layer of aligned cells is also formed at the base of the microchannel. A second plurality of cells is seeded in the microchannel, which already comprises a first layer of aligned cells. When allowing cells of the second plurality of cells to proliferate up to at least substantial confluence, contact guidance cues are again provided by the lateral walls of the microchannel. The cells also align unidirectionally and form a second layer of aligned cells.
摘要翻译：本发明提供了形成单向排列单元的三维结构的方法。该方法包括向基底提供微通道。微通道由至少一对相对的侧壁和底座限定。在微通道的至少一部分中，一对相对的侧壁之间的距离在微米范围内。将第一组多个细胞接种在微通道中，并使细胞增殖至少至少90％的密度。因此，接触引导线索由微通道的一对相对的侧壁提供，使得单元单向对准。由此，在微通道的基部也形成第一层对准的单元。将第二组多个单元接种在微通道中，该微通道已经包括第一层对准的单元。当允许第二多个细胞的细胞增殖至少至少基本汇合时，接触引导线索再次由微通道的侧壁提供。单元还单向对准并形成第二层对准的单元。

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