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1. 发明授权

US08804302B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08804302B2
公开(公告)日：2014-08-12
申请号：US13187617
申请日：2011-07-21
申请人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka , Masaki Hirota
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka , Masaki Hirota
IPC分类号： H01C7/13
CPC分类号： H01C7/008 , H01C7/13 , H01F17/0013 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/30 , H01L41/083
摘要： A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0≦t1≦(⅖)t0 is satisfied, where t0 is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.
摘要翻译：陶瓷电子部件包括陶瓷基体，第一和第二内部电极以及第一和第二外部电极。第一外部电极设置在纵向方向上的第一主表面的第一端部处。第二外部电极设置在第一主表面的纵向方向的第二端部处。第一外部电极和第二外部电极中的每一个的一部分在厚度方向上与第一和第二内部电极在厚度方向上彼此相对的区域相对。满足条件（1/10）t0＆nlE; t1＆nlE;（⅖）t0，其中t0是第一和第二外部电极中的每一个的厚度，t1是其中第一和第二外部电极中的每一个的部分的厚度嵌入第一主表面。

2. 发明申请

US20120293908A1 MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF 有权
标题翻译：单片陶瓷电子元件及其安装结构
公开(公告)号：US20120293908A1
公开(公告)日：2012-11-22
申请号：US13296262
申请日：2011-11-15
申请人： Seiji KOGA , Yukio SANADA
发明人： Seiji KOGA , Yukio SANADA
IPC分类号： H01G4/30
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30
摘要： A monolithic ceramic electronic component includes a first internal electrode including a first region extending to a first end surface and having a relatively large dimension in a width direction and a second region located at the side closer to a front end than is the first region and having a relatively small dimension in a width direction, wherein d1>c1+ng (n represents a constant based on the size of the monolithic ceramic electronic component) is satisfied, where the distance from a first end point which is closest in the first region to the first side surface and which is closest to the second end surface to the second end surface is d1, the distance between first and second wraparound portions is g, and the distance between a front end of the second wraparound portion and the second end surface is c1.
摘要翻译：单片陶瓷电子部件包括：第一内部电极，其包括延伸到第一端面的第一区域，并且在宽度方向上具有相对大的尺寸;以及第二区域，位于比第一区域更靠近前端的一侧，并且具有在宽度方向上的尺寸相对较小，其中d1> c1 + ng（n表示基于单片陶瓷电子部件的尺寸的常数），其中从第一区域中最接近的第一端点到第一区域的距离第一侧表面和最接近第二端表面的第二端面的距离为d1，第一和第二环绕部分之间的距离为g，第二环绕部分的前端与第二端面之间的距离为 c1。

3. 发明申请

US20100091429A1 MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF 有权
标题翻译：单片陶瓷电子元件及其安装结构
公开(公告)号：US20100091429A1
公开(公告)日：2010-04-15
申请号：US12642976
申请日：2009-12-21
申请人： Seiji KOGA , Yukio SANADA
发明人： Seiji KOGA , Yukio SANADA
IPC分类号： H01G4/12
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30
摘要： A monolithic ceramic electronic component includes a first internal electrode including a first region which extends to a first end surface and which has a relatively large dimension in a width direction and a second region which is located at the side closer to a front end than is the first region and which has a relatively small dimension in a width direction, wherein d1>c1+ng (n represents a constant determined in accordance with the size of the monolithic ceramic electronic component) is satisfied, where the distance from a first end point which is closest in the first region to the first side surface and which is closest to the second end surface to the second end surface is d1, the distance between first and second wraparound portions and is g, and the distance between a front end of the second wraparound portion and the second end surface is c1 while a first side surface defines a mounting surface.
摘要翻译：单片陶瓷电子部件包括：第一内部电极，其包括延伸到第一端面并且在宽度方向上具有相对较大尺寸的第一区域;以及位于靠近前端侧的第二区域，第一区域，并且在宽度方向上具有相对较小的尺寸，其中满足d1> c1 + ng（n表示根据单片陶瓷电子部件的尺寸确定的常数），其中，从第一端点到在所述第一区域中与所述第一侧表面最接近且最靠近所述第二端面的第二端面的距离为d1，所述第一和第二环绕部分之间的距离为g，并且所述第二区域的前端之间的距离为环绕部分和第二端面是c1，而第一侧表面限定安装表面。

