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    • 2. 发明申请
    • OPERATING METHOD OF A NON-VOLATILE MEMORY
    • 非易失性存储器的操作方法
    • US20070263448A1
    • 2007-11-15
    • US11778657
    • 2007-07-17
    • Wei-Zhe WongChing-Sung YangChih-Chen Cho
    • Wei-Zhe WongChing-Sung YangChih-Chen Cho
    • G11C11/34G11C16/04
    • G11C16/0416H01L27/115H01L27/11521H01L29/40114H01L29/42328H01L29/66825H01L29/7887
    • A non-volatile memory is provided. A substrate has at least two isolation structures therein to define an active area. A well is located in the substrate. A shallow doped region is located in the well. At least two stacked gate structures are located on the substrate. Pocket doped regions are located in the substrate at the peripheries of the stacked gate structures; each of the pocket doped regions extends under the stacked gate structure. Drain regions are located in the pocket doped regions at the peripheries of the stacked gate structures. An auxiliary gate layer is located on the substrate between the stacked gate structures. A gate dielectric layer is located between the auxiliary gate layer and the substrate and between the auxiliary gate layer and the stacked gate structure. Plugs are located on the substrate and extended to connect with the pocket doped region and the drain regions therein.
    • 提供非易失性存储器。 衬底在其中具有至少两个隔离结构以限定有效区域。 一个井位于基板中。 浅掺杂区域位于井中。 至少两个堆叠的栅极结构位于衬底上。 袋状掺杂区域位于堆叠栅极结构的周边的衬底中; 每个口袋掺杂区域在堆叠的栅极结构之下延伸。 漏极区位于堆叠栅极结构的周边的口袋掺杂区域中。 辅助栅极层位于堆叠栅极结构之间的衬底上。 栅极电介质层位于辅助栅极层和衬底之间,并且位于辅助栅极层和堆叠栅极结构之间。 插头位于衬底上并延伸以与其中的口袋掺杂区域和漏极区域连接。
    • 3. 发明申请
    • NON-VOLATILE MEMORY CELL, FABRICATION METHOD AND OPERATING METHOD THEREOF
    • 非挥发性记忆体,制造方法及其操作方法
    • US20060039200A1
    • 2006-02-23
    • US10907031
    • 2005-03-17
    • Ching-Sung YangWei-Zhe WongChih-Chen Cho
    • Ching-Sung YangWei-Zhe WongChih-Chen Cho
    • G11C7/10
    • G11C16/0483G11C16/0466H01L27/115H01L27/11519H01L27/11568
    • A non-volatile memory including a plurality of memory units is provided. Each of the memory units includes a first memory cell and a second memory cell. The first memory cell is disposed over the substrate. The second memory cell is disposed next to the sidewall of the first memory cell and over the substrate. The first memory cell includes a first gate disposed over the substrate, a first composite dielectric layer disposed between the first gate and the substrate. The second memory cell includes a second gate disposed over the substrate and a second composite dielectric layer disposed between the second gate and the substrate and between the second gate and the first memory cell. Each of the first and second composite dielectric layers includes a bottom dielectric layer, a charge-trapping layer and a top dielectric layer.
    • 提供包括多个存储单元的非易失性存储器。 每个存储单元包括第一存储单元和第二存储单元。 第一存储单元设置在衬底上。 第二存储单元设置在第一存储单元的侧壁旁边且在衬底上。 第一存储单元包括设置在衬底上的第一栅极,设置在第一栅极和衬底之间的第一复合介电层。 第二存储单元包括设置在衬底上的第二栅极和设置在第二栅极和衬底之间以及第二栅极和第一存储单元之间的第二复合电介质层。 第一和第二复合电介质层中的每一个包括底部电介质层,电荷俘获层和顶部电介质层。
    • 9. 发明授权
    • Non-volatile memory and fabricating method and operating method thereof
    • 非易失性存储器及其制造方法及其操作方法
    • US07274062B2
    • 2007-09-25
    • US11162116
    • 2005-08-29
    • Wei-Zhe WongChing-Sung YangChih-Chen Cho
    • Wei-Zhe WongChing-Sung YangChih-Chen Cho
    • H01L29/76
    • G11C16/0416H01L21/28273H01L27/115H01L27/11521H01L29/42328H01L29/66825H01L29/7887
    • A non-volatile memory is provided. A substrate has at least two isolation structures therein to define an active area. A well is located in the substrate. A shallow doped region is located in the well. At least two stacked gate structures are located on the substrate. Pocket doped regions are located in the substrate at the peripheries of the stacked gate structures; each of the pocket doped regions extends under the stacked gate structure. Drain regions are located in the pocket doped regions at the peripheries of the stacked gate structures. An auxiliary gate layer is located on the substrate between the stacked gate structures. A gate dielectric layer is located between the auxiliary gate layer and the substrate and between the auxiliary gate layer and the stacked gate structure. Plugs are located on the substrate and extended to connect with the pocket doped region and the drain regions therein.
    • 提供非易失性存储器。 衬底在其中具有至少两个隔离结构以限定有效区域。 一个井位于基板中。 浅掺杂区域位于井中。 至少两个堆叠的栅极结构位于衬底上。 袋状掺杂区域位于堆叠栅极结构的周边的衬底中; 每个口袋掺杂区域在堆叠的栅极结构之下延伸。 漏极区位于堆叠栅极结构的周边的口袋掺杂区域中。 辅助栅极层位于堆叠栅极结构之间的衬底上。 栅极电介质层位于辅助栅极层和衬底之间,并且位于辅助栅极层和堆叠栅极结构之间。 插头位于衬底上并延伸以与其中的口袋掺杂区域和漏极区域连接。