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1. 发明申请

US20140300880A1 Flow Through MEMS Package 有权
标题翻译：流过MEMS封装
公开(公告)号：US20140300880A1
公开(公告)日：2014-10-09
申请号：US14308627
申请日：2014-06-18
申请人： Kenichi Sano , Lars Eng , Alexander Payne , James Hunter
发明人： Kenichi Sano , Lars Eng , Alexander Payne , James Hunter
IPC分类号： G03F7/20
CPC分类号： G03F7/2051 , B81B7/0041 , B81B7/0061 , G02B26/0808 , G02B26/0841 , G03F7/70291 , G03F7/70866 , G03F7/70916 , G03F7/70933
摘要： A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS, wherein the package includes features that promote laminar flow of the fluid across the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.
摘要翻译：提供了通过微机电系统（MEMS）封装的流程以及操作使用其的MEMS封装的方法。通常，封装包括MEMS封装的空腔，在MEMS操作期间将流体引入空腔的入口和在MEMS操作期间流体被移除的出口，其中该封装包括特征促进流体跨越MEMS的层流。包装和方法在包装空间光调制器包括反射表面并且适于反射和调制入射在其上的光束时特别有用。还提供了其他实施例。

2. 发明授权

US08767170B2 Flow through MEMS package 有权
标题翻译：流过MEMS封装
公开(公告)号：US08767170B2
公开(公告)日：2014-07-01
申请号：US13153127
申请日：2011-06-03
申请人： Kenichi Sano , Lars Eng , Alexander Payne , James Hunter
发明人： Kenichi Sano , Lars Eng , Alexander Payne , James Hunter
IPC分类号： G03F7/20 , G03B27/52 , G02B26/08 , B81B7/00
CPC分类号： G03F7/2051 , B81B7/0041 , B81B7/0061 , G02B26/0808 , G02B26/0841 , G03F7/70291 , G03F7/70866 , G03F7/70916 , G03F7/70933
摘要： A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS. In certain embodiments, the fluid includes an gas, such as nitrogen, and the inlet and outlet are adapted to provide a flow of gas of from 0.01 Standard Cubic Centimeters per Minute (sccm) to 10000 sccm during operation of the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.
摘要翻译：提供了通过微机电系统（MEMS）封装的流程以及操作使用其的MEMS封装的方法。通常，封装包括MEMS封装的空腔，在MEMS运行期间将流体引入空腔的入口以及在MEMS运行期间流体被除去的出口。在某些实施例中，流体包括气体，例如氮气，并且入口和出口适于在MEMS运行期间提供从0.01标准立方厘米每分钟（sccm）至10000sccm的气体流。包装和方法在包装空间光调制器包括反射表面并且适于反射和调制入射在其上的光束时特别有用。还提供了其他实施例。

3. 发明授权

US08842359B1 Spatial light modulator with multiple linear arrays 有权
标题翻译：具有多个线性阵列的空间光调制器
公开(公告)号：US08842359B1
公开(公告)日：2014-09-23
申请号：US13429091
申请日：2012-03-23
申请人： Alexander Payne , James Hunter
发明人： Alexander Payne , James Hunter
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , G02B26/0808
摘要： A system including spatial light modulators with multiple one-dimensional (1D) diffractor arrays and methods of operating the same are provided. In one embodiment, the system comprises a spatial light modulator (SLM) assembly including a plurality of one-dimensional (1D) diffractor arrays to modulate light from a light source, the plurality of 1D diffractor arrays integrally formed on a die; illumination optics disposed in a light path between the plurality of 1D diffractor arrays and the light source to illuminate a substantially linear portion of at least one of the plurality of 1D diffractor arrays; and imaging optics disposed in a light path between the SLM assembly and an image plane on a target-substrate, the imaging optics adapted to transmit modulated light from the SLM assembly to a substantially linear portion of the image plane. Other embodiments are also provided.
摘要翻译：提供了包括具有多个一维（1D）衍射器阵列的空间光调制器及其操作方法的系统。在一个实施例中，该系统包括空间光调制器（SLM）组件，其包括多个一维（1D）衍射器阵列以调制来自光源的光，所述多个1D衍射阵列一体地形成在管芯上; 设置在所述多个1D衍射器阵列和所述光源之间的光路中的照明光学器件，以照亮所述多个1D衍射器阵列中的至少一个的基本上线性的部分; 以及设置在SLM组件和目标衬底上的图像平面之间的光路中的成像光学器件，所述成像光学器件适于将来自SLM组件的调制光传输到图像平面的基本线性部分。还提供了其他实施例。