4. 发明授权

US07005192B2 Ceramic electronic component and method of producing the same 有权
公开(公告)号：US07005192B2
公开(公告)日：2006-02-28
申请号：US10107099
申请日：2002-03-26
申请人： Yukio Sanada , Yoshinori Saito
发明人： Yukio Sanada , Yoshinori Saito
IPC分类号： B32B31/00 , B32B9/04 , C25D5/34 , C25D5/54
CPC分类号： H01G4/248 , C23C18/1865 , C23C18/1882 , Y10T29/435 , Y10T29/49155 , Y10T428/31663
摘要： A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains a ceramic member, and terminal electrodes formed on both of end-faces of the ceramic member. Each terminal electrode comprises an external electrode, and a plating coat formed thereon. To produce the ceramic electronic component, the ceramic member having the external electrodes are dipped into a water-repelling agent, dried, and plated. The water-repelling agent contains a functional group which is readily adsorbed to the external electrodes and a hydrophobic functional group.

5. 发明授权

US5536293A Base metal composition for external electrode of multilayer electronic component 失效
标题翻译：多层电子元件外部电极基体金属组成
公开(公告)号：US5536293A
公开(公告)日：1996-07-16
申请号：US318186
申请日：1994-10-05
申请人： Mika Yamamoto , Masaki Fujiyama , Yukio Sanada , Kunihiko Hamada
发明人： Mika Yamamoto , Masaki Fujiyama , Yukio Sanada , Kunihiko Hamada
IPC分类号： H01B1/02 , C03C8/18 , C22C32/00 , H01B1/16 , H01G4/232 , H01L23/498 , C22C9/04
CPC分类号： H01G4/2325 , C03C8/18 , C22C32/0089 , H01B1/16 , H01L23/49883 , H01L2924/0002 , H01L2924/09701
摘要： A base metal composition for forming an external electrode of a multilayer electronic component contains 70 to 85 percent by weight of Cu, 2 to 10 percent by weight of glass frit and 10 to 28 percent by weight of an organic vehicle. The glass frit contains at least one of lead zinc borosilicate and zinc borosilicate, Ba-Si based glass, and Zn which is in a range of less than 10 percent by weight in terms of ZnO.
摘要翻译：用于形成多层电子部件的外部电极的贱金属组合物含有70〜85重量％的Cu，2〜10重量％的玻璃料和10〜28重量％的有机载体。玻璃料包含硼硅酸铅锌和硼硅酸锌，Ba-Si基玻璃和Zn中的至少一种，其以ZnO计小于10重量％的范围。

6. 发明授权

US08721820B2 Method for manufacturing multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子部件的制造方法
公开(公告)号：US08721820B2
公开(公告)日：2014-05-13
申请号：US13602354
申请日：2012-09-04
申请人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
IPC分类号： C03B29/00 , H01G4/20 , H01G4/06 , H01G4/228
CPC分类号： H01L41/273 , B32B18/00 , C04B35/465 , C04B35/4682 , C04B35/47 , C04B35/486 , C04B35/632 , C04B35/6342 , C04B2235/3208 , C04B2237/346 , C04B2237/704 , H01C7/008 , H01C7/18 , H01C17/006 , H01F17/0006 , H01F27/292 , H01G4/1209 , H01G4/30
摘要： A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.
摘要翻译：制造多层陶瓷电子部件的方法，当将导电性糊料涂敷在生坯陶瓷体上时，显着地降低并防止溶胀或变形。该方法中使用的陶瓷生片满足180.56＆amp; NlE; A / B其中A为陶瓷生片中所含的有机粘合剂的聚合度，B为陶瓷生片中含有的增塑剂的体积含量。

7. 发明授权

US08405954B2 Monolithic ceramic electronic component and mounting structure thereof 有权
标题翻译：单片陶瓷电子部件及其安装结构
公开(公告)号：US08405954B2
公开(公告)日：2013-03-26
申请号：US13296262
申请日：2011-11-15
申请人： Seiji Koga , Yukio Sanada
发明人： Seiji Koga , Yukio Sanada
IPC分类号： H01G4/005 , H01G4/228 , H01G4/06
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30
摘要： A monolithic ceramic electronic component includes a first internal electrode including a first region extending to a first end surface and having a relatively large dimension in a width direction and a second region located at the side closer to a front end than is the first region and having a relatively small dimension in a width direction, wherein d1>c1+ng (n represents a constant based on the size of the monolithic ceramic electronic component) is satisfied, where the distance from a first end point which is closest in the first region to the first side surface and which is closest to the second end surface to the second end surface is d1, the distance between first and second wraparound portions is g, and the distance between a front end of the second wraparound portion and the second end surface is c1.
摘要翻译：单片陶瓷电子部件包括：第一内部电极，其包括延伸到第一端面的第一区域，并且在宽度方向上具有相对大的尺寸;以及第二区域，位于比第一区域更靠近前端的一侧，并且具有在宽度方向上的尺寸相对较小，其中d1> c1 + ng（n表示基于单片陶瓷电子部件的尺寸的常数），其中从第一区域中最接近的第一端点到第一区域的距离第一侧表面和最接近第二端表面的第二端面的距离为d1，第一和第二环绕部分之间的距离为g，第二环绕部分的前端与第二端面之间的距离为 c1。

