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1. 发明授权

US10901391B1 Multi-scanning electron microscopy for wafer alignment 有权
公开(公告)号：US10901391B1
公开(公告)日：2021-01-26
申请号：US16564453
申请日：2019-09-09
申请人： Carl Zeiss SMT GmbH
发明人： Jagdish Chandra Saraswatula , Jens Timo Neumann , Philipp Huethwohl , Thomas Korb , Raghavendra Hanumantha Nayak
IPC分类号： G05B19/402 , H01L23/544 , G06T7/00
摘要： A method includes controlling a multi-scanning electron microscope, mSEM, to capture a first image of a wafer attached to a motorized handling stage while the motorized handling stage is in a first position. The first image includes at least a part of a notch of the wafer. The method also includes determining a radial axis of the wafer based on the first image, and controlling the motorized handling stage to shift the wafer along the radial axis by half a diameter of the wafer so that the motorized handling stage is in a second position. The method further includes controlling the mSEM to capture a second image of the wafer while the motorized handling stage is in the second position. The second image includes wafer structures. In addition, the method includes determining a reference position of the wafer based on a structure recognition of the wafer structures of the second image, and registering a wafer coordinate system of the wafer to a stage coordinate system of the motorized handling stage based on the reference position and the radial axis.

2. 发明申请

US20210296089A1 METHOD OF RECORDING AN IMAGE USING A PARTICLE MICROSCOPE 有权
公开(公告)号：US20210296089A1
公开(公告)日：2021-09-23
申请号：US17220519
申请日：2021-04-01
申请人： Carl Zeiss SMT GmbH
发明人： Dirk Zeidler , Thomas Korb , Philipp Huethwohl , Jens Timo Neumann , Christof Riedesel , Christian Wojek , Joaquin Correa , Wolfgang Hoegele
IPC分类号： H01J37/28
摘要： A method, including: recording plural images of an object by scanning plural particle beams across the object and detecting signals generated by the particle beams, wherein the plural particle beams are generated by a multi-beam particle microscope; determining plural regions of interest; determining plural image regions in each of the recorded images; determining plural displacement vectors; and determining image distortions based on image data of the recorded images and the determined displacement vectors.

3. 发明申请

US20200258212A1 ERROR REDUCTION IN IMAGES WHICH WERE GENERATED WITH CHARGED PARTICLES AND WITH THE AID OF MACHINE-LEARNING-BASED METHODS 审中-公开
公开(公告)号：US20200258212A1
公开(公告)日：2020-08-13
申请号：US16786307
申请日：2020-02-10
申请人： Carl Zeiss SMT GmbH
发明人： Jens Timo Neumann , Thomas Korb , Abhilash Srikantha , Christian Wojek
IPC分类号： G06T7/00 , G06T5/00 , G06T7/62 , G01B15/04 , G06N20/00 , G06N7/00
摘要： Methods for determining one or more quality or size parameters of a structure in a semiconductor product, on the basis of an image of the semiconductor product which was generated with the aid of charged particles which have been radiated onto the semiconductor product, include: providing the image of the semiconductor product; applying the provided image to a machine-learning-based method such as, e.g., an artificial neural network which has been trained with training images of semiconductor products and which is configured to generate an output parameter from the provided image; and determining the size parameter of the structure on the basis of the output parameter.

4. 发明申请

US20230127194A1 METHOD TO ACQUIRE A 3D IMAGE OF A SAMPLE STRUCTURE 有权
公开(公告)号：US20230127194A1
公开(公告)日：2023-04-27
申请号：US17510538
申请日：2021-10-26
申请人： Carl Zeiss SMT GmbH , Carl Zeiss X-ray Microscopy Inc.
发明人： Ramani Pichumani , Christoph Hilmar Graf vom Hagen , Jens Timo Neumann , Johannes Ruoff , Thomas Matthew Gregorich
IPC分类号： G06T7/00 , G06T7/521 , G06T11/00 , G06T7/62
摘要： In a method to acquire a 3D image of a sample structure initially a first raw 2D set of 2D images of a sample structure is acquired at a limited number of raw sample planes. From this first raw 2D set a 3D image of the sample structure being represented by a 3D volumetric image data set is calculated and a measurement parameter is extracted from the 3D volumetric image data set. Such measurement parameter is assigned to the number of 2D image acquisitions recorded during the acquisition step. Then, a further interleaving 2D set of 2D images of the sample structure is required by recording a further number of interleaving 2D image acquisitions at a further number of interleaved sample planes which do not coincide with the previous acquisition sample planes. The steps “calculating,” “extracting” and “assigning” are repeated for the further interleaving 2D set. The actual and the last extracted measurement parameters are compared to check whether a convergence criterion is met. If not, the steps “acquiring,” “calculating,” “extracting,” “assigning” and “comparing” are repeated for a further interleaving 2D set including a further number of interleaving 2D image acquisitions at a further number of interleaved sample planes which do not coincide with the previous acquisition sample planes. This is done until the convergence criterion is met or until a given maximum number of 2D image acquisitions is recorded. The measurement parameter and a total number of recorded 2D image acquisitions are output. A projection system used for such method comprises a projection light source, a rotatable sample structure holder and a spatially resolving detector. Alternatively or in addition, such method can be used by a data processing system to acquire virtual tomographic images of a sample. With such method, a sample throughput is improved.