4. 发明授权

US07046420B1 MEM micro-structures and methods of making the same 有权
标题翻译： MEM微结构及制作方法
公开(公告)号：US07046420B1
公开(公告)日：2006-05-16
申请号：US10377680
申请日：2003-02-28
申请人： James Hunter , Christopher Gudeman , Alexander Payne
发明人： James Hunter , Christopher Gudeman , Alexander Payne
IPC分类号： G02B26/00
CPC分类号： G02B26/001 , G02B26/0833
摘要： A device comprising an array of free metal ribbons that are coupled to a substrate through ceramic support structures is disclosed. The device is preferably an optical MEM device, wherein a first set of free metal ribbons are configured to move relative to a second set of alternating free metal ribbons for modulating an incident light source. An optical MEM system in accordance with the invention includes a light source and suitable optics for transmitting light to and from the array of free metal ribbons. The optical MEM device exhibits reduced surface charging and has applications in optical communications.
摘要翻译：公开了一种包括通过陶瓷支撑结构耦合到基板的自由金属带阵列的装置。该装置优选是光学MEM装置，其中第一组自由金属带被配置为相对于第二组交替的自由金属带移动以调制入射光源。根据本发明的光学MEM系统包括光源和用于将光传送到自由金属带阵列的光学元件。光学MEM器件表现出减少的表面充电并且在光通信中具有应用。

5. 发明授权

US06660552B2 Reduced surface charging in silicon-based devices 有权
公开(公告)号：US06660552B2
公开(公告)日：2003-12-09
申请号：US10100627
申请日：2002-03-14
申请人： Alexander Payne , Christopher Gudeman , James Hunter , Michael Bruner , Clinton Carroll
发明人： Alexander Payne , Christopher Gudeman , James Hunter , Michael Bruner , Clinton Carroll
IPC分类号： H01L2100
CPC分类号： G02B26/0808 , B81B7/0012
摘要： A grating light valve with reduced surface charging is disclosed. Surface charging is measured by the propensity an insulating surface to accept and transport a charge. The grating light valve of the instant invention has a plurality of spaced and movable ribbons formed from Si3N4 coupled to a substrate structure formed of SiO2. A portion of the ribbons are moved to alternate between conditions for constructive and destructive interference with an incident light source having a wavelength &lgr; by applying the appropriate switching voltages across the portion of ribbons and the substrate structure. When charging occurs on surfaces of the grating light valve, the switching voltages required to operate the grating light valve are shifted and diminishing the performance of the grating light valve. By drying silicon-based surfaces of the grating light valve and exposing the silicon-based surfaces of the grating light valve to a Nitrogen-rich pacify gas environment, the surfaces of the grating light valve exhibit reduced charging and consistent response to applied bias voltages. In the drying step, residual water or moisture is removed from the surfaces by elevating the temperature of the grating light valve structure in a vacuum environment. Preferably, the drying is carried at temperatures of 250 degrees Celsius or greater and at vacuum pressures of 10−6 Torr or less. After the surface of the grating light valve are dried, the surfaces are exposed to the Nitrogen-rich pacifying gas environment at ambient temperature. Presumably, the Nitrogen-rich pacify gas environment blankets the silicon-based surfaces of the grating light valve with adsorbed, physisorbed, or chemi-adsorbed Nitrogen and thus reduces the propensity of those surfaces to accept water or moisture, which is believed to facilitate the charging. After the surfaces of the grating light valve are treated according to the current invention, charging of the surface remains low and stable even for several days in open air conditions.

6. 发明授权

US08957564B1 Microelectromechanical system megasonic transducer 有权
标题翻译：微机电系统兆声传感器
公开(公告)号：US08957564B1
公开(公告)日：2015-02-17
申请号：US13172514
申请日：2011-06-29
申请人： Toshio Hiroe , Zarem Harold , Alexander Payne , James Hunter
发明人： Toshio Hiroe , Zarem Harold , Alexander Payne , James Hunter
IPC分类号： H02N2/00 , B08B3/12
CPC分类号： B08B3/12 , B06B1/0292
摘要： Megasonic cleaning systems and methods of fabricating and using the same are provided. In one embodiment, the system comprises a plurality of Micro-Electromechanical System (MEMS) transducers, each transducer including a movable membrane with a membrane electrode coupled to a first potential disposed above and spaced apart from an upper surface of a die including a cavity electrode coupled to a second potential, the membrane including multiple layers including a polysilicon layer between a top silicon nitride layer and a bottom silicon nitride layer, and the membrane electrode includes the polysilicon layer; a chuck on which a target workpiece is positioned; and a fluid to couple sonic energy from the plurality of MEMS transducers to the target workpiece. Other embodiments are also provided.
摘要翻译：提供了超声波清洗系统及其制造和使用方法。在一个实施例中，系统包括多个微机电系统（MEMS）换能器，每个换能器包括具有耦合到第一电位的膜电极的可移动膜，所述膜电极设置在模具的上表面上方并与模具的上表面间隔开，所述模具的上表面包括腔电极耦合到第二电位，所述膜包括多层，包括顶部氮化硅层和底部氮化硅层之间的多晶硅层，并且所述膜电极包括所述多晶硅层; 目标工件所在的卡盘; 以及将来自多个MEMS换能器的声能耦合到目标工件的流体。还提供了其他实施例。

