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    • 8. 发明申请
    • Phase change memory device and method of fabricating the same
    • 相变存储器件及其制造方法
    • US20070210334A1
    • 2007-09-13
    • US11698155
    • 2007-01-26
    • Young-Soo LimYong-Sun KoHyuk-Jin KwonJae-Seung Hwang
    • Young-Soo LimYong-Sun KoHyuk-Jin KwonJae-Seung Hwang
    • H01L31/00
    • H01L45/143H01L27/2436H01L45/06H01L45/126H01L45/144H01L45/1675
    • Example embodiments relate to a semiconductor memory device and a method of fabricating the same. Other example embodiments relate to a phase change memory device and a method of fabricating the same. There are provided a phase change memory device and a method of fabricating the same for improving or maximizing a production yield. The method comprises: after first removing a first hard mask layer used to form a contact pad electrically connected to a semiconductor substrate, forming a lower electrode to be electrically connected to the contact pad through a first contact hole in a first interlayer insulating layer formed on the contact pad and to have a thickness equal or similar to a thickness of the first interlayer insulating layer; and forming a phase change layer and an upper electrode on the lower electrode. Because change of the resistance value of the lower electrode is reduced or prevented, which has been caused due to a non-uniform thickness of a conventional first hard mask layer, a production yield may be improved.
    • 示例性实施例涉及半导体存储器件及其制造方法。 其他示例性实施例涉及相变存储器件及其制造方法。 提供了一种相变存储器件及其制造方法,用于改善或最大化产量。 该方法包括:在首先去除用于形成与半导体衬底电连接的接触焊盘的第一硬掩模层之后,通过形成在第一层间绝缘层上的第一层间绝缘层中的第一接触孔形成下电极以与接触焊盘电连接 所述接触焊盘的厚度等于或类似于所述第一层间绝缘层的厚度; 并在下电极上形成相变层和上电极。 由于由于常规的第一硬掩模层的厚度不均匀而导致的下部电极的电阻值的变化被降低或防止,所以可以提高生产率。