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    • 9. 发明授权
    • Loadport bridge for semiconductor fabrication tools
    • 用于半导体制造工具的承载桥
    • US08944739B2
    • 2015-02-03
    • US13486024
    • 2012-06-01
    • Shih-Hung ChenYing XiaoChin-Hsiang Lin
    • Shih-Hung ChenYing XiaoChin-Hsiang Lin
    • H01L21/677
    • H01L21/6773H01L21/67733H01L21/67775
    • A wafer handling system with apparatus for transporting wafers between semiconductor fabrication tools. In one embodiment, the apparatus is a loadport bridge mechanism including an enclosure having first and second mounting ends, a docking port at each end configured and dimensioned to interface with a loadport of a semiconductor tool, and at least one wafer transport robot operable to transport a wafer between the docking ports. The wafer transport robot hands off or receives a wafer to/from a tool robot at the loadports of a first and second tool. The bridge mechanism allows one or more wafers to be transferred between loadports of different tools on an individual basis without reliance on the FAB's automated material handling system (AMHS) for bulk wafer transport inside a wafer carrier such as a FOUP or others.
    • 一种具有用于在半导体制造工具之间传输晶片的装置的晶片处理系统。 在一个实施例中,该装置是装载端口机构,其包括具有第一和第二安装端的外壳,每个端部处的对接端口被构造和尺寸设计成与半导体工具的承载端口相接合,以及至少一个可运输的晶片传送机械手 在对接端口之间的晶片。 晶片传送机器人在第一和第二工具的载荷端口移动或接收来自工具机器人的晶片。 桥接机构允许一个或多个晶片在不同工具的载荷端口之间单独传输,而不依赖于FAB的自动化材料处理系统(AMHS),用于在诸如FOUP或其它晶片载体之间的体晶片传输。