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1. 发明授权

US10204577B2 Driving method, driving circuit and display apparatus 有权
公开(公告)号：US10204577B2
公开(公告)日：2019-02-12
申请号：US15125909
申请日：2015-08-14
申请人： BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Liguang Deng , Zhen Chen , Hyungkyu Kim , Moyu Zhu , Yingming Liu , Jun Cheng , Ming Zhai
IPC分类号： G09G3/36
摘要： A driving method is provided to drive an LCD panel having rows of pixels includes obtaining source data signals of a plurality of frames for the LCD panel; inputting a source data signal of one frame of the plurality of frames; and inverting polarity of the source data signal of the one frame before scanning sequentially the rows of pixels. The driving method also includes configuring at least one of timing of the source data signal and timing of scanning a first row of the rows of pixels to cause a time overlap between an actual scanning time of the first row and a time period when the source data signal is at a threshold value to be no less than an original scanning time of the first row; scanning the first row of the rows of pixels; and scanning rest of the rows of pixels to complete displaying the one frame.

2. 发明申请

US20180269352A1 Manufacturing Method of Light Emitting Diode Device and Light Emitting Diode Device 审中-公开
公开(公告)号：US20180269352A1
公开(公告)日：2018-09-20
申请号：US15813803
申请日：2017-11-15
申请人： BOE Technology Group Co., Ltd. , Beijing BOE Optoelectronics Technology Co., Ltd.
发明人： Ting Tian , Ming Zhai , Shuqian Dou , Dayong Zhou , Jun Cheng , Xiaoliang Fu , Zhiqiang Fan , Taesung Kang
IPC分类号： H01L33/00 , H01L33/06 , H01L33/12 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/62 , H01L25/075
CPC分类号： H01L33/0095 , H01L25/0753 , H01L27/153 , H01L27/156 , H01L33/06 , H01L33/12 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/62 , H01L2933/0066
摘要： A manufacturing method of a light emitting diode device and a light emitting diode device are provided. The manufacturing method of the light emitting diode device includes: forming a light emitting lamination layer on a base substrate, the light emitting lamination layer including a first semiconductor layer, a first light emitting layer, a second semiconductor layer, a second light emitting layer and a third semiconductor layer sequentially formed on the base substrate; dividing the light emitting lamination layer to form a plurality of light emitting units spaced from each other, each light emitting unit including a first area and a second area spaced from each other; and removing the third semiconductor layer and the second light emitting layer in the first area to form a first sub light emitting unit, and the second area being used for forming a second sub light emitting unit.

3. 发明申请

US20190221588A1 ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20190221588A1
公开(公告)日：2019-07-18
申请号：US15580240
申请日：2017-06-23
申请人： BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Tongshang Su , Jun Cheng , Ce Zhao , Bin Zhou , Dongfang Wang , Guangcai Yuan
IPC分类号： H01L27/12 , G09G3/3283 , G09G3/3291 , G02F1/133
摘要： The present disclosure relates to an array substrate and a method for manufacturing the same. The array substrate includes a thin film transistor and comprises at least a first region and a second region. A thickness of an active layer of the thin film transistor in the first region is different from that of an active layer of the thin film transistor in the second region. A ratio of the overlapped area between the source electrode or the drain electrode and the active layer of the thin film transistor to the thickness of the active layer is kept uniform over the first region and the second region.

