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1. 发明授权

US08804302B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08804302B2
公开(公告)日：2014-08-12
申请号：US13187617
申请日：2011-07-21
申请人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka , Masaki Hirota
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka , Masaki Hirota
IPC分类号： H01C7/13
CPC分类号： H01C7/008 , H01C7/13 , H01F17/0013 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083
摘要： A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0≦t1≦(⅖)t0 is satisfied, where t0 is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.
摘要翻译：陶瓷电子部件包括陶瓷基体，第一和第二内部电极以及第一和第二外部电极。第一外部电极设置在纵向方向上的第一主表面的第一端部处。第二外部电极设置在第一主表面的纵向方向的第二端部处。第一外部电极和第二外部电极中的每一个的一部分在厚度方向上与第一和第二内部电极在厚度方向上彼此相对的区域相对。满足条件（1/10）t0＆nlE; t1＆nlE;（⅖）t0，其中t0是第一和第二外部电极中的每一个的厚度，t1是其中第一和第二外部电极中的每一个的部分的厚度嵌入第一主表面。

2. 发明授权

US08259433B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08259433B2
公开(公告)日：2012-09-04
申请号：US12617834
申请日：2009-11-13
申请人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Kosuke Onishi
发明人： Yasuhiro Nishisaka , Yukio Sanada , Koji Sato , Kosuke Onishi
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/232
摘要： In a ceramic electronic component having a thin structure, the occurrence of cracks due to stress applied when the ceramic component is being mounted or in a mounted state are prevented. Each of first and second external terminal electrodes has a substantially rectangular region on a principal surface of a ceramic element body, the principal surface being directed to the mounting surface side. An end of the first external terminal electrode, which is arranged in contact with a gap region, and an end of the second external terminal electrode, which is positioned in contact with the gap region, each preferably have a concave-convex shape on the principal surface.
摘要翻译：在具有薄结构的陶瓷电子部件中，防止了当安装陶瓷部件或处于安装状态时施加的应力引起的裂纹的发生。第一外部端子电极和第二外部端子电极中的每一个在陶瓷元件主体的主表面上具有基本上矩形的区域，主表面指向安装表面侧。与间隙区域接触的第一外部端子电极的端部和与间隙区域接触的第二外部端子电极的端部各自优选地在主体上具有凹凸形状表面。

3. 发明申请

US20120188682A1 CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：陶瓷电子元件
公开(公告)号：US20120188682A1
公开(公告)日：2012-07-26
申请号：US13354369
申请日：2012-01-20
申请人： Koji SATO , Yukio SANADA , Makoto OGAWA , Yasuhiro NISHISAKA
发明人： Koji SATO , Yukio SANADA , Makoto OGAWA , Yasuhiro NISHISAKA
IPC分类号： H01G4/008 , H01C7/13 , H01L41/047 , H01F5/00
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1≦t/d≦0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.
摘要翻译：陶瓷电子部件包括陶瓷体，第一外部电极和第二外部电极。第一外部电极和第二外部电极被设置在陶瓷体的朝向安装面侧的主面上，以便在它们之间以预定的间隙区域彼此面对。外部电极各自包括基层和覆盖基层的Cu镀层。在第一外部电极和第二外部电极中的每一个中，满足表达式0.1＆nlE; t / d＆nlE; 0.5，其中t是在间隙区域侧的基底层的端部处的Cu镀层的厚度，d是从间隙区域侧的基底层的端部到间隙区域侧的Cu镀层的端部的距离。

4. 发明申请

US20120018205A1 METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT, AND WIRING BOARD 有权
标题翻译：制造陶瓷电子元件，陶瓷电子元器件和接线板的方法
公开(公告)号：US20120018205A1
公开(公告)日：2012-01-26
申请号：US13184607
申请日：2011-07-18
申请人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
发明人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
IPC分类号： H05K1/18 , H01C7/02 , H01C7/13
CPC分类号： H05K1/183 , H01C1/14 , H01C7/008 , H01C7/02 , H01F27/2804 , H01F2027/2809 , H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/228 , H01L41/083 , H05K1/186 , H05K3/321 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10439 , H05K2201/10636 , Y02P70/611 , Y10T29/49085 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
摘要翻译：陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。在每个陶瓷生片的表面上形成第一导电糊层。层叠陶瓷生片以形成原料陶瓷层叠体。在原料陶瓷层叠体的表面上形成第二导电糊层。形成有第二导电膏层的原料陶瓷层叠体被烧制。

5. 发明申请

US20110290542A1 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US20110290542A1
公开(公告)日：2011-12-01
申请号：US13115243
申请日：2011-05-25
申请人： Yasuhiro NISHISAKA , Yukio SANADA , Koji SATO , Seiichi MATSUMOTO
发明人： Yasuhiro NISHISAKA , Yukio SANADA , Koji SATO , Seiichi MATSUMOTO
IPC分类号： H05K1/09 , B05D3/02 , B05D5/12
CPC分类号： H05K1/182 , H01C7/008 , H01F27/28 , H01F27/2804 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083 , H01L41/1876
摘要： A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.
摘要翻译：陶瓷电子部件包括陶瓷元件组件和外部电极。外部电极设置在陶瓷元件组件上。外部电极包括下面的电极层和第一个Cu镀膜。底层电极层设置在陶瓷元件组件上。第一Cu镀膜设置在下面的电极层上。底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