7. 发明申请

US20120307215A1 Flow Through MEMS Package 有权
标题翻译：流过MEMS封装
公开(公告)号：US20120307215A1
公开(公告)日：2012-12-06
申请号：US13153127
申请日：2011-06-03
申请人： Kenichi Sano , Lars Eng , Alexander Payne , James Hunter
发明人： Kenichi Sano , Lars Eng , Alexander Payne , James Hunter
IPC分类号： G03B27/72 , G02B26/00
CPC分类号： G03F7/2051 , B81B7/0041 , B81B7/0061 , G02B26/0808 , G02B26/0841 , G03F7/70291 , G03F7/70866 , G03F7/70916 , G03F7/70933
摘要： A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS. In certain embodiments, the fluid includes an gas, such as nitrogen, and the inlet and outlet are adapted to provide a flow of gas of from 0.01 Standard Cubic Centimeters per Minute (sccm) to 10000 sccm during operation of the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.
摘要翻译：提供了通过微机电系统（MEMS）封装的流程以及操作使用其的MEMS封装的方法。通常，封装包括MEMS封装的空腔，在MEMS运行期间将流体引入空腔的入口以及在MEMS运行期间流体被除去的出口。在某些实施例中，流体包括气体，例如氮气，并且入口和出口适于在MEMS运行期间提供从0.01标准立方厘米每分钟（sccm）至10000sccm的气体流。包装和方法在包装空间光调制器包括反射表面并适于反射和调制入射在其上的光束时特别有用。还提供了其他实施例。

8. 发明授权

US08320038B2 Method of fabricating an integrated device 有权
标题翻译：制造集成装置的方法
公开(公告)号：US08320038B2
公开(公告)日：2012-11-27
申请号：US12639899
申请日：2009-12-16
申请人： Joshua Lu , Gregory Beach , Alexander Payne , James Hunter
发明人： Joshua Lu , Gregory Beach , Alexander Payne , James Hunter
IPC分类号： G02B26/00
CPC分类号： G02B26/0808 , B81B2201/047 , B81C1/00238 , B81C1/00246 , G02B26/0833
摘要： A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.
摘要翻译：提供了一种制造包括微电子机械系统（MEMS）和相关微电路的集成装置的方法。在一个实施例中，该方法包括：通过介电层形成高温能力接触到邻近微电子机械系统（MEMS）结构的衬底上形成的微电路的下层元件; 以及在所述电介质层上沉积导电材料层，以及图案化所述导电材料层以形成用于所述微电路的局部互连（L1），所述微电路覆盖并电耦合到所述触点和所述相邻MEMS结构的底部电极。还提供了其他实施例。

9. 发明申请

US20100149625A1 Method of Fabricating an Integrated Device 有权
标题翻译：制造集成装置的方法
公开(公告)号：US20100149625A1
公开(公告)日：2010-06-17
申请号：US12639899
申请日：2009-12-16
申请人： Joshua Lu , Gregory Beach , Alexander Payne , James Hunter
发明人： Joshua Lu , Gregory Beach , Alexander Payne , James Hunter
IPC分类号： G02B26/08 , H01L21/768
CPC分类号： G02B26/0808 , B81B2201/047 , B81C1/00238 , B81C1/00246 , G02B26/0833
摘要： A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.
摘要翻译：提供了一种制造包括微电子机械系统（MEMS）和相关微电路的集成装置的方法。在一个实施例中，该方法包括：通过介电层形成高温能力接触到邻近微电子机械系统（MEMS）结构的衬底上形成的微电路的下层元件; 以及在所述电介质层上沉积导电材料层，以及图案化所述导电材料层以形成用于所述微电路的局部互连（L1），所述微电路覆盖并电耦合到所述触点和所述相邻MEMS结构的底部电极。还提供了其他实施例。

10. 发明申请

US20050212004A1 Spatial light modulator with robust mirror substrate condition 有权
标题翻译：空间光调制器，具有鲁棒的镜面基板条件
公开(公告)号：US20050212004A1
公开(公告)日：2005-09-29
申请号：US11087230
申请日：2005-03-23
申请人： Alexander Payne , James Hunter , David Amm
发明人： Alexander Payne , James Hunter , David Amm
IPC分类号： G02B26/08 , H01L29/24
CPC分类号： G02B26/0808
摘要： A light modulator and a method of manufacturing the same are provided having a substrate with reflectivity enhancing layers formed thereon. The layers include at least a top surface for receiving incident light, a first layer overlying the substrate, and a second layer between the top surface and the first layer, the second layer overlying and abutting the first layer. The second layer has a predetermined thickness selected in relation to an index of refraction of the second layer and to a wavelength of the incident light such that the light reflecting off an interface between the first and second layers constructively interferes with light reflected from the top surface. Preferably, the first layer also has a predetermined thickness selected such that the light reflecting off an interface between the first layer and the substrate constructively interferes with light reflected from the top surface.
摘要翻译：提供一种光调制器及其制造方法，具有在其上形成有反射增强层的基板。这些层至少包括用于接收入射光的顶表面，覆盖衬底的第一层，以及顶表面和第一层之间的第二层，第二层覆盖并邻接第一层。第二层具有相对于第二层的折射率和入射光的波长选择的预定厚度，使得从第一和第二层之间的界面反射的光建构性地干扰从顶表面反射的光。优选地，第一层还具有选择的预定厚度，使得从第一层和衬底之间的界面反射的光构造地干扰从顶表面反射的光。

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