4. 发明申请

US20190157308A1 ARRAY SUBSTRATE ASSEMBLY, METHOD OF MANUFACTURING ARRAY SUBSTRATE ASSEMBLY, DISPLAY PANEL AND DISPLAY APPARATUS 审中-公开
公开(公告)号：US20190157308A1
公开(公告)日：2019-05-23
申请号：US16030825
申请日：2018-07-09
申请人： BOE TECHNOLOGY GROUP CO., LTD. , Hefei Xinsheng Optoelectronics Technology Co., Ltd.
发明人： Yuankui Ding , Guangcai Yuan , Ce Zhao , Bin Zhou , Jun Cheng , Zhaofan Liu , Yingbin Hu , Yongchao Huang
IPC分类号： H01L27/12 , H01L29/786 , H01L21/027 , G03F7/16 , G03F7/20 , G03F7/26 , G03F7/42 , G03F7/038
摘要： A method of manufacturing an array substrate assembly, an array substrate assembly manufactured by the method, and a display panel including the array substrate assembly are disclosed. The method includes: providing a substrate, the substrate having a first region as a preset semiconductor-removed region, and a second region as a remaining region; forming, in the first region of the substrate, a semiconductor removing layer corrodible by a corrosive solution; and forming a semiconductor layer on the substrate formed with the semiconductor removing layer, so that the semiconductor layer covers the semiconductor removing layer.

5. 发明授权

US10230073B2 Organic light-emitting display panel and display device 有权
公开(公告)号：US10230073B2
公开(公告)日：2019-03-12
申请号：US15321154
申请日：2016-02-26
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Wulin Shen , Jun Cheng
IPC分类号： H01L51/52
摘要： The present invention provides an organic light-emitting display panel, comprising: a substrate; a light-emitting unit provided on the substrate; and a package structure covering the light-emitting unit. The organic light-emitting display panel further comprises a thermally conductive structure, and the thermally conductive structure is at a side of the light-emitting unit far away from the substrate. Correspondingly, the present invention further provides a display device. The thermally conductive structure provided by the present invention can rapidly dissipate the heat generated by the light-emitting unit, so that the organic light-emitting display panel has an improved performance and the display device has an extended service life.

6. 发明授权

US09793327B2 Array substrate, display device having the same, and method thereof 有权
公开(公告)号：US09793327B2
公开(公告)日：2017-10-17
申请号：US15037883
申请日：2015-12-10
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Jun Cheng
IPC分类号： H01L27/32 , H01L27/12
CPC分类号： H01L27/3248 , H01L27/124 , H01L27/3262 , H01L27/3267 , H01L27/3276 , H01L2227/323 , H01L2251/5323
摘要： The present application discloses an array substrate comprising a pixel unit comprising a bottom emitting organic light emitting diode, a top emitting organic light emitting diode, a first drive thin film transistor, and a second drive thin film transistor. The first drive thin film transistor is connected to the bottom emitting organic light emitting diode for driving the bottom emitting organic light emitting diode to emit light. The second drive thin film transistor is connected to the top emitting organic light emitting diode for driving the top emitting organic light emitting diode to emit light.

7. 发明申请

US20170077201A1 ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：阵列基板及其制造方法
公开(公告)号：US20170077201A1
公开(公告)日：2017-03-16
申请号：US15122172
申请日：2015-09-25
申请人： BOE Technology Group Co., Ltd.
发明人： Jiangbo Chen , Jun Cheng , Chunsheng Jiang , Xiaodi Liu , Xiangyong Kong
IPC分类号： H01L27/32 , H01L51/56
CPC分类号： H01L27/3262 , H01L21/77 , H01L27/1288 , H01L51/56 , H01L2227/323
摘要： Embodiments of the invention provide an array substrate and a method of manufacturing the same. The method comprises: forming a gate electrode pattern, a gate insulation layer, an active layer pattern and an etching stopping layer on a substrate; forming a photoresist layer on the etching stopping layer; performing a single patterning process on the photoresist layer, such that photoresist in the first region is partially etched off, photoresist in the second region is completely etched off, and photoresist in the third region is completely remained; and performing a single etching process, such that residual photoresist in the first region and a portion of the etching stopping layer in the first region are etched off, and at the same time, a portion of the etching stopping layer and a portion of the gate insulation layer in the second region are etched off.
摘要翻译：本发明的实施例提供阵列基板及其制造方法。该方法包括：在衬底上形成栅极电极图案，栅极绝缘层，有源层图案和蚀刻停止层; 在所述蚀刻停止层上形成光致抗蚀剂层; 在光致抗蚀剂层上执行单一的图案化工艺，使得第一区域中的光致抗蚀剂被部分蚀刻掉，第二区域中的光致抗蚀剂被完全蚀刻掉，并且第三区域中的光致抗蚀剂被完全残留; 并进行单蚀刻处理，使得第一区域中的残留光致抗蚀剂和第一区域中的蚀刻停止层的一部分被蚀刻掉，同时蚀刻停止层的一部分和栅极的一部分第二区域中的绝缘层被蚀刻掉。

