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1. 发明授权

US10476465B2 Parallel RC circuit equalizers 有权
公开(公告)号：US10476465B2
公开(公告)日：2019-11-12
申请号：US15864176
申请日：2018-01-08
申请人： AVX Corporation
发明人： Gheorghe Korony
IPC分类号： H03H1/02 , H03H7/06 , H04B3/04
摘要： Disclosed are apparatus and methodology for increasing the resonance frequency and useful frequency range of surface mount RC equalizer devices. The presently disclosed subject matter provides improved operational characteristics of generally known such RC equalizer devices by implementing a reverse geometry that relocates the internal termination points, as well as external termination points for such devices, along lateral portions of the assembled device. Such reverse geometry achieves improvements by providing a reduction of the equivalent series inductance (ESL) to provide the increased resonance frequency and useful frequency range.

2. 发明授权

US09722568B2 Thin film surface mount components 有权
公开(公告)号：US09722568B2
公开(公告)日：2017-08-01
申请号：US15202793
申请日：2016-07-06
申请人： AVX Corporation
发明人： Gheorghe Korony , Andrew P. Ritter
IPC分类号： B32B37/00 , H03H7/01 , H01C1/148 , H01C7/00 , H01F5/00 , H01G4/224 , H01G4/248 , H01G4/33 , H01F27/28 , H05K1/11 , H05K1/18 , H05K3/46 , H03H1/00
CPC分类号： H03H7/17 , H01C1/148 , H01C7/006 , H01F5/003 , H01F27/2804 , H01F2027/2809 , H01G4/224 , H01G4/248 , H01G4/33 , H01L2924/0002 , H03H7/0115 , H03H2001/0085 , H05K1/111 , H05K1/186 , H05K3/4611 , H05K3/467 , H05K3/4697 , Y10T29/49124 , H01L2924/00
摘要： Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

3. 发明申请

US20140208555A1 PRECISION LASER ADJUSTABLE THIN FILM CAPACITORS 审中-公开
标题翻译：精密激光可调薄膜电容器
公开(公告)号：US20140208555A1
公开(公告)日：2014-07-31
申请号：US14230312
申请日：2014-03-31
申请人： AVX CORPORATION
发明人： Kevin D. Christian , Gheorghe Korony
IPC分类号： H01G4/33
CPC分类号： H01G4/38 , H01G4/33 , H01L27/016 , Y10T29/43 , Y10T29/435
摘要： Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.
摘要翻译：公开了用于提供精密激光可调（例如，可调整的）薄膜电容器阵列的装置和方法。在公共基板上形成多个单独的电容器，并且通过可熔链路并联连接。单独的电容器被提供为陶瓷电容值电容器，以便提供对应梯子的较低级的多个低值电容器，以及用于梯子的连续步骤的包括单个电容器的较小数量的电容器。精密电容值可以通过熔接或烧蚀所选择的熔丝链接来实现，以便从并行连接中移除选定的子部件。可以在将电容器阵列放置在托管印刷电路板上之后进行选择的可熔链节的原位实时修整。

4. 发明申请

US20130127588A1 HIGH FREQUENCY RESISTOR 有权
标题翻译：高频电阻
公开(公告)号：US20130127588A1
公开(公告)日：2013-05-23
申请号：US13644355
申请日：2012-10-04
申请人： AVX Corporation
发明人： Gheorghe Korony , Kevin D. Christian
IPC分类号： H01C7/00 , H01C17/00
CPC分类号： H01C1/01 , H01C1/06 , H01C1/142 , H01C7/003 , H01C17/06513
摘要： An ultra wideband frequency compensated resistor and related methodologies for frequency compensation are disclosed. In exemplary configuration, a resistive layer is provided over a substrate, and a frequency compensating structure is provided over at least a portion of the resistive layer and separated therefrom by an insulative layer. In certain embodiments, the insulating layer may be an adhesive that may also be effective to secure a protective cover over the resistive material and supporting substrate. In selected embodiments, the frequency compensating structure corresponds to a plurality of conductive layers, one or more of which may be directly electrically connected to terminations for the resistive material while one or more of the conductive layers are not so connected.
摘要翻译：公开了一种用于频率补偿的超宽带频率补偿电阻器和相关方法。在示例性配置中，在衬底上提供电阻层，并且在电阻层的至少一部分上提供频率补偿结构，并通过绝缘层与其隔开。在某些实施例中，绝缘层可以是也可以有效地将保护盖固定在电阻材料和支撑衬底上的粘合剂。在选择的实施例中，频率补偿结构对应于多个导电层，其中的一个或多个可以直接电连接到电阻材料的端子，同时一个或多个导电层不连接。

5. 发明申请

US20210360837A1 Filter with Cover Layer and Shield Layer 有权
公开(公告)号：US20210360837A1
公开(公告)日：2021-11-18
申请号：US17307015
申请日：2021-05-04
申请人： AVX Corporation
发明人： Cory Nelson , Gheorghe Korony
IPC分类号： H05K9/00
摘要： A filter can include a monolithic substrate and at least one conductive layer formed over a top surface of the monolithic substrate and along at least a portion of one or more of a first top edge of the monolithic substrate or a second top edge of the monolithic substrate. A cover layer can be arranged over the top surface of the monolithic substrate. A shield layer can connect with one or more of the conductive layer(s) at the first top edge or the second top edge of the monolithic substrate. The shield layer can include a first portion formed over the first side surface of the cover layer, a second portion formed over the top surface of the cover layer, and a third portion formed over the second side surface of the cover layer.

