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    • 9. 发明授权
    • Semiconductor device including a plurality of wiring lines
    • 包括多条布线的半导体装置
    • US07649259B2
    • 2010-01-19
    • US11316887
    • 2005-12-27
    • Mizuki OnoYuichi Motoi
    • Mizuki OnoYuichi Motoi
    • H01L23/52
    • H01L27/101H01L27/105Y10S257/905Y10S257/908
    • A semiconductor device includes a first wiring line group made of a metal, wiring lines of the first wiring line group being arranged in parallel with each other, a second wiring line group which is made of a semiconductor and crosses the first wiring line group, wiring lines of the second wiring line group being arranged in parallel with each other and being movable in the vicinity of each intersection with the wiring lines of the first wiring line group, and a plurality of metal regions which are formed to be joined with the wiring lines constituting the second wiring line group, and have a work function different from that of the metal forming the first wiring line group.
    • 半导体器件包括由金属构成的第一布线线组,第一布线线组的布线彼此平行布置,第二布线线组由半导体制成并与第一布线组交叉,布线 第二布线线组的线相互平行配置,并且能够在与第一布线线组的布线相交的各交点附近移动,并且形成为与布线接合的多个金属区 构成第二配线组,并且具有与形成第一配线组的金属不同的功函数。