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1. 发明授权

US08035234B2 Wiring substrate, manufacturing method thereof, and semiconductor device 有权
标题翻译：配线基板及其制造方法以及半导体装置
公开(公告)号：US08035234B2
公开(公告)日：2011-10-11
申请号：US11064495
申请日：2005-02-23
申请人： Yoshiaki Komuro
发明人： Yoshiaki Komuro
IPC分类号： H01L23/52
CPC分类号： H01L23/49827 , H01L2223/6622 , H01L2224/05569 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/15311 , Y10T29/49155 , Y10T29/49165
摘要： There is provided a wiring substrate for connecting a mounting board on one surface thereof and mounting an integrated circuit chip on the opposite surface to the surface. The wiring substrate has a conductive connecting portion penetrating the substrate for connecting to at least a portion of a wiring layer of the integrated circuit chip, with the portion of a wiring layer formed on the substrate, and an insulating portion formed at a lateral side of the connecting portion for surrounding the connecting portion via a portion of the wiring substrate.
摘要翻译：提供了用于在其一个表面上连接安装板并且在与表面相对的表面上安装集成电路芯片的布线基板。布线基板具有穿透基板的导电连接部，用于与集成电路芯片的布线层的至少一部分连接，配线层的部分形成在基板上，绝缘部形成在所述连接部分经由所述布线基板的一部分围绕所述连接部分。

2. 发明授权

US5681212A Polishing device and correcting method therefor 失效
标题翻译：抛光装置及其修正方法
公开(公告)号：US5681212A
公开(公告)日：1997-10-28
申请号：US628325
申请日：1996-04-05
申请人： Hideaki Hayakawa , Takatoshi Saito , Yoshiaki Komuro , Shuzo Sato
发明人： Hideaki Hayakawa , Takatoshi Saito , Yoshiaki Komuro , Shuzo Sato
IPC分类号： B24B37/005 , B24B37/30 , B24B37/34 , B24B41/06 , B24B49/16 , B24B49/18 , B24B53/00 , B24B53/007 , B24B53/017 , H01L21/304 , B24B7/22
CPC分类号： B24B37/345 , B24B37/30 , B24B41/061 , B24B49/16 , B24B49/18 , B24B53/00 , B24B53/017
摘要： Disclosed herein is a polishing including a polishing plate having an upper surface on which a polishing pad is attached, a polishing head having a lower surface opposed to an upper surface of the polishing pad on the polishing plate, for holding a substrate to be polished on the lower surface, and a pressure source for applying a polishing pressure to the polishing head, whereby the substrate held by the polishing head is pressed against the upper surface of the polishing pad under the polishing pressure applied from the pressure source to perform polishing of the substrate. The polishing head is provided with a contact pressure adjusting mechanism capable of adjusting an in-plane contact pressure of the substrate against the upper surface of the polishing pad on the polishing plate at every area of the substrate. Accordingly, the uniformity and the planarity in the plane of the substrate surface to be polished can be improved with a high throughput.
摘要翻译：本发明公开了一种抛光装置，该抛光装置具有：抛光板，其具有安装有抛光垫的上表面;抛光头，其具有与抛光板上的抛光垫的上表面相对的下表面，用于将待抛光的基板保持在下表面和用于向研磨头施加抛光压力的压力源，由此由抛光头保持的基板在从压力源施加的抛光压力下被压靠在抛光垫的上表面上，以对抛光头进行抛光基质。抛光头设置有接触压力调节机构，该接触压力调节机构能够在衬底的每个区域处调整衬底的面内接触压力与抛光板上的抛光垫的上表面。因此，能够以高产量提高待研磨的基板表面的平面的均匀性和平坦度。