6. 发明授权

US08754335B2 Ceramic electronic component and wiring board 有权
标题翻译：陶瓷电子元件及接线板
公开(公告)号：US08754335B2
公开(公告)日：2014-06-17
申请号：US13178530
申请日：2011-07-08
申请人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01G4/232 , H01G4/236 , H01G4/30 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H05K2201/10015 , H05K2203/1469 , H01L2924/00
摘要： A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.
摘要翻译：陶瓷电子部件包括具有大致长方体形状的陶瓷元件体以及第一外部电极和第二外部电极。第一和第二外部电极设置在第一主表面上。第一外部电极和第二外部电极的部分在厚度方向上比其他部分突出。第一外部电极的突出部设置在第一外部电极的长度方向的一端，第二外部电极的第二突出部设置在第二外部电极的长度方向的另一端。因此，在突出部之间设置有凹部，露出第一和第二外部电极之间的第一主面的一部分。

7. 发明授权

US08465830B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08465830B2
公开(公告)日：2013-06-18
申请号：US13118629
申请日：2011-05-31
申请人： Koji Sato , Yukio Sanada , Kosuke Onishi , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Kosuke Onishi , Yasuhiro Nishisaka
IPC分类号： B32B3/00
CPC分类号： H01G4/30 , H01G4/005 , H01G4/01 , H01G4/12 , Y10T428/24752 , Y10T428/24926
摘要： A ceramic electronic component includes a ceramic body having a substantially rectangular parallelpiped shape. The ceramic body includes a central portion in which first and second internal electrodes are arranged, and first and second end portions in which the first and second internal electrodes are not arranged. The ceramic electronic component satisfies Expressions (1) and (2) below: W1>T (1) W2>T (2) where T denotes the dimension of the ceramic body in a thickness direction, W1 denotes the dimension of the first end portion in a width direction, and W2 denotes the dimension of the second end portion in the width direction.
摘要翻译：陶瓷电子部件包括具有大致矩形的平行形状的陶瓷体。陶瓷体包括其中布置有第一和第二内部电极的中心部分，以及未布置第一和第二内部电极的第一和第二端部。陶瓷电子元件满足以下表达式（1）和（2）：W1> T（1）W2> T（2）其中，T表示陶瓷体的厚度方向的尺寸，W1表示第一端部宽度方向，W2表示第二端部在宽度方向上的尺寸。

8. 发明申请

US20120018204A1 CERAMIC ELECTRONIC COMPONENT AND WIRING BOARD 有权
标题翻译：陶瓷电子元件和接线板
公开(公告)号：US20120018204A1
公开(公告)日：2012-01-26
申请号：US13178530
申请日：2011-07-08
申请人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
发明人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
IPC分类号： H05K1/16 , H01L41/00 , H01C7/13 , H01G4/12 , H01F5/00
CPC分类号： H05K1/185 , H01G4/232 , H01G4/236 , H01G4/30 , H01L23/49822 , H01L23/50 , H01L2924/0002 , H05K2201/10015 , H05K2203/1469 , H01L2924/00
摘要： A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.
摘要翻译：陶瓷电子部件包括具有大致长方体形状的陶瓷元件体以及第一外部电极和第二外部电极。第一和第二外部电极设置在第一主表面上。第一外部电极和第二外部电极的部分在厚度方向上比其他部分突出。第一外部电极的突出部设置在第一外部电极的长度方向的一端，第二外部电极的第二突出部设置在第二外部电极的长度方向的另一端。因此，在突出部之间设置有凹部，露出第一和第二外部电极之间的第一主面的一部分。

9. 发明授权

US08721820B2 Method for manufacturing multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子部件的制造方法
公开(公告)号：US08721820B2
公开(公告)日：2014-05-13
申请号：US13602354
申请日：2012-09-04
申请人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
IPC分类号： C03B29/00 , H01G4/20 , H01G4/06 , H01G4/228
CPC分类号： H01L41/273 , B32B18/00 , C04B35/465 , C04B35/4682 , C04B35/47 , C04B35/486 , C04B35/632 , C04B35/6342 , C04B2235/3208 , C04B2237/346 , C04B2237/704 , H01C7/008 , H01C7/18 , H01C17/006 , H01F17/0006 , H01F27/292 , H01G4/1209 , H01G4/30
摘要： A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.
摘要翻译：制造多层陶瓷电子部件的方法，当将导电性糊料涂敷在生坯陶瓷体上时，显着地降低并防止溶胀或变形。该方法中使用的陶瓷生片满足180.56＆amp; NlE; A / B其中A为陶瓷生片中所含的有机粘合剂的聚合度，B为陶瓷生片中含有的增塑剂的体积含量。

10. 发明申请

US20130056133A1 METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：制造多层陶瓷电子元件的方法
公开(公告)号：US20130056133A1
公开(公告)日：2013-03-07
申请号：US13602354
申请日：2012-09-04
申请人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
发明人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
IPC分类号： B32B37/14
CPC分类号： H01L41/273 , B32B18/00 , C04B35/465 , C04B35/4682 , C04B35/47 , C04B35/486 , C04B35/632 , C04B35/6342 , C04B2235/3208 , C04B2237/346 , C04B2237/704 , H01C7/008 , H01C7/18 , H01C17/006 , H01F17/0006 , H01F27/292 , H01G4/1209 , H01G4/30
摘要： A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.
摘要翻译：制造多层陶瓷电子部件的方法，当将导电性糊料涂敷在生坯陶瓷体上时，显着地降低并防止溶胀或变形。该方法中使用的陶瓷生片满足180.56＆amp; NlE; A / B其中A为陶瓷生片中所含的有机粘合剂的聚合度，B为陶瓷生片中含有的增塑剂的体积含量。

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