8. 发明申请

US20150129881A1 PIXEL UNIT AND METHOD OF FABRICATING THE SAME, ARRAY SUBSTRATE AND DISPLAY DEVICE 有权
标题翻译：像素单元及其制造方法，阵列基板和显示设备
公开(公告)号：US20150129881A1
公开(公告)日：2015-05-14
申请号：US14361700
申请日：2013-11-28
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Xiangyong Kong , Dongfang Wang , Jun Cheng , Hongda Sun
IPC分类号： H01L27/12
CPC分类号： H01L27/1248 , G02F1/136227 , H01L27/1244 , H01L27/1288
摘要： The present invention provides a pixel unit including a thin film transistor and a pixel electrode, the thin film transistor includes a gate, a source and a drain, and the pixel electrode is electrically connected to the drain through a via hole. An upper end surface of the via hole is connected to the pixel electrode, and a lower end surface of the via hole is connected to the drain. The via hole is a step-shaped hole, and an area of the upper end surface of the via hole is larger than that of the lower end surface of the via hole. The present invention also provides a method of fabricating the pixel unit, an array substrate including the pixel unit, and a display device including the array substrate.
摘要翻译：本发明提供一种包括薄膜晶体管和像素电极的像素单元，薄膜晶体管包括栅极，源极和漏极，并且像素电极通过通孔电连接到漏极。通孔的上端面与像素电极连接，通孔的下端面与漏极连接。通孔是台阶状的孔，通孔的上端面的面积大于通孔的下端面的面积。本发明还提供一种制造像素单元的方法，包括该像素单元的阵列基板以及包括该阵列基板的显示装置。

9. 发明授权

US11592742B2 Photoresist composition, its manufacturing method, and manufacturing methods of metal pattern and array substrate 有权
公开(公告)号：US11592742B2
公开(公告)日：2023-02-28
申请号：US16320041
申请日：2018-05-22
申请人： Hefei Xinsheng Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
发明人： Wei Li , Guangcai Yuan , Bin Zhou , Dongfang Wang , Jun Cheng , Yingbin Hu , Jingjing Xia , Tongshang Su
IPC分类号： G03F7/021 , G03F7/038 , G03F7/039 , G03F7/027 , H01L21/027 , H01L21/283 , H01L21/3213 , H01L21/77
摘要： A photoresist composition and manufacturing method thereof, a manufacturing method of a metal pattern, and a manufacturing method of an array substrate are provided. The photoresist composition includes a base material and an ion adsorbent, and the ion adsorbent is chelating resin.

10. 发明申请

US20210327987A1 DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE 有权
公开(公告)号：US20210327987A1
公开(公告)日：2021-10-21
申请号：US16605782
申请日：2019-05-06
申请人： BOE TECHNOLOGY GROUP CO., LTD.
发明人： Jingang Fang , Jun Cheng , Ce Zhao , Luke Ding , Ning Liu
IPC分类号： H01L27/32 , H01L51/52 , H01L51/56
摘要： A display substrate, a method for manufacturing the same, and a display device are provided. The display substrate includes: a base substrate, and a conductive layer and a passivation layer which are stacked on the base substrate. The display substrate has a peripheral region and a capacitor region, the conductive layer is located in the peripheral region, the conductive layer is used for electrically connecting with an external driving circuit in the display device, a thickness of a part of the passivation layer in the capacitor region is less than a thickness of a part of the passivation layer in the peripheral region, and the capacitor region is provided with a capacitor that charges a pixel unit in the display substrate.

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