3. 发明授权

US08634017B2 Focus detection apparatus, image pickup device, and electronic camera 失效
标题翻译：焦点检测装置，图像拾取装置和电子照相机
公开(公告)号：US08634017B2
公开(公告)日：2014-01-21
申请号：US12773269
申请日：2010-05-04
申请人： Yoshiaki Komuro
发明人： Yoshiaki Komuro
IPC分类号： H04N5/232
CPC分类号： H04N5/23212
摘要： A focus detection apparatus includes first-type and second-type pixels and an image-formation-state detector. Each first-type pixel includes a photoelectric converter that receives light from an image-pickup optical system and first and second optical members arranged on an optical path from the optical system to the photoelectric converter and having different refractive indices, and outputs a first charge signal corresponding to an amount of light received by the photoelectric converter. Each second-type pixel includes the photoelectric converter and the first and second optical members arranged such that a positional relationship relative to the photoelectric converter differs from that in each first-type pixel, and outputs a second charge signal corresponding to an amount of light received by the photoelectric converter. The detector detects an image formation state of the image-pickup optical system on the basis of the first and second charge signals.
摘要翻译：焦点检测装置包括第一类型和第二类型像素和图像形成状态检测器。每个第一类像素包括光电转换器，其接收来自摄像光学系统的光和布置在从光学系统到光电转换器的光路上并具有不同折射率的第一和第二光学构件，并且输出第一充电信号对应于由光电转换器接收的光量。每个第二类型像素包括光电转换器，并且第一和第二光学构件被布置成使得相对于光电转换器的位置关系与每个第一类型像素中的位置关系不同，并且输出与所接收的光量对应的第二充电信号由光电转换器。检测器基于第一和第二充电信号来检测摄像光学系统的图像形成状态。

4. 发明申请

US20100302432A1 FOCUS DETECTION APPARATUS, IMAGE PICKUP DEVICE, AND ELECTRONIC CAMERA 失效
标题翻译：焦点检测装置，图像拾取装置和电子摄像机
公开(公告)号：US20100302432A1
公开(公告)日：2010-12-02
申请号：US12773269
申请日：2010-05-04
申请人： Yoshiaki Komuro
发明人： Yoshiaki Komuro
IPC分类号： H04N5/232 , H04N5/225
CPC分类号： H04N5/23212
摘要： A focus detection apparatus includes first-type and second-type pixels and an image-formation-state detector. Each first-type pixel includes a photoelectric converter that receives light from an image-pickup optical system and first and second optical members arranged on an optical path from the optical system to the photoelectric converter and having different refractive indices, and outputs a first charge signal corresponding to an amount of light received by the photoelectric converter. Each second-type pixel includes the photoelectric converter and the first and second optical members arranged such that a positional relationship relative to the photoelectric converter differs from that in each first-type pixel, and outputs a second charge signal corresponding to an amount of light received by the photoelectric converter. The detector detects an image formation state of the image-pickup optical system on the basis of the first and second charge signals.
摘要翻译：焦点检测装置包括第一类型和第二类型像素和图像形成状态检测器。每个第一类像素包括光电转换器，其接收来自摄像光学系统的光和布置在从光学系统到光电转换器的光路上并具有不同折射率的第一和第二光学构件，并且输出第一充电信号对应于由光电转换器接收的光量。每个第二类型像素包括光电转换器，并且第一和第二光学构件被布置成使得相对于光电转换器的位置关系与每个第一类型像素中的位置关系不同，并且输出与所接收的光量对应的第二充电信号由光电转换器。检测器基于第一和第二充电信号来检测摄像光学系统的图像形成状态。

5. 发明授权

US4421152A Apparatus for precision casting 失效
标题翻译：精密铸造设备
公开(公告)号：US4421152A
公开(公告)日：1983-12-20
申请号：US239470
申请日：1981-03-02
申请人： Tsutomu Shinkawa , Akihide Yoshino , Hitoshi Konishi , Yoshiaki Komuro , Satoshi Hamada , Saburo Okumura
发明人： Tsutomu Shinkawa , Akihide Yoshino , Hitoshi Konishi , Yoshiaki Komuro , Satoshi Hamada , Saburo Okumura
IPC分类号： B22D18/04 , A61C13/20 , B22D18/06 , B22D23/00 , B22D25/02 , B22D27/15 , B22D21/02 , B22D27/13
CPC分类号： B22D25/02 , B22D27/15
摘要： A precision casting device especially suitable for dental use, which includes melting and casting chambers supported by a frame such that they are arranged coaxially up and down in the frame under a normal operating state and can be drawn horizontally out of the frame during service time in order to facilitate access to the interiors of them, and which is provided with evacuating apparatus and an inert gas supply and can carry out the casting process in which a casting material is molten in an inert atmosphere, the molten material is then supplied to a mold in a vacuum state and, therafter, casting is effected under a pressure of inert atmosphere.
摘要翻译：一种特别适用于牙科用途的精密铸造装置，其包括由框架支撑的熔化和铸造室，使得它们在正常操作状态下在框架中同轴地同轴地布置，并且可以在使用时间内从框架中水平拉出为了便于进入它们的内部，并且设置有排气装置和惰性气体供应，并且可以执行铸造过程，其中铸造材料在惰性气氛中熔融，然后将熔融材料供给到模具在真空状态下，在惰性气氛的压力下进行铸造。