6. 发明申请

US20160343508A1 METHOD FOR LASER ADJUSTABLE THIN FILM CAPACITORS 审中-公开
标题翻译：激光可调薄膜电容器的方法
公开(公告)号：US20160343508A1
公开(公告)日：2016-11-24
申请号：US15202862
申请日：2016-07-06
申请人： AVX Corporation
发明人： Kevin D. Christian , Gheorghe Korony
IPC分类号： H01G4/38 , H01G4/33
CPC分类号： H01G4/38 , H01G4/33 , H01L27/016 , Y10T29/43 , Y10T29/435
摘要： Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.
摘要翻译：公开了用于提供精密激光可调（例如，可调整的）薄膜电容器阵列的装置和方法。在公共基板上形成多个单独的电容器，并且通过可熔链路并联连接。单独的电容器被提供为陶瓷电容值电容器，以便提供对应梯子的较低级的多个低值电容器，以及用于梯子的连续步骤的包括单个电容器的较小数量的电容器。精密电容值可以通过熔接或烧蚀所选择的熔丝链接来实现，以便从并行连接中移除选定的子部件。可以在将电容器阵列放置在托管印刷电路板上之后进行选择的可熔链节的原位实时修整。

7. 发明授权

US09755609B2 Thin film surface mount components 有权
公开(公告)号：US09755609B2
公开(公告)日：2017-09-05
申请号：US15202814
申请日：2016-07-06
申请人： AVX Corporation
发明人： Gheorghe Korony , Andrew P. Ritter
IPC分类号： H05K7/12 , H03H7/01 , H01C1/148 , H01C7/00 , H01F5/00 , H01G4/224 , H01G4/248 , H01G4/33 , H01F27/28 , H05K1/11 , H05K1/18 , H05K3/46 , H03H1/00
CPC分类号： H03H7/17 , H01C1/148 , H01C7/006 , H01F5/003 , H01F27/2804 , H01F2027/2809 , H01G4/224 , H01G4/248 , H01G4/33 , H01L2924/0002 , H03H7/0115 , H03H2001/0085 , H05K1/111 , H05K1/186 , H05K3/4611 , H05K3/467 , H05K3/4697 , Y10T29/49124 , H01L2924/00
摘要： Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

8. 发明申请

US20160345444A1 THIN FILM SURFACE MOUNT COMPONENTS 审中-公开
公开(公告)号：US20160345444A1
公开(公告)日：2016-11-24
申请号：US15202793
申请日：2016-07-06
申请人： AVX Corporation
发明人： Gheorghe Korony , Andrew P. Ritter
IPC分类号： H05K3/46 , H01G4/33 , H05K1/18 , H01F27/28 , H03H7/01 , H01C1/148 , H01C7/00 , H01G4/248 , H05K1/11
CPC分类号： H03H7/17 , H01C1/148 , H01C7/006 , H01F5/003 , H01F27/2804 , H01F2027/2809 , H01G4/224 , H01G4/248 , H01G4/33 , H01L2924/0002 , H03H7/0115 , H03H2001/0085 , H05K1/111 , H05K1/186 , H05K3/4611 , H05K3/467 , H05K3/4697 , Y10T29/49124 , H01L2924/00
摘要： Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

9. 发明授权

US09437366B2 Method for laser adjustable thin film capacitors 有权
标题翻译：激光可调薄膜电容器的方法
公开(公告)号：US09437366B2
公开(公告)日：2016-09-06
申请号：US14230312
申请日：2014-03-31
申请人： AVX Corporation
发明人： Kevin D. Christian , Gheorghe Korony
IPC分类号： H01G7/00 , H01G4/33 , H01G4/38 , H01L27/01
CPC分类号： H01G4/38 , H01G4/33 , H01L27/016 , Y10T29/43 , Y10T29/435
摘要： Disclosed are methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.
摘要翻译：公开了提供精密激光可调（例如，可调整）薄膜电容器阵列的方法。在公共基板上形成多个单独的电容器，并且通过可熔链路并联连接。单独的电容器被提供为陶瓷电容值电容器，以便提供对应梯子的较低级的多个低值电容器，以及用于梯子的连续步骤的包括单个电容器的较小数量的电容器。精密电容值可以通过熔接或烧蚀所选择的熔丝链接来实现，以便从并行连接中移除选定的子部件。可以在将电容器阵列放置在托管印刷电路板上之后进行选择的可熔链节的原位实时修整。

10. 发明授权

US10176925B2 Precision laser adjustable thin film capacitors 有权
公开(公告)号：US10176925B2
公开(公告)日：2019-01-08
申请号：US15202862
申请日：2016-07-06
申请人： AVX Corporation
发明人： Kevin D. Christian , Gheorghe Korony
IPC分类号： H01G4/38 , H01G4/33 , H01L27/01 , H01G4/005 , H01G4/06
摘要： Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

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