8. 发明申请

US20130056133A1 METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
标题翻译：制造多层陶瓷电子元件的方法
公开(公告)号：US20130056133A1
公开(公告)日：2013-03-07
申请号：US13602354
申请日：2012-09-04
申请人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
发明人： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
IPC分类号： B32B37/14
CPC分类号： H01L41/273 , B32B18/00 , C04B35/465 , C04B35/4682 , C04B35/47 , C04B35/486 , C04B35/632 , C04B35/6342 , C04B2235/3208 , C04B2237/346 , C04B2237/704 , H01C7/008 , H01C7/18 , H01C17/006 , H01F17/0006 , H01F27/292 , H01G4/1209 , H01G4/30
摘要： A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.
摘要翻译：制造多层陶瓷电子部件的方法，当将导电性糊料涂敷在生坯陶瓷体上时，显着地降低并防止溶胀或变形。该方法中使用的陶瓷生片满足180.56＆amp; NlE; A / B其中A为陶瓷生片中所含的有机粘合剂的聚合度，B为陶瓷生片中含有的增塑剂的体积含量。

9. 发明授权

US08319594B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08319594B2
公开(公告)日：2012-11-27
申请号：US13354369
申请日：2012-01-20
申请人： Koji Sato , Yukio Sanada , Makoto Ogawa , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Makoto Ogawa , Yasuhiro Nishisaka
IPC分类号： H01F5/00
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1≦t/d≦0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.
摘要翻译：陶瓷电子部件包括陶瓷体，第一外部电极和第二外部电极。第一外部电极和第二外部电极被设置在陶瓷体的朝向安装面侧的主面上，以便在它们之间以预定的间隙区域彼此面对。外部电极各自包括基层和覆盖基层的Cu镀层。在第一外部电极和第二外部电极中的每一个中，满足表达式0.1＆nlE; t / d＆nlE; 0.5，其中t是在间隙区域侧的基底层的端部处的Cu镀层的厚度，d是从间隙区域侧的基底层的端部到间隙区域侧的Cu镀层的端部的距离。

10. 发明授权

US08130484B2 Monolithic ceramic electronic component and mounting structure thereof 有权
标题翻译：单片陶瓷电子部件及其安装结构
公开(公告)号：US08130484B2
公开(公告)日：2012-03-06
申请号：US12642976
申请日：2009-12-21
申请人： Seiji Koga , Yukio Sanada
发明人： Seiji Koga , Yukio Sanada
IPC分类号： H01G4/005 , H01G4/06
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30
摘要： A monolithic ceramic electronic component includes a first internal electrode including a first region which extends to a first end surface and which has a relatively large dimension in a width direction and a second region which is located at the side closer to a front end than is the first region and which has a relatively small dimension in a width direction, wherein d1>c1+ng (n represents a constant determined in accordance with the size of the monolithic ceramic electronic component) is satisfied, where the distance from a first end point which is closest in the first region to the first side surface and which is closest to the second end surface to the second end surface is d1, the distance between first and second wraparound portions and is g, and the distance between a front end of the second wraparound portion and the second end surface is c1 while a first side surface defines a mounting surface.
摘要翻译：单片陶瓷电子部件包括：第一内部电极，其包括延伸到第一端面并且在宽度方向上具有相对较大尺寸的第一区域;以及位于靠近前端侧的第二区域，第一区域，并且在宽度方向上具有相对较小的尺寸，其中满足d1> c1 + ng（n表示根据单片陶瓷电子部件的尺寸确定的常数），其中，从第一端点到在所述第一区域中与所述第一侧表面最接近且最靠近所述第二端面的第二端面的距离为d1，所述第一和第二环绕部分之间的距离为g，并且所述第二区域的前端之间的距离为环绕部分和第二端面是c1，而第一侧表面限定安装表面。

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