5. 发明申请

US20220138973A1 CROSS SECTION IMAGING WITH IMPROVED 3D VOLUME IMAGE RECONSTRUCTION ACCURACY 有权
公开(公告)号：US20220138973A1
公开(公告)日：2022-05-05
申请号：US17540976
申请日：2021-12-02
申请人： Carl Zeiss SMT GmbH
发明人： Thomas Korb , Jens Timo Neumann , Eugen Foca , Alex Buxbaum , Amir Avishai , Keumsil Lee , Ingo Schulmeyer , Dmitry Klochkov
IPC分类号： G06T7/33 , G06T7/35 , G06T5/00 , G06T7/55 , G06T7/73
摘要： A three-dimensional circuit pattern inspection technique includes cross sectioning integrated circuits for obtaining a 3D volume image of an integrated semiconductor sample. The method employs a feature based alignment of cross section images based on features of an integrated semiconductor sample. A computer program product and apparatus are provided.

6. 发明申请

US20130188160A1 Optical System of a Microlithographic Projection Exposure Apparatus and Method of Reducing Image Placement Errors 有权
标题翻译：微光刻投影曝光装置的光学系统和减少图像放置误差的方法
公开(公告)号：US20130188160A1
公开(公告)日：2013-07-25
申请号：US13792599
申请日：2013-03-11
申请人： CARL ZEISS SMT GMBH
发明人： Johannes Ruoff , Jens Timo Neumann , Joerg Zimmermann , Dirk Hellweg , Dirk Juergens
IPC分类号： G03F7/20
CPC分类号： G03F7/70141 , G03F7/70116 , G03F7/70466 , G03F7/70566 , G03F7/70633
摘要： A method of reducing image placement errors in a microlithographic projection exposure apparatus includes providing a mask, a light sensitive layer and a microlithographic projection exposure apparatus which images features of the mask onto the light sensitive surface using projection light. Subsequently, image placement errors associated with an image of the features formed on the light sensitive surface are determined either by simulation or metrologically. Then an input state of polarization of the projection light is changed to an elliptical output state of polarization which is selected such that the image placement errors are reduced.
摘要翻译：一种降低微光刻投影曝光装置中的图像放置误差的方法包括提供一种掩模，光敏层和将该掩模的特征使用投影光将该特征成像到光敏表面上的微光刻投影曝光装置。随后，通过模拟或计量确定与形成在光敏表面上的特征的图像相关联的图像放置误差。然后，投影光的输入偏振状态变为偏振的椭圆输出状态，其被选择为使得图像放置误差减小。

7. 发明申请

US20230120847A1 METHOD FOR MEASURING A SAMPLE AND MICROSCOPE IMPLEMENTING THE METHOD 有权
公开(公告)号：US20230120847A1
公开(公告)日：2023-04-20
申请号：US17501238
申请日：2021-10-14
申请人： Carl Zeiss SMT GmbH
发明人： Eugen Foca , Amir Avishai , Dmitry Klochkov , Thomas Korb , Jens Timo Neumann , Keumsil Lee
IPC分类号： H01J37/24 , H01J37/28
摘要： The present invention relates to a method for measuring a sample with a microscope, the method comprising the steps of: measuring a tilt of the sample, correcting an orientation of the sample based on the tilt, and scanning the sample.

8. 发明申请

US20220392793A1 METHODS OF CROSS-SECTION IMAGING OF AN INSPECTION VOLUME IN A WAFER 有权
公开(公告)号：US20220392793A1
公开(公告)日：2022-12-08
申请号：US17820117
申请日：2022-08-16
申请人： Carl Zeiss SMT GmbH
发明人： Alex Buxbaum , Eugen Foca , Chuong Huynh , Dmitry Klochkov , Thomas Korb , Jens Timo Neumann , Baohua Niu
IPC分类号： H01L21/67 , H01J37/28 , H01J37/305 , H01J37/22 , G06T7/00 , G06T7/50 , G06T7/30
摘要： The present disclosure relates to dual beam device and three-dimensional circuit pattern inspection techniques by cross sectioning of inspection volumes with large depth extension exceeding 1 μm below the surface of a semiconductor wafer, as well as methods, computer program products and apparatuses for generating 3D volume image data of a deep inspection volume inside a wafer without removal of a sample from the wafer. The disclosure further relates to 3D volume image generation and cross section image alignment methods utilizing a dual beam device for three-dimensional circuit pattern inspection.

9. 发明申请

US20210358101A1 PROCESSING IMAGE DATA SETS 有权
公开(公告)号：US20210358101A1
公开(公告)日：2021-11-18
申请号：US17388589
申请日：2021-07-29
申请人： Carl Zeiss SMT GmbH
发明人： Jens Timo Neumann , Abhilash Srikantha , Christian Wojek , Thomas Korb
IPC分类号： G06T7/00 , G06F16/55 , G06N20/00 , G06T7/33 , G06K9/68 , G06K9/62
摘要： A method includes obtaining an image data set that depicts semiconductor components, and applying a hierarchical bricking to the image data set. In this case, the bricking includes a plurality of bricks on a plurality of hierarchical levels. The bricks on different hierarchical levels have different image element sizes of corresponding image elements.

10. 发明申请

US20200285976A1 METHOD AND DEVICES FOR DETERMINING METROLOGY SITES 审中-公开
公开(公告)号：US20200285976A1
公开(公告)日：2020-09-10
申请号：US16807581
申请日：2020-03-03
申请人： Carl Zeiss SMT GmbH , Carl Zeiss SMT Inc.
发明人： Abhilash Srikantha , Christian Wojek , Keumsil Lee , Thomas Korb , Jens Timo Neumann , Eugen Foca
IPC分类号： G06N5/04 , G06N20/00 , G06K9/00
摘要： Methods for determining metrology sites for products includes detecting corresponding objects in measurement data of one or more product samples, and aligning the detected objects are aligned. The methods also include analyzing the aligned objects, and determining metrology sites based on the analysis. Devices use such methods to determine metrology sites for products.

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