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    • 10. 发明授权
    • Method for sensor fabrication and related sensor and system
    • 传感器制造方法及相关传感器及系统
    • US07891252B2
    • 2011-02-22
    • US12362741
    • 2009-01-30
    • Cornel CobianuViorel AvramescuIon GeorgescuStefan-Dan Costea
    • Cornel CobianuViorel AvramescuIon GeorgescuStefan-Dan Costea
    • G01L7/00
    • G01L9/0025B60C23/0408C03C27/00H01L41/1132H01L41/331Y10T29/42
    • A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.
    • 一种方法包括在第一晶片中形成多个沟槽,在第二晶片的第一表面上形成传感器结构,以及结合第一晶片和第二晶片。 该方法还包括蚀刻第二晶片的第二表面以在第二晶片中形成传感器膜片。 该方法还包括通过在与沟槽相关联的第一晶片的多个区域中切割第一晶片来去除第一晶片的一部分。 传感器包括在基板的第一表面上的基板和表面声波(SAW)谐振器。 传感器还包括电耦合到SAW谐振器的接合焊盘和形成在衬底的第二表面中的凹口。 传感器还包括通过间隔件与衬底的第一表面分离的盖。 SAW谐振器位于盖和基板之间。