6. 发明申请

US20100148313A1 SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20100148313A1
公开(公告)日：2010-06-17
申请号：US12628703
申请日：2009-12-01
申请人： Yoshiaki KOMURO
发明人： Yoshiaki KOMURO
IPC分类号： H01L23/544 , H01L21/78
CPC分类号： G03F7/70475 , H01L27/14683
摘要： Disclosed herein is a semiconductor apparatus, wherein a technique for manufacturing one semiconductor region by dividing the one semiconductor region into a plurality of divisional regions in regard of a step is applied, and one-side device portions formed simultaneously by a one-side treatment conducted primarily for the divisional region on one side and other-side device portions formed simultaneously by an other-side treatment conducted primarily for the divisional region on the other side are mixedly present in a joint region joining a boundary between the divisional regions.
摘要翻译：本发明公开了一种半导体装置，其中通过将一个半导体区域分成多个分割区域来制造一个半导体区域的技术，通过单面处理同时形成的单面器件部分主要用于一侧的分割区域，并且通过主要对另一侧的分割区域进行的另一侧处理同时形成的另一侧装置部分混合存在于连接分割区域之间的边界的接合区域中。

7. 发明授权

US06841820B2 Information storage apparatus and manufacturing method therefor 失效
标题翻译：信息存储装置及其制造方法
公开(公告)号：US06841820B2
公开(公告)日：2005-01-11
申请号：US10451318
申请日：2002-10-17
申请人： Yoshiaki Komuro , Makoto Moioyoshi
发明人： Yoshiaki Komuro , Makoto Moioyoshi
IPC分类号： G11C11/14 , G11C11/15 , G11C11/16 , H01L21/8246 , H01L27/105 , H01L27/22 , H01L43/08 , H01L29/76
CPC分类号： H01L27/222 , B82Y10/00 , G11C11/16
摘要： The invention achieves the fine processing of an information writing device, which includes a multilayered element obtained by stacking ferromagnetic/semiconductor/ferromagnetic layers, without increasing the resistivity and power consumption of the device and lowering the reliability thereof. The invention provides an information storage apparatus (1) having write word lines (11), bit lines (21) formed in such a way as to intersect with the write word lines (11) at predetermined intervals, and information storage devices (31) each comprising a multilayered film including a magnetic layer provided in an intersection region, in which each of the write word lines (11) intersects with an associated one of the bit lines (21), between the write word lines (11) and the bit lines (21). The information storage devices (31) each have a concave portion (54), which is provided in a second insulating film (53) formed between the write word line (11) and the bit line (21) in the intersection region between the word line (11) and the bit line (21), and a multilayered film including at least a magnetic layer formed in the concave portion (54).
摘要翻译：本发明实现了一种信息写入装置的精细处理，其包括通过堆叠铁磁/半导体/铁磁层获得的多层元件，而不增加装置的电阻率和功率消耗并降低其可靠性。本发明提供了一种具有写入字线（11）的信息存储装置（1），以预定间隔与写入字线（11）相交形成的位线（21）和信息存储装置（31），每个包括设置在交叉区域中的磁性层的多层膜，其中每个写入字线（11）与相关联的一条位线（21）在写入字线（11）和位之间相交线（21）。信息存储装置（31）各自具有凹部（54），该凹部设置在形成在写字线（11）和位线（21）之间的第二绝缘膜（53）中，该第二绝缘膜线（11）和位线（21），以及至少包括形成在凹部（54）中的磁性层的多层膜。

8. 发明授权

US06425810B2 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06425810B2
公开(公告)日：2002-07-30
申请号：US09188354
申请日：1998-11-10
申请人： Yoshiaki Komuro
发明人： Yoshiaki Komuro
IPC分类号： B24B2900
CPC分类号： B24B37/30 , B25B11/005
摘要： A polishing apparatus for polishing a subject surface of a thin-plate-like object that is held by a rotary polishing head with a polishing pad that is mounted on the surface of a rotary polishing surface table. The polishing head has sucking structures such as suction grooves and a through-hole. An elastic holding film that is formed with a plurality of through-holes are attached to the object holding surface of the polishing head. The object is polished in a state that it is sucked and held by the polishing head via the holding film by vacuum suction force.
摘要翻译：一种用于抛光由旋转抛光头保持的薄板状物体的被摄体表面的抛光装置，其具有安装在旋转抛光表台的表面上的抛光垫。抛光头具有诸如抽吸槽和通孔的吸引结构。形成有多个通孔的弹性保持膜附着到抛光头的物体保持表面。在通过真空抽吸力通过保持膜被研磨头吸引并保持的状态下抛光物体。

9. 发明授权

US6077155A Polishing device and correcting method therefor 失效
标题翻译：抛光装置及其修正方法
公开(公告)号：US6077155A
公开(公告)日：2000-06-20
申请号：US909053
申请日：1997-08-11
申请人： Hideaki Hayakawa , Takatoshi Saito , Yoshiaki Komuro , Shuzo Sato
发明人： Hideaki Hayakawa , Takatoshi Saito , Yoshiaki Komuro , Shuzo Sato
IPC分类号： B24B37/005 , B24B37/30 , B24B37/34 , B24B41/06 , B24B49/16 , B24B49/18 , B24B53/00 , B24B53/007 , B24B53/017 , H01L21/304
CPC分类号： B24B37/345 , B24B37/30 , B24B41/061 , B24B49/16 , B24B49/18 , B24B53/00 , B24B53/017
摘要： Disclosed herein is a polishing device including a polishing plate having an upper surface on which a polishing pad is attached, a polishing head having a lower surface opposed to an upper surface of the polishing pad on the polishing plate, for holding a substrate to be polished on the lower surface, and a pressure source for applying a polishing pressure to the polishing head, whereby the substrate held by the polishing head is pressed against the upper surface of the polishing pad under the polishing pressure applied from the pressure source to perform polishing of the substrate. The polishing head is provided with a contact pressure adjusting mechanism capable of adjusting an in-plane contact pressure of the substrate against the upper surface of the polishing pad on the polishing plate at every area of the substrate. Accordingly, the uniformity and the planarity in the plane of the substrate surface to be polished can be improved with a high throughput.
摘要翻译：本发明公开了一种抛光装置，包括：抛光板，其上表面上安装有抛光垫;抛光头，其具有与抛光板上的抛光垫的上表面相对的下表面，用于保持待抛光的基板以及用于对抛光头施加抛光压力的压力源，由此由抛光头保持的基板在从压力源施加的研磨压力下被压靠在抛光垫的上表面上，以进行抛光底物。抛光头设置有接触压力调节机构，该接触压力调节机构能够在衬底的每个区域处调整衬底的面内接触压力与抛光板上的抛光垫的上表面。因此，能够以高产量提高待研磨的基板表面的平面的均匀性和平坦度。

10. 发明申请

US20080127489A1 WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE 有权
标题翻译：接线基板，其制造方法和半导体器件
公开(公告)号：US20080127489A1
公开(公告)日：2008-06-05
申请号：US11969273
申请日：2008-01-04
申请人： Yoshiaki Komuro
发明人： Yoshiaki Komuro
IPC分类号： H05K3/42
CPC分类号： H01L23/49827 , H01L2223/6622 , H01L2224/05569 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/15311 , Y10T29/49155 , Y10T29/49165
摘要： There is provided a wiring substrate for connecting a mounting board on one surface thereof and mounting an integrated circuit chip on the opposite surface to the surface. The wiring substrate has a conductive connecting portion penetrating the substrate for connecting to at least a portion of a wiring layer of the integrated circuit chip, with the portion of a wiring layer formed on the substrate, and an insulating portion formed at a lateral side of the connecting portion for surrounding the connecting portion via a portion of the wiring substrate.
摘要翻译：提供了用于在其一个表面上连接安装板并且在与表面相对的表面上安装集成电路芯片的布线基板。布线基板具有穿透基板的导电连接部，用于与集成电路芯片的布线层的至少一部分连接，配线层的部分形成在基板上，绝缘部形成在所述连接部分经由所述布线基板的一部分围绕所述连接部分。

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